晶性熱塑塑膠 的英文怎麼說
中文拼音 [jīngxìngrèsùsùjiāo]
晶性熱塑塑膠
英文
crystalline thermoplastics-
It has exact processing and heat treatment gate bushing, the part of heat can be delivered to the steel around the gate which make the plastic just enter wouldn ' t be frozen so quickly. it applies to crystalline materials
帶精確加工及熱處理的一體澆口司，能傳遞部分熱量至澆口區域的金屬，使得剛一進入型腔的塑料不至於迅速凝固，適于快速凝結的結晶性塑膠。Tip point nozzle will leave minor point mark on the surface of products. it has plastic cement heat insulations. it applies to all of plastic materials
點澆口熱咀，在產品表面留下極小的點狀澆口痕跡。熱咀前端有隔熱層，適于非結晶性及半結晶性塑膠The crystal is applied to the papermaking that can raise whiteness and non - transparency, remains - proportion of the crystal is higher than the usual light calcium carbonate. as for plastics, it can improve impact strength in the plastics, its inhibiting - burning capability is advancing bigger than the common inhibiting - burning material of magnesium hydroxide. concerning the thermo tropic adhesives, the physical property of compound - packing is higher than the one of single - packing, namely remover strength, softening point, hardness, climate tolerance and the speed of consolidation are high
晶須作為造紙填料，可使紙張的白度和不透明度提高，留著率比造紙常用填料輕質碳酸鈣高；用作塑料填料，可使塑料的沖擊強度提高，阻燃性能比常用阻燃材料氫氧化鎂有較大的提高；添加到熱熔型膠粘劑中，與輕質碳酸鈣混合使用可明顯提高熱熔膠的剝離強度、軟化點、硬度、耐侯性以及固化速度。In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows
論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。分享友人