封裝形式 的英文怎麼說

中文拼音 [fēngzhuāngxíngshì]
封裝形式 英文
encapsulation mode/form/modality
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 式 : 名詞1 （樣式） type; style 2 （格式） pattern; form 3 （儀式; 典禮） ceremony; ritual 4 （自然科...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. It can produce air - laid paper napkin pad, fluffy n. w. fabric napkin pad and three pieces style napkin pad. ( as per request, it can be added to produce cotton core napkin pad

    獨立包裝型式：主機成型后的護墊三折疊輸入形成口字狀的外包膜經封口形成袋包狀，產品密封性好。
  2. Chip carrier sockets for plastic quad flat packages for use in electronic equipment, blank detail specification for

    電子設備用塑料方形扁平封裝用片式載體插座的空白詳細規范
  3. Work, good optical function, high dependable, low spoilage, good direction - sense, ware length evenness, good stability, used for every environment

    附加損耗低方向性好波長平坦性好環境穩定性好，適用於各種惡劣環境多種封裝形式可選
  4. Since web service model can not be used directly in the traditional workflow model, the paper detailed describe the design of the encapsulate and structure workflow, this workflow is different from the traditional workflow which is modeled in a graph method, we use the idea of the object oriented to make the workflow more reusable and easy to be deployed in web service environment

    由於web服務模型並不能直接用在傳統的工作流模型中，因此就需要對傳統的工作流語言建模做相應的修改來適應web服務的特點。對此，本文就詳細討論了一種結構化封裝型工作流的設計，該工作流不同於以往工作流都是通過圖形化的方式建模，而是採用面向對象方法中的解釋器模式來設計一個封裝和結構化的定義流程。
  5. Packaging of winding wires - part 3 - 1 : taper barelled delivery spools - basic dimensions

    繞組線的封裝.第3 - 1部分:錐形筒式輸出線軸.基本尺寸
  6. Packaging of winding wires. part 3 : taper barrelled delivery spools. section 3 : specification for non - returnable spools made from thermoplastic material

    繞組線的封裝.第3部分:錐形筒式輸出線軸.第3節:由熱塑性材料製成的不能回收使用的繞線軸規范
  7. The main results are as follows : 1 ) firstly, this paper furtherly analyzes and research on the high - voltage isolation optocouplers, the forms of the package, the aging rule, the character of isolation - voltage, the basic parameters and the typical applications of optocouplers in detail

    主要內容為: 1 、首先對光電耦合器的結構特點、封裝形式、老化規律、隔離電壓特性、基本參數及典型應用等作了詳細的分析和總結，為進一步的研究打下了深厚的理論基礎。
  8. The most recognized form of digital wrappers are digital envelopes. those pieces of code are the workhorses of e - mail encryption, locking out intruders who don ' t have the right digital key to open the envelope. the digital envelope is essentially made up of code encrypted with a cipher, or software algorithm, and carries a digital signature that properly identifies the sender to the recipient

    數字包裝器最被認可的形式是數字信封，這些代碼主要完成電子郵件的加密，把想打開信封而沒有正確數字密鑰的入侵者擋在外面，數字信封主要由通過密碼加密或軟體演算法加密的代碼組成，運載著能正確讓接收方識別發送方身份的數字簽名。
  9. Which command verifies encapsulation as well as layer 1 and layer 2 statistics on a router configured for frame relay

    在幀中繼的配置中，哪一條命令可以用來校驗數據在第一層和第二層上的封裝形式
  10. By using it, the section mapping drawings of multi - types & complex pipeline system can be automatically generated through the entity crossing operation. this method composes of the following three key steps. in the first, different graphic entities are identified from the complex pipelines drawing in terms of the layer information they owned, then the correspondent information is to be encapsulated to keep the spatial data completeness of the graphic symbols

    該方法通過管線系統設計圖中的圖形實體的分層處理與信息封裝，首先實現了復雜管線實體的自動識別並確保了圖形實體具有對應管線實體對象的完備空間信息；在此基礎上，根據用戶給出的任意位置截切線，構造隱式描述的截切面並與隱式描述的管線實體進行求交運算；最後通過對求交結果的坐標變換，生成能夠直觀反映出多類型復雜管線系統空間分佈信息的截切面映射圖。
  11. In datagram - emulation mode, the wma 1. 0 ri emulates the transport by packing the sms message into a datagram and forming the actual client or server address based on the following entries : default values for sms internal implementation

    在數據報模擬方式中， wma 1 . 0 ri模擬傳輸的方式是：將sms消息封裝在數據報中，並基於下列項形成實際的客戶機或服務器地址：
  12. Magnetic head is designed by six magnetic poles in symmetrical distribution, the design of excitation loop and excitation angle makes magnetic field act on welding arc region which could control welding arc effectively. the insulation, cooling and hermetization of magnetic head avoid the influence on magnetic field of outside ; miniaturization design of magnetic head could achieve different welding process

    磁頭裝置採用六磁極對稱勵磁方式設計，勵磁線圈和勵磁角度的設計使產生的磁場恰好作用於焊接電弧區域以實現對電弧的有效控制;磁頭的絕緣，冷卻，密封設計避免了焊接過程中外界因素對磁場的干擾;磁頭整體的小型化使該裝置可以實現多種形式的焊接工藝。
  13. The body of the article goes deep into out style design ( face, construction, package ), further discuss the role of inner style design ( interface, layout, text, graphic & illustration, audio, video & animation, color, decoration, function, and the design of how to combine material )

    論文主體部分是對外形式設計：盤體設計、盤盒設計、封套裝潢設計和內形式設計：界面設計、版面編排設計、字體形象設計、圖形圖像設計、聲音效果設計、視頻動畫設計、主體色彩設計、裝飾美化設計、基本功能設計、素材組接設計的深入分析。
  14. 5 by using multi - window programming technology to combine vc + + with autocad, this thesis implemented comparison of plane, profile and across section, interactive design of profile, railway location by across section and setting location of bridge and tunnel. 6 this thesis expounded itself viewpoint on application model of profile optimization in scrlid, and has been used in system development. 7 by putting forward the summaries on the application model of professional design, this thesis established mathematics model of calculating terrain height of profile and across section, automatic setting location of the bridge and the tunnel

    2 、用面向對象的數據封裝和繼承技術實現了項目管理和方案數據的安全保護； 3 、選擇應用vc + + dao數據庫應用技術，完成了方案比選共用數據庫的開發； 4 、用autocadobjectarx定製實體技術，實現了線路平面拖放式交互設計； 5 、用vc + +與autocad相結合的多窗口編程技術，實現了平面、縱斷面、橫斷面三種圖形的對比顯示，實現了縱斷面交互設計、橫斷面定線和橋隧工程設置； 6 、就縱斷面優化在線路方案比選工作中的應用模式提出了自己的觀點，並在系統開發中得到應用； 7 、總結專業設計應用模式，建立了內插縱橫斷面地面高程、自動設橋、自動設隧數學模型。
  15. Recently, designers developed a new type of package : ball grid array ( bga ) package. the bga package has many i / o pins. because of this merit, this kind of package is used widely now. but the package has a new structrue, and the old routing algorithms are not used

    鑒于球柵陣列封裝（ bga ）的優點，這種技術成為目前最廣泛的封裝形式。然而由於球柵陣列封裝（ bga ）結構的特殊性，對于這種封裝上的布線演算法不同於普通的布線演算法。
  16. The transistor count is 3. 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design

    該處理器目前正在進行後端設計，即將採用0 . 25 mcmos工藝流片，整個處理器的晶體管數目為380萬，封裝形式是qfp240 ， die面積為98mm ~ 2 。
  17. This thesis overall views the historical development, future trend, active devices. sensitivity definitions and configurations of microwave and millimeter mixers, and then discuss several kinds of mixers and mixer diodes

    本文系統地介紹了微波毫米波混頻器的發展概況和今後的發展趨勢、實現混頻器的有源器件及其封裝形式以及利用它們實現混頻的優缺點。
  18. As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem

    三維疊層晶元尺寸封裝（ stackedchipscalepackage ）是目前最先進的微電子封裝形式之一，具有體積小、重量輕、封裝效率高等特點。
  19. Packaged in bga and pga

    封裝形式：
  20. Therefore, the traditional testing of packaging format has been not enough, and it moves up to the wafer level

    因此，傳統使用封裝形式的測試已不敷需求，漸漸往上游回溯至晶圓層級，被晶圓形式所取代。
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