封裝密度 的英文怎麼說

中文拼音 [fēngzhuāngmìdù]
封裝密度 英文
density of packaging
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 密 : Ⅰ名詞1 （秘密） secret 2 [紡織] （密度） density 3 （姓氏） a surname Ⅱ形容詞1 （距離近; 空隙小）...
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. The pillow block ball bearing is composed of a single row deep groove ball bearings with seals at both sides and spherical outside surface, and a housing, suitable for simple support, widely used in varieties of mechanical equipment, especially for agricultural, metallurgical, textile and printing machinery

    外球面帶座軸承由一個兩面帶密封圈的單列外球面深溝球軸承和一個軸承座組成，適用於簡單支撐，對主機的製造和安裝精度要求低，安裝拆卸方便，廣泛應用於各種機械設備，尤其使用於農業機械、冶金機械、紡織機械及印刷、印染、食品、建材、陶瓷等各種輸送設備。
  2. The pillow block ball bearing is composed of a single row deep groove ball bearing with seals at both sides and spherical outdide surface, and a housing, suitalie for simpie support, widely usedinvarieties of mechanical epuipment, especially for agricultural, metallurgical, teatile and prnting machinery

    外球面帶座軸承由一個兩面帶密封圈的單列外球面深溝球軸承和一個軸承座組成，適用於簡單支承，對主機的製造和安裝精度要求低，安裝拆卸方便，廣泛應用於各種機械設備，尤其適用於農業機械、冶金機械、紡織機械及印刷、印染、食品、建材、陶瓷等各種輸送設備。
  3. It is suited for : high - tech electronic parts and related products such as magnetic head, ic, lsi, optical fiber, semiconductor, electronic lead frame and etc, require high precision disc wheel with high precision, efficiency cutting and break molding

    適用：高科技電子零件及相關產品，如磁頭ic lsi光纖半導體封裝品電子導線架等，要求高精度高效率切割切斷加工的高精密薄片砂輪。
  4. Shorts between metal runners are important only in those regions of the chip with a high density of closely packed metal runners.

    金屬布線間的短接，僅在那些具有高密度密集封裝型金屬布線的晶元中才極為重要。
  5. Therefore, the waveguide optical modes in the semiconductor lasers with different waveguide structures are investigated by means of optical waveguide theory. with the development of fabrication and packaging techniques, the dimensions of optoelectronic and photonic systems have become smaller and smaller. the far - field radiation models are no longer suitable for the near - field distribution of semiconductor lasers

    隨著製作工藝和封裝技術的發展，光電系統和光子系統的尺寸越來越小，半導體激光輻射的遠場模型不再適合其近場特性的分析；而且，半導體激光器可以作為近場虛擬光探針，應用於近場光學高密度存儲、納米光刻、近場光學成像以及光譜探測等領域。
  6. When the machine is working, the operations of feeding, heating, extruding, filming, forming, cooling, measuring, slitting and rolling can be carried out automatically. air bubble film is also called air bubble sheet, air cushion film, poly - cell sheet or plastic poly - cell. it s widely used as anti - shock material for the package of electronic appliance, industrial products, craftwork and so on

    氣泡膜，亦稱氣墊膜氣珠膜氣泡布氣泡紙氣泡薄膜氣墊薄膜，是採用ldpe低密度聚乙烯樹脂加工而成，是當前普遍使用的唯一透明的一種軟包裝緩沖材料，可製成氣泡袋氣泡牛皮紙信封袋汽車太陽擋隔熱座墊隔熱保溫材料等。
  7. Connection and sealing device for new and old casings used when repairing the broken and damaged casing in well with large area, long length, as well as repairing the wrongly cut casing in well ? ? packer - type casing patch - connector

    修復面積大，長度長，破裂，損壞的井內套管，修復錯斷的井內套管時所用的新舊套管的連接密封裝置?封隔器型套管補接器。
  8. [ english ] connection and sealing device for new and old casings used when repairing the broken and damaged casing in well with large area, long length, as well as repairing the wrongly cut casing in well ? ? packer - type casing patch - connector

    修復面積大，長度長，破裂，損壞的井內套管，修復錯斷的井內套管時所用的新舊套管的連接密封裝置?封隔器型套管補接器。
  9. In relation to an integrated circuit ; a term that indicates small element size and high packing density

    集成電路技術中的一種修飾術語，表示元件體積小而且封裝密度高。
  10. The accelerometer which has simple fabricated process and high sensitivity and small parasitic capacitance and residual stress is hybrid integrated with the interface circuit using ic nude chip. so the density of the package is increased, and the noise of the sensing system is decreased. these found the base of capacitive accelerometer module using the mcm method

    該傳感器製作工藝簡單，靈敏度高，支撐梁採用u型，減小了刻蝕后的殘余應力，用玻璃作為襯底，減小了襯底和硅可動質量塊間的寄生電容，且把傳感器晶元和用ic裸片製作的介面電路集成在一起，提高了封裝密度，減小了傳感器系統的噪聲，為採用mcm技術製作電容式加速度傳感器模塊打下了基礎。
  11. Thick film technology is applied in complex dense electronic assemblies and makes it possible that reduces room occupied and increases mount density in printed circuit board

    採用這樣的封裝能夠大大減少佔用線路板的空間，進一步提高電路板的組裝密度，從而
  12. With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on

    多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。
  13. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  14. Third, it analyzes different influences upon the life predication by comparing different models of the same package, different constitutive models of the same solder ball ' s materials, different life prediction models, different solder ball dimensions, different mesh density etc. finally, it compares some popular constitutive models of the solder ball materials, and constructs an integrated constitutive model by different curve fits

    接著，又在上述分析的基礎上，比較了同種封裝的不同模型（如條形模型， 1 4模型， 1 8模型） 、相同焊球材料的不同本構模型、不同壽命預測模型、不同焊球尺寸及網格密度等方面對壽命預測的影響。
  15. With increasing of packaging density and power, the technologies of cooling and heat dissipation and thermal stress become important problems to be resolved

    隨著封裝密度和功率的提高，冷卻和散熱以及由溫度引起的熱應力問題是必須要考慮的重要技術課題。
  16. Currently, the digital system is composed of a large amount of highly fine packeted ics, such as pgas, bgas, smts, and mcms

    如今的數字電子系統，大量地採用了諸如pga 、 bga 、 smt 、 mcm等高度封裝器件，使得pcb上各器件之間的連線間距越來越細密。
  17. Today, a wide variety of materials and fabrication techniques enable suppliers to design stencils that meet the assembly challenges of fine - pitch technology, miniaturized components and densely packed boards

    今天，多種多樣的材料和製造技術時供應商能設計出的鋼網能迎接細微坡度，小型化部品和高密度封裝電路板的挑戰。
  18. In our country there are additional requirements for gaskets, glands and sealing compounds employed to prevent harmful ingress of water and to adhesives used for securement of such gaskets to an enclosure or cover in controls to be installed where exposed to rain and operating at or below 60

    6條注：對用於防止有害水侵入的密封圈、密封墊及密封劑和將這樣的密封墊固定到要安裝在雨水環境中及在60或以下溫度下工作的控制器中的外殼和蓋上的膠粘劑應有附加要求。
  19. The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays

    減少元件和電路的幾何尺寸，以達到增加電路的封裝密度、減少功耗和減小信號傳播延遲的目的。
  20. The flip chip technology developed recently provides the shortest possible leads, lowest inductance, highest frequency, best noise control, highest packaging density, greatest number of inputs / outputs ( i / 0 ' s ) and lowest profile when compared with other popular interconnect technologies

    新近發展起來的電子封裝倒裝焊技術，具有封裝密度高、信號處理速度快、寄生電容/電感小等優點，是目前最具發展前景的先進封裝技術之一。
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