未酯化的 的英文怎麼說

中文拼音 [wèizhǐhuàde]
未酯化的 英文
nonesterified
  • : Ⅰ副詞1 (沒) did not; have not 2 (不) not Ⅱ名詞1 (地支的第八位) the eighth of the twelve ear...
  • : 名詞[化學] (有機化合物的一類) ester
  • : 4次方是 The fourth power of 2 is direction
  1. The influence of catalyst on the copolymerization of epoxy and cyanate was investigated, and the mechanism of their copolymerization was discussed. the catalyst can obviously accelerate the curing of the resin to decrease the curing temperature. the three kinds of reactions ( cyclotrimerization, co - reaction and polyetherification ) in their copolymerization are not simultneous and independent to each other. in the lack of cyanate functional group, the main structures are oxazoine and polyether structure in the cured resin, and the triazine ring structure is of miner importance

    研究了催劑對環氧樹脂與氰酸樹脂共聚固反應行為影響,並初步探索氰酸/環氧固反應歷程.研究表明,催劑能明顯地促進其固反應,降低固溫度,縮短固時間;氰酸與環氧共聚反應歷程是首先氰酸三聚反應生成三嗪環結構,然後三嗪環開環與環氧共聚反應,最後是能參與共聚反應環氧官能團在唑啉結構和三嗪環下發生聚醚反應;在氰酸官能團欠量條件下,固樹脂中主要是唑啉和聚醚結構,而三嗪環結構含量很少
  2. Glycolipids ( glycosyldiacylglycerols ) are diacylglycerols with a sugar attached to the unesterified hydroxyl group

    類物質是由甘油二和糖結合未酯化的羥基形成
  3. There were 29 fat soluble constituents identified of which fatty acid methyl esters made up 99. 32 % ( 12. 36 % saturated fatty acid methyl esters and 86. 96 % unsaturated fatty acid methyl esters ) and 13 constituents had not been previously reported in other studies

    共鑒定29種脂溶性成分,其中脂肪酸甲產物佔99 . 32 % (其中飽和脂肪酸甲為12 . 36 % ,不飽和脂肪酸甲為86 . 96 % ) , 13種成分在火麻仁脂溶性成分研究中見報道。
  4. Graft copolymerization of methyl methacrylate onto carboxymethyl chitin was carried out by stirring quickly and no emulsifier, without emulsifier made the products more pure

    摘要通過高速攪拌,使用乳劑,制備了羧甲基甲殼素和甲基丙烯酸甲接枝共聚物,避免了產物中引入乳劑雜質。
  5. Materials for printed boards and other interconnecting structures - part 2 - 10 : reinforced base materials clad and unclad - cyanate ester, brominated epoxide, modified or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製電路板和其它互連結構用材料.第2 - 10部分:包覆和非包覆增強基材.規定可燃性銅包改性改性氰酸環氧編織e型玻璃纖維增強層壓薄板
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