晶圓 的英文怎麼說

中文拼音 [jīngyuán]
晶圓 英文
mpw
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  1. September 8, 2007, intel broke ground on its first 300mm wafer fabrication facility in asia

    2007年9月8日，英特爾在亞洲的第一座300毫米晶圓工廠大連晶元廠破土奠基。
  2. In the wafer - cycle fitting algorithm, comparing with circumgyration radius approach, track fitting approach, and least square circle fitting approach. in the wafer pre - alignment system, the wafer square fitting algorithm - least square circle fitting approach, based on optical linear ccd sensor, as well as the theoretical error analyze of this algorithm

    在晶圓檢測演算法方面，比較回轉半徑法、軌跡擬合法以及最小二乘圓法，選擇光學線陣ccd的晶圓圓心最小二乘圓法作為系統晶圓圓心的檢測方法。
  3. Screen printing technology for solder ball flip chip for smt

    倒裝晶元及晶圓和基底凸起的網版印刷技術一
  4. Hot plate with silicon wafer lowered to heating position

    加熱板與矽晶圓降低至加熱位置。
  5. Hot plate with silicon wafer in initial configuration ( before heating )

    加熱板與矽晶圓在啟始狀態（加熱前） 。
  6. A beam of light ( typically ultraviolet light from a mercury arc lamp ) shines through the chromium mask, then passes through a lens that focuses the image onto a photosensitive coating of organic polymer ( called the photoresist ) on the surface of a silicon wafer

    一束光（通常是汞弧燈發出的紫外光）先穿透鉻光罩，然後通過透鏡把影像聚焦在晶圓表面的有機高分子感光塗料（稱為光阻劑） 。
  7. One of the most important advancements recently for electroglas has been in gaining greater control over the z direction of the wafer prober, which affects the accuracy and impact force of touchdowns on wafers and enables their customers to effectively test even the most recent types of delicate devices

    其中伊智公司最近最重要的一個進步就是：實現了對于晶圓探針臺z方向的更大程度的控制，這直接影響到探針接觸晶圓的精確性和沖擊力，為客戶提供了高效率的測試；即使是最新型的精細器件。
  8. Profilometer - a tool that is used for measuring surface topography

    表面形貌劑-一種用來測量晶圓片表面形貌的工具。
  9. Measurement challenges for on - wafer rf - soc test

    晶圓上測試射頻系統級晶元的挑戰
  10. Upon its establishment tera xtal managed to recruit the top technical personnel in crystal growth and wafer processing fields. their first mission was to manufacture the lithium tantalate crystal substrate for the rf saw filters used in the wireless applications

    凝聚國內長晶及晶圓加工等技術第一流菁英共同組成的經營團隊投入創業，半年來最主要的課題就是在最短的時間內生產出無線通訊器材內射頻表面聲波濾波器
  11. Total indicator reading ( tir ) - the smallest distance between planes on the surface of the wafer

    總計指示劑數（ tir ） -晶圓片表面位面間的最短距離。
  12. Tera xtal manufactures a variety of oxide single crystal wafers for wireless communication, opto - electronic and light emitting diode ( led ) applications

    兆晶製作多樣的氧化物晶圓以提供無線通訊、光電等產業應用。
  13. Employees at tera xtal take great pride on every wafer manufactured from our production line as they represent our dedication towards quality excellence and teamwork

    專注于品質上的優越與團隊精神是全體兆晶員工緻力于每一片晶圓產出過程中所引以為傲的。
  14. Our extensive wafer manufacturing expertise qualifies us to provide wafer sub - contract services for a wide variety of crystal materials. ingot slicing and grinding, wafer lapping and polishing are process we can provide on a sub - contract basis

    我們淵博的晶圓製造專業為晶體材料同業提供多種晶圓代工服務。項目包括晶棒切割與成型、晶片研磨與拋光。
  15. Building directly on these 2 - d technologies, we have made 3 - d circuits by coating standard silicon wafers with many successive layers of polysilicon ( as well as insulating and metallic layers ), polishing the surface flat after each step

    利用這些傳統的二維晶片技術，我們已做出三維電路：在標準的矽晶圓上，連續鍍上好幾層的多晶矽及絕緣層與金屬層，每一層鍍完后，都磨光晶圓表面。
  16. Edge profile - the edges of two bonded wafers that have been shaped either chemically or mechanically

    邊緣輪廓-通過化學或機械方法連接起來的兩個晶圓片邊緣。
  17. Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials

    蝕刻-通過化學反應或物理方法去除晶圓片的多餘物質。
  18. Edge exclusion area - the area located between the fixed quality area and the periphery of a wafer. ( this varies according to the dimensions of the wafer

    邊緣排除區域-位於質晶和區證保量圓片外圍之間的區域。 （根據晶圓同不寸尺的片而有所不同。 ）
  19. This work is partially supported by the high technology research and development programme of china

    本課題來源於國家高技術研究發展計劃（ 863計劃）課題:掩膜管理和晶圓處理系統的研究。
  20. Wafer sheet hot blow

    對晶圓黏膠片吹熱風
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