晶元外連接 的英文怎麼說

中文拼音 [jīngyuánwàiliánjiē]
晶元外連接 英文
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  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : Ⅰ名詞1 (外面) outside; external side 2 (外國) foreign country 3 (以外) besides; beyond; in ...
  • : Ⅰ動詞1 (連接) link; join; connect 2 (連累) involve (in trouble); implicate 3 [方言] (縫) ...
  • : Ⅰ動詞1 (靠近;接觸) come into contact with; come close to 2 (連接; 使連接) connect; join; put ...
  • 連接 : connect; fit together; link; marry; mate; joint; association trail; linkage; concatenate; concate...
  1. The leec biochip can be connected with pcb ( printed circuit board ), thus it can generate a moving electric field by changing time, scope and field intensity discretionarily under single chip processor ' s control. meanwhile it is probable to reduce driving voltage and decrease temperature greatly, and so increase resolution of dna separation

    研究內容包括線性分散式電極陣列的理論設計,以普通載波片和有機高聚物pdms ( polydimethylsiloxane )為基本材料的製作工藝, leec和pcb板的方式,硬體控制系統的設計以及控制工作的單片機程序編制等,此還包括電化學檢測方法的研究。
  2. Quartz crystal units of assessed quality - standard outlines and lead connections

    質量評定的石英件.標準形和引線
  3. Bringing into play the communication market resources in hangzhou bay, the park devotes itself to the formation of a “ mobile valley ”, which means a unique zhejiang - flavored economic pattern : forming a complete telecommunication industry chain from software and operation development of key parts, such as ic chip, rf modules, base band, display, high capacity battery, to related components like cell phone housing, keypad, antenna, vibration motor, mould, pcb ( circuit board ), photoelectricity device, electronic device, connectors and system and software development, and operation service development

    園區依託杭州灣通信市場資源,致力打造「移動谷」 ,創造中國浙江經濟特有的專業版塊模式:從集成電路、 rf組件、基帶、顯示器、高能電池等核心器件到手機殼和按鍵、天線、振動馬達、模具、 pcb (電路板) 、光電器件、電子器件、件等相關組件及系統和軟體開發、運營服務開發,形成完整的通信產業鏈。
  4. According to the request of this subject, we have developed the system hardware and software for the slave device and the inspection software running on the pc. in this paper all of the followings is illustrated detailedly, such as the research on the principles of measurement and its realization, three means of water - level measurement that are separately based on photo electricity coder, pressure sensor and potentiometer ; selection of the microchip, we choose an advanced integrated soc ( system on chip ) microchip c8051f021 as the main controller ; realization of signal sampling, processing and its conversion in the mcu ; application of high precision 16 bits adc cmos chip - - ad7705 in our system, designing its interface with the microchip and relevant program ; using a trickle charge timekeeping chip ds1302 in the system which can provide time norm and designing of its i / o interface and program ; additionally, a 4 ~ 20ma current output channel to provide system check - up using ad421. in the system, ad421, ad7705 and the microchip compose spi bus ; to communicate with the master pc, here we use two ways which are separately rs232 and rs485 ; moreover, there are alarm unit, keyboard unit, power supply inspection unit and voltage norm providing unit in the system

    針對研製任務的要求,課題期間研製了下位機系統硬體和軟體,開發了上位機監控軟體,其中所作的具體工作包括:測量原理的研究和在系統中的實現,在本次設計中用三種方法來進行水位測量,分別是旋轉編碼器法、液位壓力傳感器法和可變電阻器法;主控的選擇,我們選用了高集成度的混合信號系統級c8051f021 ;實現了信號的採集和處理,包括信號的轉換和在單片機內的運算;高集成度16位模數轉換ad7705在系統中的應用,我們完成了它與單片機的介面設計及程序編制任務;精確時鐘ds1302在系統中的應用,在此,我們實現了用單片機的i o口與ds1302的和在軟體中對時序的模擬,該的應用給整臺儀器提供了時間基準,方便了儀器的使用;另,針對研製任務的要求,還給系統加上了一路4 20ma模擬信號電流環的輸出電路來提供系統監測,該部分的實現是通過採用ad421來完成的,本設計中完成了ad421與單片機的spi介面任務,協調了它與ad7705和單片機共同構成的spi總線系統的關系,並完成了程序設計;與上位機的通信介面設計,該部分通過兩種方法實現: rs232通信方式和rs485通信方式;系統設計方面還包括報警電路設計、操作鍵盤設計、電源監控電路設計、電壓基準電路的設計。
  5. The minimum control system of single - chip micro - controller has two part of binary systems serial communication. for the communication between pc and the single - chip instrument, i chose to connect a chip named max232 to proceed the level conversion in electricity, establish the correspondence agreement, drawing the hardware connection diagram, and designed the correspondence procedure process with parts of procedures code ; for the communication between the single - chip instrument and the fx489, thesis uses 8251a to expand 89c51 for a serial port

    對于pc機和單片機的通信,論文選擇了介面max232進行電平轉換,設定了雙方通信協議,畫出硬體圖,並設計了通信程序流程及部分程序代碼;對于單片機和fx489之間的串列通信,論文採用了8251a擴展了89c51的一對串列口,同時也設計了這部分的通信程序流程及程序代碼;另,還對89c51擴展了一片數據存儲器6264 。
  6. Hereinbefore expatiate of software and hardware for the text is five parts, the heart of cmos type is elaborate recommendations, connection in the circuit of priphery, circuit connection between and cmos, means of programmer and software of corresponding, and the linchpin software upon which of source code

    本文對以上五個部分的軟硬體設計作了詳細的闡述,詳細介紹了核心的選型,圍電路的之間的電路,程序設計方法和相應的軟體,並給出了關鍵軟體的程序源代碼
  7. It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials

    研究表明, 93w與ofc的界面是ofc與93w中w粒的以及ofc與93w中ni - fe粘劑的共同作用的結果; ofc與tc _ 4界面的形成是由於ofc與tc _ 4之間發生反應擴散,並由此在二者頭處生成了cu - ti金屬間化合物的中間相; tc _ 4 - al的與al - mb _ 2的則分別是其基體素ti 、 al之間和al 、 mg之間素互擴散的結果,另,由於熱膨脹系數的差異,擴散焊后在不同焊件的頭處存在殘余熱應力並由此引起頭的形變。
  8. For the image acquisition of optical scan mode, normally, ccd image sensor is used to capture image, but in our system, due to the system request of micromation and high integration, cmos image sensor is adopted as the image collection device, and then the thesis gives a interface circuit between the chip and dsp and a control solution of image collection ; toward the information storage in our solution, dsp is directly linked to usb host chip and it is the dsp that accomplishes the processing of usb protocol and interface control so as to reduce the cost, minimize product cubage and consequently meet the requirement of system micromation ; at the same time, the thesis probes preliminarily into usb otg ( on - the - go ) technology, which offers an approach between embedded machines including pda, mobile phone, printer, digital camera and so on ; in addition, some attempts on the other application area with tms320vc5402 which was commonly used to voice processing and static image processing are done, for example, to arrange the chip to control lcd module directly

    在圖像的光電掃描輸入上,傳統方案大部分採用ccd型圖像傳感器,而在本方案中,根據系統微型化、高集成的特點,使用了cmos圖像傳感器作為攝像器件,並且設計了該與dsp的一種介面電路以及圖像採集控制方案;在信息存儲上,本方案採用dsp直與usbhost,由dsp處理usb協議和介面信息,從而降低了系統成本、縮小了產品體積,滿足了系統微型化的要求;同時本論文也對usb - otg技術進行了初步探討,利用此項技術,不再需要計算機作為主機,就能實現在pda 、移動電話、印表機、數碼相機等嵌入式應用之間直互聯通信;另也對廣泛用於語音處理和靜態圖像處理的tms320vc5402其它方面的應用進行了嘗試,比如直控制液顯示器等。
  9. The lastic, metal, or ceramic container that enclose a ic. ackage rotect the chi and ring the lead from the outside world to the chip

    封住ic所用的塑料、金屬或陶瓷包裝。封裝可以保護,並使部世界
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