封裝元件 的英文怎麼說
中文拼音 [fēngzhuāngyuánjiàn]
封裝元件
英文
encapsulated component-
The design of temperature sensor realizes bare fiber temperature characters and strain insensitivity of capsulated components in the range of 30 ~ 85, which guarantees their high stability and repeatability
溫度傳感器的設計結構在30 ? 85的溫度變化范圍內有效的實現了封裝元件的裸刪溫度特性及應變不敏感性，保證了其高穩定性和重復性。Components for electronic equipment. electrical wires for wrapped connexions. general requirements
電子設備元件.封裝連接用電線.一般要求The analysis of delamination and fracture in ic packages
濕熱導致電子元件封裝脫層斷裂的分析Can be used to produce insulating seal material for switch box, instrument board, etc
：可用於各種電器開關設備儀錶板電子元器件的封裝材料。An isv may want to ship this as a redistributable component as part of their application
Isv可能想要將這個封裝當做可轉散發元件來轉送，以作為其應用程式的一部分。Series full - auto pipe expander with drawing device and program interface is used with extruding machine. it is also used solitarily, while expanding pipes, the machine adopts translation, the action is steady and corret, it does not damage pipe materical, the machine adoptes double - infrared heating oven type, each oven is equipped with heating cire, the shaping method adopts expanding - end shaping, the size of pipe mouth is correct. on its panel, there is a transfer swith of expanding solvent type pipe socket ( straigh port ) and expanding sealloop type pipe socket ( rport ). the choice of expanding pipe type is very convenient, the technologocal adaptability is strong, its main electric control elements are all imported. the syetem charecteristics are steady and reliable
配有與主機配套的接料牽引裝置和相應的程序介面，既能與擠管主機聯線使用，又可以作單機使用；擴管時管材的移動均採用平移方式，動作平穩準確而且不易損傷管材；這種機型採用紅外線加熱方式且為雙加熱爐型，每個加熱爐都配有中心加熱爐芯；成型方式均採用擴管頭定型方式，管口成型尺寸準確；該機型在控制面板上設有擴溶劑型承介面（直口）和擴彈性密封圈型承介面（ r口）的轉換開關，擴管方式選擇十分方便，工藝適應性強；主要的電器控制元件均採用進口元件，系統性能穩定可靠。In poor packages, too large stresses are formed, which often results in cracking of chips and delaminating at mounting interfaces
如若封裝不當，會使器件產生過大的熱應力，致使晶元破裂、封裝微裂、漏氣，導致器件失效。The 43 - year - old man was found in possession of $ 5, 500 in cash while the 46 - year - old man was found discarding a paper bag containing suspected stolen property. it was found that the paper bag was containing five gold ornaments worth about $ 7, 500, a lady watch worth about $ 1, 000, $ 460 in 20 red pockets and various currencies equivalent to about hk $ 8, 872
經點算后，探員發現該紙袋裝五件價值合共約七千五百元的金飾、一隻約值一千元的女裝手錶、二十封共值四百六十元的利是及約相當於八千八百七十二港元的多種貨幣。Several materials with large coefficient of expansion were selected to make packaging components, and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers. experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed. have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of fbg wave - length, have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes
本文所做的主要工作包括以下幾個內容：一、選取了常見的熱膨脹系數大的材料製作封裝元件，經過多次一80到80反復測試，封裝元件沒有出現老化開裂、封裝裂紋、空洞、離層等缺陷，封裝材料具有良好的溫敏穩定性及復用性，與光纖相容性較好；二、對光纖光柵進行簡單、實用的封裝處理，就封裝效果的優劣性、波長測量的準確度、重復性和封裝時產生的波長損失等方面進行了一系列的實驗，得出了初步的結論；三、對溫敏和溫度補償式封裝的實驗數據進行了詳細的分析和對比，從數字上對溫變過程中光纖光柵中心波長的改變及溫變曲線進行了定量的分析，在大量實驗數據分析結果的基礎上，總結出哪種材料封裝效果更好，以及如何有效的減小實驗誤差。With the accumulation of product development experience in the last years, axcen photonics corp can provide the clients the high quality, high coupling - efficiency and cost - effective osa products. the products include sc - type, lc - type and pigtailed - type osas with the speed ranging from 155mbps to 2. 5gbps. in order to meet the specific request for high power and high coupling efficiency osas, axcen photonics corp also can offer the customized service to this kind of products
創威光電目前亦可提供客戶光學次模組封裝的產品及服務，藉由本公司技術研發人員過去多年來累積的開發經驗，本公司已可為客戶提供高品質高耦合效率及具市場競爭價格的光學次模組產品，其產品包括: sc - type ， lc - type及pigtailed - type光學次模組封裝，就傳輸速率而言，目前創威光電可提供從155mbps至2 . 5gbps等不同速率的產品，以迎合顧客需求，另外，本公司亦可提供客制化，特殊規格，符合高功率，高耦合效率要求之元件封裝。Packaging of components for automatic handling - stick magazines for electronic components encapsulated in packages of form e and g
自動控制用元件的封裝. e和g型封裝件中密封電子元件用粘結自動送料裝置Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
本文對金剛石材料在多晶元組件熱性能改善和熱應力研究，對金剛石在多晶元組件封裝熱設計應用具有一定的參考價值和提供一定的理論依據。The main conclusions and original results are summarized as follows. the manganin ultra - high pressure sensors for gas gun were made by two - step thin film techniques, namely, manganin thin films were first deposited by magnetron sputtering on fused silica substrates, and then covered by a layer of sio2 thin films by electron beam evaporation. consequently, the manganin sensing elements were " cleanly " encapsulated in inorganic solid matrix and the high - pressure shunt effect was eliminated radically
上述技術的主要優點在於可以採用高壓絕緣性能更好的無機物作為絕緣封裝材料，如本研究中所採用的sio2 ，而代替在箔式錳銅計中所使用的ptfe ；並可實現敏感元件「清潔」地無機固態封裝，即將整個敏感元件是包封在無機物中，而不與高壓力下絕緣性能相對較差的有機物，如粘接劑、樹脂等直接接觸，從而在根本上消除了高壓旁路效應。Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。For such calibrations it is necessary that the sensor element be mounted and sealed in a glass sheath so that the distance from the tip of the element to the bottom of the head of the thermometer is at least 450 mm, and the diameter of the glass sheath should not be greater than 8 mm
進行上述校正時，感溫元件必須裝于及密封於一玻璃套內，而該感溫元件的尖端與溫度計把手部份的底部最少距離450毫米，該玻璃套的直徑不得超過8毫米。First we measured s - parameter of the device and package shell. the package shell and bonding wire are expressed with equipment circuit composed of the resistance, capacitance and inductance then acquired the value of component by optimizing using microwave emulation software ( microwave office )
首先，測量出管殼封裝器件和管殼的s參數，把管殼和鍵合線均表示為由電容、電感、電阻組成的等效電路，再用微波模擬軟體（ microwaveoffice ）優化出元件數值。In the 2nd chapter, the modeling method of manufacture - oriented structure unit is put forward, and has been used to implement design reuse. the structure unit encapsulates manufacturing and planning data, and provides basic modular for product design and process planning reuse
第二章提出了支持設計重用的面向製造結構單元建模方法，將加工工藝和製造數據封裝于結構單元中，為零件結構設計和工藝設計重用提供了基本模塊。Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics
電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle
實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。8 mm through 200 mm embossed carrier taping and 8 mm 12 mm punched carrier taping of surface mount components for automatic handling
自動裝配用表面安裝元件的8mm至200mm壓紋載體帶式封裝以及8mm和12mm穿孔載體帶式封裝分享友人