晶粒流向 的英文怎麼說

中文拼音 [jīngliúxiàng]
晶粒流向 英文
grain flow
  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : Ⅰ名 (小圓珠形或小碎塊形物) small particles; grain; granule; pellet Ⅱ量詞(用於粒狀物)
  • : Ⅰ動1 (液體移動; 流動) flow 2 (移動不定) drift; move; wander 3 (流傳; 傳播) spread 4 (向壞...
  • 流向 : flow direction流向測量器 flow direction probe; 流向角 [水文] angle of current; 流向圖 flow graph;...
  1. For electrodeposition by dc methods, the metals deposite uninterrupted and the particles were also embeded uninterrupted into the coatings ; for electrodeposition by pc method, the particles with biggish volume were desorbed from the coatings and returned to the electrolyte again owing to the presence of pulse interval ; for electrodeposition by prc method, the particles carried positive charges are much more easy to desorb from the coatings owing to the effecf of reverse pulse current combined with pulse interval, in addition, the reverse pulse current also could dissovle the metals, further accelerates the desorption of particles, thus the particles size embeded in the coatings by prc method is the least

    電沉積時,基質金屬的沉積連續進行,子在電極表面不間斷嵌入鍍層;單脈沖電沉積由於脈沖間歇的存在使得具有較大體積的子會脫附,重新回到溶液中;採用周期換脈沖時,反脈沖電使表面荷正電的較大的子更易從電極表面脫附,同時,反脈沖電對基質金屬的溶解作用,也會促進子的脫附,因此鍍層中復合子尺寸最小。隨著鍍層中子復合量的增加,三種鍍層的都明顯細化,說明al _ 2o _ 3的存在阻止了的長大,提高了電沉積過程中核的形成速率。
  2. The quality of buffer layer and thin films was analyzed by afm, xrd, rheed and xps respectively. the effect of the experimental parameters such as carbonization time, working pressure, c source gas flow rate, carbonization temperature, different carbonization gas and substrate on the carbonization process was studied firstly. it was observed that the size of particles was increased with the increase of carbonization time and the rms was opposite, but the trend was reduced while the carbonization time was long enough ; the size of particles was increased with the increase of working pressure too, and choosing a proper working pressure could get a smooth surface ; the size of particles was unobviously changed while the gas flow rate was low, but it was notability increased with the increase of gas flow rate while the gas flow rate was high enough, and a smooth surface could be also obtained by choosing a proper gas flow rate ; with the increase of carbonization temperature, the size of particles was increased, the rms is decreased and a good single - crystalline carbonization layer could be obtained, but a rough surface was formed at a excessive high temperature ; the rms of

    對于碳化工藝,側重研究了碳化時間、反應室氣壓、 c源氣體的量、碳化溫度以及不同種類的c源氣體、基片取等因素對碳化層質量的影響,研究結果表明:隨著碳化時間的增長,碳化層的尺寸隨之變大,表面粗糙度隨之降低,但當碳化到一定時間之後,碳化反應減緩,碳化層的尺寸以及表面粗糙度的變化幅度變小;碳化層的尺寸隨反應室氣壓的升高而變大,適中的反應室氣壓可得到表面比較平整的碳化層;在c源氣體的量相對較小時,碳化層的尺寸隨氣體量的變化不明顯,但當氣體量增大到一定程度時,碳化層的尺寸隨氣體量的增大而明顯變大,同時,適中的氣體量得到的碳化層表面粗糙度較低;碳化溫度較低時,碳化層的不明顯,隨著碳化溫度的升高,碳化層的尺寸明顯變大,且有微弱的單出現,但取較差,同時,適中的碳化溫度可得到表面平整的碳化層;相比于c _ 2h _ 2 ,以ch _ 4作為c源氣體時得到的碳化層表面平整得多;比起si ( 100 ) ,選用si ( 111 )作為基片生長的碳化層的一致性明顯更好。
  3. It can be noticed that both r and t specimens show initial hardening and subsequent softening at the strain amplitude higher than 0. 8 % and cyclic softening from the beginning to fracture under strain amplitude less than 0. 8 % at room temperature, and the cyclic flow stress was always lower in r specimen than in t specimen at the same strain range

    且在相同的應變幅下, t試樣比r試樣具有更高的循環變應力。此外,對r及t試樣,低應變幅下呈現出循環軟化現象是因為旋轉導致循環軟化;而在高應變幅下發生循環硬化是由於孿作用的結果。
  4. Professor hongkai wu was born in 1978. after receiving his b. s. and m. s

    研究方為微元和微膠的制備及應用。
  5. Carrier will be capture by trap, the number of electric carrier will decrease. the trap hold back carrier to move from crystal to other crystal. it influences the electrical properties of tft

    陷阱在浮獲載子之前是電中性的,但是在俘獲載子之後就帶電了,在其周圍形成一個多子勢區,阻擋載子從一個另一個運動,導致載子遷移率下降,導致tft的電學性能下降。
  6. The flux of n2o greatly affected the film ' s microstructure. as the n2o flux was increased, the content of anatase decreased and rutile increased gradually. the size of rutile became smaller with increase of the flux of n2o

    摻雜劑n _ 2o的量對薄膜的結構有很大影響,隨著量的增大,銳鈦礦相tio _ 2逐漸金紅石相轉變,金紅石體的顆尺寸也不斷減小。
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