板上封裝 的英文怎麼說

中文拼音 [bǎnshàngfēngzhuāng]
板上封裝 英文
cob
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  • 上 : 上名詞[語言學] （指上聲） falling-rising tone
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Up - down bisection is an arc, horizontal type. innovative insert plates and fixing bolts are used to fix and seal fosc, and its installation is quite simple

    光纜接頭盒外形按弧線型臥式結構設計，上下對開，整體採用創新的插板卡緊結構和少量螺釘固定密封，安裝極為方便。
  2. Series full - auto pipe expander with drawing device and program interface is used with extruding machine. it is also used solitarily, while expanding pipes, the machine adopts translation, the action is steady and corret, it does not damage pipe materical, the machine adoptes double - infrared heating oven type, each oven is equipped with heating cire, the shaping method adopts expanding - end shaping, the size of pipe mouth is correct. on its panel, there is a transfer swith of expanding solvent type pipe socket ( straigh port ) and expanding sealloop type pipe socket ( rport ). the choice of expanding pipe type is very convenient, the technologocal adaptability is strong, its main electric control elements are all imported. the syetem charecteristics are steady and reliable

    配有與主機配套的接料牽引裝置和相應的程序介面，既能與擠管主機聯線使用，又可以作單機使用；擴管時管材的移動均採用平移方式，動作平穩準確而且不易損傷管材；這種機型採用紅外線加熱方式且為雙加熱爐型，每個加熱爐都配有中心加熱爐芯；成型方式均採用擴管頭定型方式，管口成型尺寸準確；該機型在控制面板上設有擴溶劑型承介面（直口）和擴彈性密封圈型承介面（ r口）的轉換開關，擴管方式選擇十分方便，工藝適應性強；主要的電器控制元件均採用進口元件，系統性能穩定可靠。
  3. In this paper, a high performance sma system applied to steel bridge deck is put forth in allusion to the pavement project of the wuhan junshan yangtze river highway bridge. it comprises steel slab, zn coating layer, closing layer, adhesive, pre - mixed asphalt stone and dual layer sma from bottom to top. it is based on the fea results of the forces and deformation of the pavement layer by means of the algor feas, according to this bridge ' s traffic and the ambient temperature varying range of the pavement layer

    本文針對武漢軍山長江公路大橋鋼箱梁橋面鋪裝工程，從鋪裝層環境溫度變化范圍、交通量等使用條件出發，在用algorfeas有限元分析軟體分析鋪裝層受力變形基礎上，提出了（即鋼板+金屬鋅塗層+封閉層+粘接劑+預拌瀝青碎石+雙層sma ）的高性能鋼橋面sma鋪裝體系，並對這種sma的組成材料，包括改性瀝青、集料、礦粉、纖維進行了比較研究，設計了這種sma的配合比，對sma混合料的性能進行了對比試驗，對這種sma方案進行了疲勞性能研究，驗證了所選擇sma方案的可行性。
  4. 2 all light fixtures shall be installed with safety glass panel cemented and sealed to the hood roof

    照明裝置上面有安全玻璃面板，並且和櫃體密封。
  5. Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design

    本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。
  6. It is not sure that the improvement is also fitted to the other items. but basing t he study, it is obvious that if all the reagent bottles of any item reagent kit can provide enough reagent for its dual - plate test, the improvement can be used to double the test samples

    而與autodelfia1235相配套的其它單微孔板封裝藥盒，是否也可採用該方案，實現一次上機檢測標本量的翻倍，還必須對這些藥盒各類實驗試劑的具體用量，進行定量分析和評估。
  7. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  8. Bsp supplies the simple interface to operate the peripheral chips conveniently. thus, real - time operating system ( rtos ) can start up from the various hardware successfully and response to the asynchronous event opportunely. on the other hand, rsp implements the encapsulation to rtos and brings up the process model according to the running character of the business layer, realizes the secondary process schedule inside task

    一方面，支撐子系統bsp層（板級支撐包）的設計實現了對硬體層的封裝，這包括對cpu （ mpc8241 ）的封裝和對外部晶元（串口、網口等）的封裝，通過這層封裝使得實時操作系統能夠成功啟動，及時響應異步事件，實現了硬體的基本功能，並且為上層提供了簡單易用的操作晶元的介面，隔離了軟體對硬體功能要求所必需的具體細節。
  9. In the early stage of experiment, an in - material thin film manganin gauge was studied. this in situ gauge was manufactured by single - step thin film processing, namely, manganin piezoresistance element was prepared on inorganic substrates such as ceramic, microcrystalline glass, etc by sputtering

    在實驗的初期，本文還研究了「在位式」的錳銅薄膜傳感器，即首先在陶瓷或微晶玻璃基板上沉積錳銅敏感元件，然後用粘貼ptfe薄膜的方法完成傳感器的封裝。
  10. 1. the manganin ultra - high pressure sensors for gas gun were made by two - step thin film techniques, namely, manganin thin films were first deposited by magnetron sputtering on a12o3 substrates, and then covered by a layer of a12o3 thin films by electron beam evaporation

    首次採用全薄膜化工藝製作氣炮用錳銅超高壓力傳感器，即首先在絕緣基板上沉積錳銅敏感薄膜，然後再在敏感膜的上面沉積絕緣封裝薄膜。
  11. He had not finished the sentence, but looked about the mean little room and let his eyes dwell sadly upon a heap of returned manuscripts, still in their long envelopes, which lay in a corner on the floor

    話還沒說完，他回頭看了看那間寒傖的小屋，目光落在一堆退稿上，裝在長信封里的份份退稿躺在地板角落山地里。
  12. Although the highest pressure in copper target was 107 gpa and that in alumina packaging was in the vicinity of 70 gpa, the gauge records showed a good plateau of about 1 um in duration and absence of shunt

    實驗中銅靶板上的最大壓力達到了107gpa ，氧化鋁封裝中的壓力也達70gpa以上，薄膜式錳銅計輸出的信號波形完整，壓阻信號的平臺持續時間長，無明顯的旁路存在。
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