封裝外殼 的英文怎麼說

中文拼音 [fēngzhuāngwàiké]
封裝外殼 英文
package shell
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 外 : Ⅰ名詞1 （外面） outside; external side 2 （外國） foreign country 3 （以外） besides; beyond; in ...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. The catena product is in the light of iso international criterion to design and make iso2858, pumpbody adopt metalline crust pad fluorine plastics inside, impeller and pump - cover all adopt metal embed part wrap fluorine plastics alloy outside to press. to make it possess superduper resist impact and eximious resist causticity, axis - envelop choose advanced outer - install form moire - pipe machine - airproof, airproof of oppositely abrade have silicon nitride chinaware f4 horniness alloy to choose. it has ratio of very high capability and price

    本系列產品按國際標準設計製造iso2858 ，泵體採用金屬外殼內襯氟塑料，葉輪及泵蓋均採用金屬嵌件外包氟塑料合金模壓成型，使其具有超強的抗沖擊能力又有卓越的耐腐蝕性能，軸封選用先進的外裝式波紋管機械密封，對磨的密封面有：碳化硅陶瓷四氟硬質合金可供選擇。
  2. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  3. The military qualified cots thermovision 2000 is designed with robust components in a field hardened enclosure, allowing it to readily withstand virtually any atmospheric or environmental condition

    Thermovision 2000將耐用的組件封裝在堅固的外殼內。使系統能夠在任何惡劣的天氣和環境下工作。
  4. Only the new device is housed in sealed water proof case.

    只有這種新裝置才具有密封防水的外殼。
  5. Rradial packaging : when insert assembly is mated, the space between shell and assembly should be totally packaged with glue in order to prevent external dust, liquid and harmful gas leaking radically into connector

    徑向灌封：絕緣安裝板組件到位后，殼體與組件之間的全部用膠液灌，防止外界的灰塵、液體、有害氣體從連接器的徑向滲入
  6. Solid front case with pressure relief at back

    後部帶泄壓裝置的前封式外殼
  7. The results of fe simulation shows that the mental package made abroad has lower thermal stress and higher reliability during working and manufacturing process than that made in china. it is mainly because that the two packaging structures were manufactured in different forming processes : one was punched and the other was brazed

    有限元計算的結果表明，採用沖壓一次成型的國外封裝外殼比採用異材壓焊的國產封裝外殼的工作熱應力和製造殘余熱應力要小很多，具有更高的可靠性。
  8. Functions to find file, shell file, read a file and more

    封裝了用於查找文件、外殼文件和讀取文件的一系列函數。
  9. High inxulation resistance, long life fue to self - healing effect

    塑料外殼封裝，外觀一致性好
  10. In our country there are additional requirements for gaskets, glands and sealing compounds employed to prevent harmful ingress of water and to adhesives used for securement of such gaskets to an enclosure or cover in controls to be installed where exposed to rain and operating at or below 60

    6條注：對用於防止有害水侵入的密封圈、密封墊及密封劑和將這樣的密封墊固定到要安裝在雨水環境中及在60或以下溫度下工作的控制器中的外殼和蓋上的膠粘劑應有附加要求。
  11. High - strength polypro - carbonic acid ester casing, fully seal up structure, waterproof, riot function are very good. the battery and headlamp can be one set and artistic

    高強度聚碳酸酯外殼；全密封結構、防水、防爆性能優良。電池、頭燈一體化結構，美觀實用。配塊裝手柄及掛鎖，可頭燈、手柄兩用。
  12. Purged and pressurized enclosures for electrical equipment

    電氣設備的清洗和加壓封裝外殼
  13. Mechanical standardization of semiconductor devices - coding system and classification into forms of package outlines for semiconductor device packages

    半導體器件的機械標準化.半導體器件封裝外殼形式的分類和編碼系統
  14. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages

    半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統
  15. Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 2

    半導體器件的機械標準化.第4部分:半導體器件封裝外殼形式的分類和編碼系統.修改件2
  16. Box type provides the identical outer appearance

    塑料外殼封裝，外觀一致性好
  17. Hardware circuits, encapsulation boxes and software of the smart devices were designed. the smart temperature sensor, smart pressure sensor, smart speed sensor, and smart positioning actuator were developed

    設計了智能裝置的硬體電路、封裝外殼和相關軟體，在實驗室環境下研製完成了智能溫度傳感器、智能壓力傳感器、智能轉速傳感器和智能位置控制器。
  18. Each parts of the micro fiber spectrometer are packaged in a little metal box. one end of the box is connected to the optics processing system with fiber and the other end of the box is connected to computer with usb wire

    將微型光纖光譜儀封裝到一個較小的金屬外殼中，其一端通過光纖與光處理系統相連，一端通過usb傳輸線與計算機usb介面相連。
分享友人
分享到 Line

分享到臉書