標準集成電路 的英文怎麼說

中文拼音 [biāozhǔnchéngdiàn]
標準集成電路 英文
hex buffer
  • : Ⅰ名詞1 [書面語] (樹梢) treetop; the tip of a tree2 (枝節或表面) symptom; outside appearance; ...
  • : Ⅰ名詞1 (標準) standard; guideline; criterion; norm 2 (目標) aim; target Ⅱ動詞1 (依據; 依照)...
  • : gatherassemblecollect
  • : Ⅰ動詞1 (完成; 成功) accomplish; succeed 2 (成為; 變為) become; turn into 3 (成全) help comp...
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : 1 (道路) road; way; path 2 (路程) journey; distance 3 (途徑; 門路) way; means 4 (條理) se...
  • 標準 : (衡量事物的準則; 榜樣; 規范) standard; criterion; benchmark; pip; rule; ètalon (衡器); merits
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit (ckt); electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. This paper aims at investigating and realizing an asic cell of high performance instrumentation amplifier based on the standard cmos process, which is employed in the readout circuits of microsilicon sensor as a part of soc

    本文的主要目的是研究並採用cmos工藝實現一種高性能的儀表放大器專用模塊,該模塊專用於容式微硅傳感器的一種soc模式讀出中。
  2. Standard test method for estimating electromigration median time - to - failure and sigma of integrated circuit metallizations metric

    金屬噴鍍總量和遷移中值失效時間的評定試驗方法
  3. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of integrated circuits

    半導體裝置的機械化.略圖繪制的一般規則
  4. Mechanical standardization of semiconductor devices - part 3 : general rules for the preparation of outline drawings of integrated circuits

    半導體器件的機械化.第3部分:略圖制備的一般規則
  5. Visual inspection criteria for integrated circuits metal packages

    金屬外殼目檢
  6. The sekotan shipbuilders then custom - engineered an elegant craft from the seed partners, rare organoform circuits and standardized technology

    賽寇特造船工便用這些種子拍檔定做了一艘優雅的船,極少化技術。
  7. With the rapid development of semiconductor, digital integrated circuit ( p, memory, standard logic gates, etc. ) and advance computer technology, the various measuring instruments ( virtual instruments ) with the powerful function of pc are produced in different industrial and scientific research fields. as we all known, the traditional instruments are usually built with discrete components and small scale ics, the disadvantages are obvious in system design, debugging and maintenance

    隨著半導體技術與數字(微處理器、存貯器以及邏輯門等)技術的迅速發展,特別是隨著計算機技術的發展,在工業生產和科學技術研究的各行各業中,人們利用pc機的強大處理功能代替傳統儀器的某些部件,開發出各種測量儀器(虛擬儀器) ,傳統儀器的數字邏輯部分多是採用分立( ic )組,分立ic愈多,給系統的設計、調試及維護帶來諸多不便。
  8. Delay and power calculation standards - pre - layout delay calculation specification for cmos asic libraries

    延遲計算和功率計算. cmos子程序庫.預布局延遲計算規范
  9. In the meantime, the all sub - circuits are also designed and emulated carefully including inverter, rs type flip - flop, voltage reference circuit, error amplifier, voltage comparator, sawtooth - wave generator, pwm comparator, soft activation circuit and so on. as a result, all of the sub - circuits answer the requirements. this chip has taped out with the 0. 5um mix - signal process of csmc

    本文利用cadenceeda設計工具、 spectres模擬工具,對內的各個模塊包括反相器、基本rs觸發器、基、誤差放大壓比較、鋸齒波振蕩發生、 pwm比較、軟啟動、驅動等進行了具體的設計和模擬,且達到了預先設定的指
  10. Provide emi / rfi shielding and esd control for pcb assemblies

    達到emi / rfi屏蔽,為和印刷板提供可靠的靜防護,避免損害
  11. Standard guide for transient radiation upset threshold of digital integrated circuits

    數字的瞬時輻射固定閾的指南
  12. Subcircuit models are designed and simulated, which includes bias current source, voltage reference, error amplifier, pwm comparator, driver circuit, protection circuits for over - temperature, over - current. at last, combined with periphery component, the circuit is simulated, and the result meets the anticipant requirement

    並對內的各個模塊包括流偏置、基、誤差放大、三角波振蕩發生、 pwm比較、驅動、過熱保護和過流保護等進行了具體的設計和模擬,並對整體應用進行了模擬,結果均達到了預先設定的指
  13. Tab mechanical standardization of semiconductor devices - part 5 : recommendations applying to tape automated bonding of integrated circuits

    半導體器件的機械化第5部分:用於載帶自動焊
  14. Industrial automation systems and integration - product data representation and exchange - implementation methods - standard data access interface

    工業自動化系統和.產品數據表示和交換.實現方法.數據存取介面
  15. F - theta lens is one of the most important parts of laser scanning system, and has been widely used in many equipments with high precision, such as laser marking machine, missile tracking and aiming, laser printer, faxes, biochip test and so on

    F - theta鏡頭是激光掃描系統中必不可少的重要組部分,已廣泛應用於打機、導彈跟蹤瞄、激光印表機、傳真機激光圖形發生器和生物晶元檢測儀[ 1 ]等精密設備中。
  16. A hierarchical quality metric model for ip module is proposed in this dissertation. a framework and basic methodology of the ip quality metric standard are provided based on the model

    設計領域內,首次提出了層次化的ip質量評測模型,並據此建立了ip質量評測的框架和基本思
  17. Semiconductor devices - integrated circuits - part 5 : semicustom integrated circuits

    半導體器件..第5部分:半非標準集成電路
  18. Darlington driving ic cl2003 is no ready - made technical process to match because of its upper voltage and power

    達林頓驅動cl2003因為其工作許可壓較高,功率較大,沒有現工藝流程匹配。
  19. With the development toward sub - micron and deep sub - micron technologies, cmos will have extremely wide market prospects, because its low cost and easy of implementation. hence all the simulation of this paper uses the csmc 0. 6 m standard cmos process

    cmos工藝作為數模混合的主流工藝,隨著cmos技術的發展,具有廣泛的市場前景,本文就是在在csmc0 . 6 mcmos工藝庫下進行模擬的。
  20. Delay and power calculation standards - integrated circuit delay and power calculation systems

    延遲計算和功率計算.延遲計算和功率計算系統
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