封裝技術 的英文怎麼說

中文拼音 [fēngzhuāngjìshù]
封裝技術 英文
lga （land grid arry）
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 技 : 名詞（技能; 本領） skill; ability; trick; technique
  • 術 : 術名詞1. （技藝; 技術; 學術） art; skill; technique 2. （方法; 策略） method; tactics 3. （姓氏） a surname
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Flip chip will be a new method of packaging technology

    倒裝晶元將成為封裝技術的最新手段
  2. The advanced microelectronics packaging technology

    新型微電子封裝技術
  3. Investigation of electroless nickel gold bump technology

    晶元封裝技術的發展演變
  4. There are various techniques involved in the development of umbirfpa, such as principle of the device, micro - machined technique, readout integrated circuit ( roic ), signal process, infrared imaging, device capsulation and so on

    Umbirfpa的研製涉及到器件原理研究、紅外材料的研製、微機械製造技術、低功耗信號讀出技術、信號處理技術、紅外成像技術、器件封裝技術等方面。
  5. Chalk one up for good encapsulation techniques

    從良好封裝技術獲得一項好處
  6. Chapter 2 offers a brief description of dvb / davic standards, including the format of mpeg - 2 transmission stream, package method of dvb, and the components of dvb data broadcasting system

    第二章介紹了hfc catv網路上的主流數據廣播技術： dvb davic系統，包括碼流格式、封裝技術和系統構成。
  7. High power diode laser is the requirement to research on the high - average - power diode - pumped solid - state lasers, so the package techniques of the diode laser is studied first in this thesis

    高功率二極體激光器是開展高平均功率dpl研究的必要條件。本文首先研究了高功率二極體激光器封裝技術，二極體條散熱冷卻是高功率二極體激光器封裝要解決的核心問題。
  8. However, the disadvantage of laser welding is the so - called post - weld - shift ( pws ). the end result is a reduction in light coupling efficiency. the shrinkage force generated by the solidification process is so great that no known mechanical structure can counteract the shrinkage from shifting the joint ? at least at the micron level

    這種封裝技術最大的缺點是會使激光二極體的封裝產生焊後偏移（ pws ） ，很少有一種機械的方法可以校正這種焊後偏移到亞微米級別，目前激光錘被證明是一種很有效的校正方法，激光錘校正作用過程就是利用金屬熔化凝固冷卻產生的內應力來恢復焊後偏移的過程。
  9. Ultrathin wafer level chip size package technology

    超薄型圓片級晶元尺寸封裝技術
  10. Package technology and trends of surface acoustic wave devices

    聲表面波器件的封裝技術及其發展
  11. Therefore, the waveguide optical modes in the semiconductor lasers with different waveguide structures are investigated by means of optical waveguide theory. with the development of fabrication and packaging techniques, the dimensions of optoelectronic and photonic systems have become smaller and smaller. the far - field radiation models are no longer suitable for the near - field distribution of semiconductor lasers

    隨著製作工藝和封裝技術的發展，光電系統和光子系統的尺寸越來越小，半導體激光輻射的遠場模型不再適合其近場特性的分析；而且，半導體激光器可以作為近場虛擬光探針，應用於近場光學高密度存儲、納米光刻、近場光學成像以及光譜探測等領域。
  12. Wlcsp wafer - level chip scale packaging technology

    晶圓片級晶元規模封裝技術
  13. Wafer - level packaging technology and application

    圓片級封裝技術及其應用
  14. The development of wafer - level packaging

    圓片級封裝技術展望
  15. Development and application of modern wafer - level packaging technology

    現代圓片級封裝技術的發展與應用
  16. With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on

    多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。
  17. Packaging technology of 10gb s optical transceiver

    光收發模塊封裝技術
  18. New progress of electronic packaging technology

    電子封裝技術的新進展
  19. In this paper outlining the characteristics of diamond substrate and problems to be faced with, and measures to be taken, introducing knowledge of multi - chips modules packaging

    本文首先綜述了熱沉用金剛石基板的特點和面臨的問題及相應的措施;並介紹了多晶元組件封裝技術相關知識。
  20. Progress and application for mems packaging technologies

    封裝技術的發展及應用
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