封裝電子電路 的英文怎麼說

中文拼音 [fēngzhuāngdiànzidiànlù]
封裝電子電路 英文
packaged electronic circuits
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  • 電子 : [物理學] [電學] electron
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  2. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  3. Totally - enclosed three - phase induction motors with short - cicuited rotors. class e

    裝有短路轉子的全封閉型三相感應電動機. e類
  4. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  5. A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip

    提出了一種通過特定的扁平小矩形路徑j積分，計算電子封裝中異質界面分層裂縫擴展能量釋放率的新方法。
  6. With yulon ' s reputation and financial power, worldwide fab and assembly house ' s support, anachip is devoted to provide total ic solutions to serve our customers, and expect to reach a great operational result together

    藉由裕隆集團在企業界的聲望及財務奧援，與世界各地晶圓廠及封裝測試廠的配合，易亨電子將致力於提供客戶完整的集成電路方案，共同創造更亮麗的營運成果。
  7. Electromechanical switches for use in electronic equipment ; part 3 : sectional specification for in - line package switches

    電子設備用機電式開關.第3部分:線路封裝開關的分規范
  8. Electromechanical switches for use in electronic equipment ; part 3 : sectional specification for in - line package switches ; identical with iec 61020 - 3 : 1991

    電子設備的機電開關.第3部分:線路封裝開關分規范
  9. Because the calculation of j - integral is much simpler than other method, and the multilayers and interfaces are ubiquitous in microelectronic packaging structures, it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging, especially

    並通過實例證明，此新方法對于界面分層問題是可行的。由於j積分計算十分簡便，因此扁平小矩形路徑j積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應用。
  10. Ic and optoelectronics packaging ; flip chip technology ; surface mount technology

    集成電路及光電子封裝；倒扣晶元技術；表面貼裝技術
  11. While expensive eda tools are required for ic design, other types of equipment are also needed for other parts of the cycle, such as wafer fabrication, packaging, wafer bumping, testing, etc. currently, most hong kong ic design companies have to rely on overseas companies to perform these tasks

    集成電路設計工作須要利用昂貴的電子設計自動化工具，但周期內其他環節如晶圓加工、封裝、晶圓凸塊製造、測試等，卻需要其他類型的儀器。目前香港大部分集成電路設計公司均要依賴海外公司進行有關工作。
  12. Tianyu electronic firm is the electronic sale firm that manages the famous - brand producer integrated circuit of the world. there are brand managed mainly maxim. lt. ds. mot. ad and so on, the encapsulation of the products rely mainly on smd and dip concurrently plcc, the use of the products is extensive and suitable for industry and commercial field

    天宇電子有限公司是一家經營世界名牌廠家集成電路的電子貿易公司，經營的品牌主要有maxim . lt . ds . mot . ad等，產品的封裝以smd （貼片）為主，兼有dip （直插） . plcc （粒）等封裝，產品的用途廣泛適用於工業和商業領域
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