晶元粘著板的英文怎麼說

中文拼音 [jīngyuánniánzhāobǎn]
晶元粘著板英文
chion board

  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : 粘動詞(粘附) glue; stick; paste; adhere to; bond
  • : 著助詞1. (表示動作的持續) 2. (表示狀態的持續) 3. (用在動詞或表示程度的形容詞後面, 加強命令或囑咐的語氣) 4. (加在某些動詞後面, 使變成介詞)
  • : Ⅰ名詞1 (片狀硬物體) board; plank; plate 2 (專指店鋪的門板) shutter 3 [音樂] (打拍子的樂器) ...
  • 粘著: stick together; adhere;bond;agglutination; [工業] adhesion粘著力 adhesion force; 粘著強度 adhesio...

※中文詞彙晶元粘著板在字典百科國語字典中的解釋。

  1. The leec biochip can be connected with pcb ( printed circuit board ), thus it can generate a moving electric field by changing time, scope and field intensity discretionarily under single chip processor ' s control. meanwhile it is probable to reduce driving voltage and decrease temperature greatly, and so increase resolution of dna separation

    研究內容包括線性分散式電極陣列的理論設計,以普通載波片和有機高聚物pdms ( polydimethylsiloxane )為基本材料的製作工藝, leec和pcb的連接方式,硬體控制系統的設計以及控制工作的單片機程序編制等,此外還包括電化學檢測方法的研究。
  2. Moving stiffness analysis on the parallel bonding mechanism of ic chip die

    片機並聯焊頭機構的動剛度分析
  3. The author advances that the shear connector is simulated by two spring elements, which are vertical to each other and parallel to the interface between steel and concrete, and one multipoint constraint element, mpc element, which is vertical to the interface. the author also puts forward that the crack of the deck is simulated by the gap element which ca n ' t support longitudinal tensile force but can support longitudinal compressive force

    提出了以正交的兩個平行於鋼和混凝土界面的彈簧單及一個垂直於界面的多點約束( mpc )單來模擬剪力鍵,以小間隙接觸( gap )單來模擬混凝土橋面的開裂,模型中忽略了混凝土與鋼梁接觸面間由摩阻而產生的力。
  4. It is wildly used to squeeze the adhesive fluid in a syringe onto boards or substrates with the pressurized air for wafer or substrate bonding

    它利用某種方法將一定量的接劑擠壓到基或基片上,以實現和基之間的接。
  5. While the chips are attached to near center or near a edge of subatrate, the mean, deviation and maximum are at the almost same level ; when the chip is attached near a corner, the deviation and the maximum is far larger than those of the above two positions ; during thermal treatment followed, the residual stress demonstrates a regular cycle trend when the chips are attached near center or edge of the substrate and fluctuates in a wide range when the chip is attached near a corner

    貼在基中心和靠近基邊緣的位置時合劑固化后殘余應力的平均值、最大值和數值的分散性皆處于相接近的水平,而當貼在基靠近一角的位置時應力分佈狀況則有很大不同:應力的分散性增大,應力最大值也遠大於貼于另外兩個位置時的值。
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