晶元工藝 的英文怎麼說

中文拼音 [jīngyuángōngyì]
晶元工藝 英文
chip technology
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 工 : Ⅰ名詞1 （工人和工人階級） worker; workman; the working class 2 （工作; 生產勞動） work; labour 3 ...
  • 藝 : Ⅰ名詞1 （技能; 技術） skill 2 （藝術） art 3 [書面語] （準則） norm; standard; criterion4 [書面語...
  1. Quick diathermancy avoid damage to cmos chip and solder. precise design and good technics avoid damage due to attrition. vacuumize avoid alterative because of oxygenation during transportation. antistatic plastic core

    傳熱吸收快，盡可能的避免對晶元和焊盤的損壞;精確的設計和製造工藝避免磨擦對焊盤可能造成的損壞;真空包裝避免?品在運輸途中氧化變質;防靜電塑料芯;符合美國軍隊及國家宇航局各種標準
  2. Based on the analyses on mechanical properties, microstructure and fracture of - the microalloyed steels socrv with various heat treatment technique, it can be affirmed that various fractures arttribute to various mechanism, we can draw conclusion that the strength and toughness of microalloyed steels 50crv will be increase simultaneously by optimal heat treatment technique. to illustrate the mechanism of the strength and toughness of microalloyed steels socrv, we designed the comparative experiment and observed the microstructure of the sample which occurred at different quench and tempering temperature and different tempering time. the last experiment results were determined by the four factors : fined microalloyed elements grains, the decompound of martensite, martensite transformation of remnant austenite and the second phase precipitation

    為解釋微合金化50crv鋼強韌化機理，本文通過對不同淬火溫度，回火溫度，回火時間下的力學性能指標的對比及顯微分析，認為微合金元素的細化晶粒，馬氏體的回火分解，殘余奧氏體的轉變，第二相的沉澱析出共同決定了微合金鋼的強韌化情況，特別是由於微合金元素的存在，其細化晶粒及其碳氮化物的沉澱析出，導致鋼的良好的強韌性，並且如果工藝滿足第二相的沉澱析出強化大於回火馬氏體分解引起的軟化效應，會在硬度曲線中產生明顯的二次硬化現象。
  3. Research on the thermode bonding procee for flip chip

    倒裝晶元熱電極鍵合工藝研究
  4. It is well known that there exists a composition triangle in phase diagram for ternary system of al2o3 - sio2 - zno, responding to three high temperature phases of corundum, mullite and gahnite. through control of chemical composition and technical process, it is possible to synthesize corundum - mullite - gahnite multiphase materials theoretically

    在al _ 2o _ 3 - sio _ 2 - zno三元系中，存在著一個對應剛玉、莫來石和鋅鋁尖晶石三物相的分三角形，在適當的配料組成和工藝條件下，是能夠合成出剛玉?莫來石?鋅鋁尖晶石復相材料。
  5. Chip lsi technology

    晶元大型集體化工藝學
  6. Wamow company provides raw material and oem package of crystal collagen mask for worldwide suppliers. the raw material of crystal collagen is composed lf natural medical ingredients, and is the best beauty and moisturizing product. it utilizes bio - genetic engineering technology to compound ossein, hyaluric acid, and red algapolymer, as well as water solvable collagen, to produce the very best crystal collagen raw material, which is also known as “ fountain of skin “

    華茂貿易公司在中國內地是膠原蛋白水晶面膜原材料最大供應商，而且我們也可以?國內化妝品企業提供水晶面膜生?工藝流程，可以指導客戶組織生?出如：金箔元素系列、水果果素系列、花草茶系列、香熏水晶蠟系列、中華草本系列、海洋元素系列、純晶骨膠原系列等十大系列100多個品種的天然水晶蛋白膠原膜貼成品。
  7. During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc

    在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。
  8. The result shows that with the addition of rare earth elements, ultrasonic irradiation and magnetic field, the chemical component, surface configuration, microstructure and properties of electroless co - ni - b and co - fe - b alloy changes remarkably. such kind of change can be described as the followings. firstly the depositing speed of electroless alloy bath is raised while the polarizability and cathodic overpotential are reduced ; secondly the surface quality of the alloy coating and adhesion of the coating and matrix are improved ; thirdly in the coatings the content of the elements in the transient group increases, but the content of cobalt decreased ; fourthly the amorphous structure is transformed to microcrystal structure and polycrystal structure ; fifthly the microhardness and wear resistance of the coating are enhanced ; sixthly coercitive force is reduced, and magnetoconductivity of the coating is increased ; lastly the magnetic intensity of the coating increases with the addition of energy and light rare earth elements such as ce, la and decreases with the addition of heavy rare earth elements such as y. on the other side, when the alloy coatings passes through the heat treatment under the temperature of 250 or 500, their properties will change

    結果顯示化學沉積co - ni - b 、 co - fe - b工藝在稀土元素（ ce 、 la 、 y 、 dy ） 、能量（超聲波、磁場）介入后，沉積過程、合金成分、鍍層形貌結構和性能都有顯著變化，表現在：鍍液的陰極極化過電位和極化度降低，沉積速度提高；鍍層的結合力、表面質量改善；鍍層中過渡族元素的含量增加，輕元素硼的含量降低，同時證實了稀土元素與過渡族元素共沉積的可能性；鍍層的顯微結構由非晶態向微晶和多晶態轉變；鍍層的顯微硬度與耐磨性提高，力學性能優化；鍍層的矯頑力降低；磁導率提高；鍍層的磁化強度在能量（超聲波、磁場）和輕稀土元素ce 、 la介入后提高，重稀土元素y介入后降低。
  9. The leec biochip can be connected with pcb ( printed circuit board ), thus it can generate a moving electric field by changing time, scope and field intensity discretionarily under single chip processor ' s control. meanwhile it is probable to reduce driving voltage and decrease temperature greatly, and so increase resolution of dna separation

    研究內容包括線性分散式電極陣列的理論設計，以普通載波片和有機高聚物pdms （ polydimethylsiloxane ）為基本材料的晶元製作工藝， leec晶元和pcb板的連接方式，硬體控制系統的設計以及控制晶元工作的單片機程序編制等，此外還包括電化學檢測方法的研究。
  10. In the paper, we introduced how to draw layout based on the standard of 0. 6 m, 5v cmos given by csc semiconductor ltd and finish the work in candence

    晶元版圖的設計中採用了綠華半導體公司的0 . 6 m ， 5vcmos工藝庫，工藝基本特徵為多晶硅柵，單層金屬布線。
  11. Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 2 : testing of edge profile

    半導體工藝材料的試驗.半導體晶元幾何尺寸的測量.第2
  12. The fishkill facility, and most of ibm s other fabs, spends a lot of its time producing chips with powerpc cores

    Fishkill以及ibm的大部分其他工藝都花費了大量的時間來使用powerpc核心生產晶元。
  13. An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders

    全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。
  14. The principle and structure of pyroelectric infrared detector consisted of pyroelectric infrared sensor, fresnel lens and an application - specific controller, which is compatible with 0. 6 m 1p1m n - well cmos technology, is introduced in the paper

    本文介紹了組成熱釋電紅外探測器的三大部件:熱釋電紅外傳感器、菲涅耳透鏡、專用控制晶元的結構和原理，並提出了一種0 . 6 m1p1mn - wellcmos工藝專用控制晶元的設計方案。
  15. The degrees of crystallinity of pure ptfe under the different conditions of water cooling, air cooling and furnace - varying cooling were made comparison by xrd. the thermal stability of pure ptfe and solid lubricant was analyzed by dsc - tg ; the composition and valence state of elements in the surface of carbon fiber, solid lubricant before and after friction test and lubricant transfer film were characterized by xps ; the frictional property of solid lubricant was tested by pin and disk test rig. the frictional wear property of solid lubricant between embedded bearing sleeve and steel axle friction pair ring was tested by special simulate test machine, the hardness of solid lubricant was tested by pm ; the compression strength of solid lubricant was tested by material test machine

    用sem表徵原料微觀結構、摩擦表面及潤滑轉移膜表面形貌：用xrd進行原料物相分析，及比較水冷卻、空氣冷卻、隨爐冷卻三種工藝條件下的純聚四氟乙烯樹脂的結晶度；用dsc - tg分析純聚四氟乙烯樹脂及固體潤滑劑的熱穩定性；用xps表徵碳纖維表面、固體潤滑劑摩擦前後表面、潤滑轉移膜表面的元素組成、價態變化；用銷盤式摩擦磨損試驗機對固體潤滑劑進行摩擦性能測試；採用專用的臺架模擬試驗機對固體潤滑劑鑲嵌軸承套與鋼軸摩擦副間的摩擦磨損性能進行測定；用萊次偏光顯微鏡（ pm ）測試固體潤滑劑的硬度；用材料試驗機測試固體潤滑劑的抗壓強度等。
  16. With the advancement of technology and craftwork, the devolpment of the technique of integrated circuit ( ic ) has made it posibble to integrate a programmable system on a chip ( sopc )

    隨著工藝和技術的進步，集成電路技術的發展已經使得在一個晶元上集成一個可編程系統（即sopc ， programmablesystemonachip ）成為可能。
  17. In order to make the sensitivity of 2 - demension accelerometer along the two main arbors almost identical, symmetric four - beam structure that embeds a double - sides interdigitated differential capacitive with puckered beam in two directions was used as sensitive component. in addition, the differential capacitive accelerometer fabricated by bulky silicon micromechanical technique has high sensitivity, wide measurement scope, less nonlinear error, and simple converting circuit. then, the structure parameters of the sensitive component were calculated and stimulated, which results in a set of the optimized structure design parameters, main fabrication procedure and several key fabrication technology

    為使二維振動傳感器在兩主軸方向的靈敏度大致相同，敏感元件採用高度對稱的四梁結構，其中每個軸向上均採用帶折疊梁的雙側叉指電容結構，採用體硅微機械工藝製作的高深寬比叉指電容式敏感元件，具有高靈敏度、寬量程、非線性誤差小、外圍電路簡單等優點;對設計的敏感元件結構參數進行了計算，並利用有限元法進行了模擬分析，根據模擬結果得出了優化參數;在確定敏感結構的基礎上，研究了敏感元件採用體硅微機械加工工藝製作的工藝流程和關鍵工藝技術;對敏感晶元內部的c - v介面電路進行了原理設計與分析，利用差動測量技術得到由振動引起的微小電容變化量，經c - v介面電路進行相位調制處理，然後通過解調輸出與加速度成正比的電壓信號。
  18. Ningbo foryard optoelectronics co., ltd. is a manufacturer specialized in led area in china, located in ningbo jiangdong hi - tech park

    寧波復洋光電有限公司生產的led顯示屏，採用高品質的led原材料及晶元，利用先進的生產加工工藝，確保了產品的可靠性。
  19. With the development of semiconductor process technology, nowadays a system on a pcb ( printed circuit board ) which is composed of several ics can be integrated into a chip

    隨著集成電路製造工藝的飛速發展，人們已經可以將原先用各種電路搭建的板極系統集成在一塊晶元上。
  20. The electrophoretic microchip fabricated by mems technology is successfully used to finish the electrophoresis process

    摘要微晶元電泳是基於微機電加工技木（ mems ）工藝，在晶元上的微管道中完成電泳檢測過程的新型技術。
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