元組件 的英文怎麼說

中文拼音 [yuánzǔjiàn]
元組件 英文
ld - components
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 組件 : assembler
  1. The combined toy as right request 3 stated, whose character is : the electronic components electrically or electromagnetically connected with the iron stick or the magnet stick can be resistor, capacitor, inductor, battery, switch, diode, audion, ic ( integrated circuit ), motor, led ( light - emitting diode ), infrared ray receiver, sound circuit and instrument

    如權利要求3所述的組合玩具，其特徵是：和鐵棒或磁鐵棒電連接的電子元器件是可以是電阻、電容、電感、電池、開關、二極體、三極體、集成電路、馬達、發光二極體、紅外線接受器、發聲電路、儀表。
  2. One of us ( shapiro ) began this research with the realization that the basic operations of certain biomolecular machines within living cells ? recognition of molecular building blocks, cleavage and ligation of biopolymer molecules, and movement along a polymer ? could all be used, in principle, to construct a universal computer based on turing ' s conceptual machine

    這項研究的開端，是本文作者之一夏比洛意識到，細胞內某些生物分子組件的基本運作方式，像是辨認基本分子建構單元、切開和連接生物聚合分子，以及組件沿著聚合分子移動的方式，理論上都能以塗林的概念為基礎，建構普適的計算器器。
  3. Information systems - unformatted 80 - megabyte trident pack for use at 370 tpi and 6000 bpi - general, physical and magnetic requirements

    信息系統.使用370tpi和6000bpi的非格式化的80兆位元組三叉組件.物理和磁特性通用要求
  4. 256 by 4 implies that two devices are needed to complete the byte.

    2564意味著組成一個位元組需要兩個器件。
  5. If the grid is a calculation platform where individual calculations or calculable components are distributed to the clients, you can normally split the work up into a number of discrete work units

    如果網格是一個將個別的計算和可計算的組件分配給客戶機的計算平臺，那麼通常可以將工作劃分為幾個獨立的工作單元。
  6. Aimed at the trends of ftu in our country and overseas, the thesis first give the summary of characteristics towards current feed terminal unit used in electric automation, then detailed introduce the adoption of microchip msp430f149 for the cpu design

    論文結合國內外ftu的現狀和發展趨勢，對ftu的主要功能進行了分析研究，設計了以ti公司msp430f149單片機為ftu核心的控制器系統硬體電路，並對硬體電路的設計原理、電路組成及元器件選擇進行了詳細分析。
  7. We specialize in varicoloured light - emitting diode, full colour display screen with lattice pixel module, high fr -

    微波接收元組件的廠家，位於廣東省順德市高新科技工業區。
  8. In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied

    本文研究了金剛石材料在多晶元組件中熱特性改善和熱應力問題。
  9. Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material

    本文對金剛石材料在多晶元組件熱性能改善和熱應力研究，對金剛石在多晶元組件封裝熱設計應用具有一定的參考價值和提供一定的理論依據。
  10. The indexer cannot find or load a filter or word breaker component

    索引器找不到或無法加載篩選器或斷字元組件。
  11. Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip

    本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。
  12. With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on

    多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。
  13. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  14. In this paper outlining the characteristics of diamond substrate and problems to be faced with, and measures to be taken, introducing knowledge of multi - chips modules packaging

    本文首先綜述了熱沉用金剛石基板的特點和面臨的問題及相應的措施;並介紹了多晶元組件封裝技術相關知識。
  15. Just twenty years ago, chip components were measured in microns, or thousands of nanometers

    就在20年前，晶元組件還是微米或幾千納米級的。
  16. The semi - unitized curtain wall is a kind curtain - wall structure, of which is fixed on stud by little unit - plate. in the same way with unit curtain wall, the half - unit curtain is still linked by rough upright frame and uneven cross bar each other

    半單元式幕墻半單元式幕墻是將小單元板塊固定在立柱上的一種幕墻結構，單元組件的上下連接，仍然是通過上下凹凸橫桿互相插接完成。
  17. Coverage ranges from thermal properties and semiconductor materials to mosfets, digital logic families, memory devices, microprocessors, digital - to - analog and analog - to - digital converters, digital filters, and multichip module technology

    覆蓋范圍從熱性能和半導體材料的mosfet ，數字邏輯家庭，記憶體裝置，微處理器，數位類比和模擬到數字轉換器，數字濾波器，以及多晶元組件技術。
  18. Aibas software fits the period of soft engineering, so it frees us from the dry and troubled code writing work. at last the application shows us an effective attempt to national small & medium - sized enterprises

    同時論文在吸取了aibas ? erp軟體系統其軟體設計方面的思想時，根據企業發展電子商務的需要，針對erp軟體系統，抽象出了三方面的「元組件」 。
  19. The purpose of this layer is to provide a unified way for interfacing with the api calls that manage the registry operations requested by the server and client network utility functionality and that provide enhanced control and manipulation over the selected sql services of the computer manager snap - in component

    此層的目的是提供與api調用交互的統一方法， api調用對服務器和客戶端網路實用工具功能請求的注冊表操作進行管理，並對計算機管理器管理單元組件的選定sql服務提供增強的控制和操作。
  20. 4. we set up the w - ocdma system experiment platform, carried through the experiment of w - ocdma, demonstrated 622mbps fast frequency hopping ( ffh ) encoding / decoding experiment with fbg encoder / decoder. the experiment results

    4 .設計搭建了w - ocdma通信系統實驗平臺，對w - ocdma通信系統各單元組件進行了實驗研究，測試各單元組件的性能。
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