機械膠粘 的英文怎麼說

中文拼音 [jīxièjiāonián]
機械膠粘 英文
mechanical adhesion
  • 機 : machineengine
  • 械 : 名詞1. （器械） tool; instrument 2. （武器） weapon 3. [書面語] （枷和鐐銬之類的刑具） fetters, shackles, etc
  • 膠 : Ⅰ名詞1 （某些具有黏性的物質） glue; gum 2 （橡膠） rubber 3 （姓氏） a surname Ⅱ動詞（用膠粘） st...
  • 粘 : 粘動詞（粘附） glue; stick; paste; adhere to; bond
  • 機械 : 1. （利用力學原理組成的各種裝置） machinery; machine; mechanism 2. （死板; 刻板） mechanical; inflexible; rigid
  1. The juncture of between two boards of the flume box was agglomerated ( ) with stickiness first. then the top and the bottom board of the box were tighten with bolts

    水槽式加熱器箱體兩板間的連接首先用粘補膠粘接，然後在箱體的四周用螺絲連接，確保機械強度和密封性能。
  2. Clays are produced by mechanical and chemical weathering and primarily colloidal in size.

    粘土是由機械和化學的風化作用形成，主要是膠粒大小。
  3. Woodworking machines. crosswise veneer splicing machines. nomenclature

    木材加工機械.交叉膠合板粘接機.術語
  4. Woodworking machines - nomenclature for crosswise veneer splicing machines

    木工機械.第31部分:交叉膠合板粘接機命名
  5. It can implement emulsion breaking, dehydration and remove water, soap, acid, color and metal particulate in emulsive turbine oil and low - viscosity lubricating oil as well as filtration of hydraulic transmission oil and antiwear hydraulic oil in machinery, turbine oil of electric equipment

    能對嚴重進水混濁乳化的透平油低粘度潤滑油進行破乳脫水，除去油中水分皂類膠質酸質色素及金屬微粒等機械雜質，使乳化狀油液變清澈。
  6. The glass adherence craft has avoided the temperature, humidity, machinery fatigue and medium to the glue water and material influence, and then improved the sensor long - term stability in the industry ambient, in the meanwhile also avoided the sensor p - n effect phenomenon that appeared in the traditional micro machining operation manufacture process

    玻璃粘接工藝避免了溫度濕度機械疲勞和介質對膠水和材料的影響，從而提高了傳感器在工業環境中的長期穩定性能，同時也避免了傳感器在傳統微機械加工製造工藝過程中出現的p - n結效應現象。
  7. Standard test methods for establishing allowable mechanical properties of wood - bonding adhesives for design of structural joints

    確定結構連接設計用木材膠粘劑允許機械性能的標準試驗方法
  8. Field test procedure for determining the mechanical uplift resistance of insulation adhesives over various substrates

    測定各種襯底上方絕緣膠粘劑抗機械提升力的現場試驗過程
  9. The development in the adhesion between the polymer cords such as rayon, nylon, polyester, and aramid, to rubbers were reviewed from aspects of adhesion test and analysis, fiber and adhesives interface, dipped cord and rubber interface and the mechanical properties of resorcinol formaldehyde latex adhesives

    摘要從測試與分析方法、纖維與粘合劑的界面粘合、浸膠簾線與橡膠的粘合、間苯二酚甲醛膠乳浸膠層的物理機械性能等方面總結了人造絲、尼龍、聚酯和芳香聚酰胺等聚合物簾線與橡膠的粘合方法及最新進展。
  10. Rubber components often appear interface failure due to the actions of mechanical loads and the influences of enviorment. hence, in this paper the interface failure mechanism has been studied by means of finite element method and fracture machinics. the numerical results of testpieces deformation with crack are in close agreement with experimental values

    橡膠鋼雙材料試件由於機械載荷和環境的影響經常在粘接界面發生破壞而導致結構失效，藉助有限元和斷裂力學對界面破壞機理進行研究，得到的存在初始裂紋的試件變形與實驗結果吻合較好。
  11. Adhesives for floor covering - requirements for mechanical and electrical performance

    地板覆蓋物用膠粘劑.機械性能和電氣性能的要求
  12. At presentproduces the mechanical variety includes : becoming spongy machine, pingqie machine, turns on lathe cutting machine, the punching machine, sets up cutting machine, the flame assembly, the gummy assembly, thebreaker and so on

    目前生產的機械品種有：發泡機、平切機、旋切機、打孔機、立切機、火焰復合機、膠粘復合機、破碎機等。
  13. Standard practice for determining the adhesion of print media utilizing mechanical stress : two different test methods - score tape and cross hatch

    利用機械應力測定印刷媒體粘著性的標準規程:兩種不同的試驗方法.劃痕膠帶法和斷面線法
  14. Abstract : this paper introduces a new class f epoxy glass - cloth laminate. the synthesis of a epoxy adhesive and the production process were studied. the properties of the laminate were compared with those of some similar products abroad. the results show that the laminate has higher adhesive strength 、 resistivity in moist conditions 、 dielectric strength and mechanical strength in higher temperatures. it is applicable for electric equipments, especially those to run in higher moisture or higher temperature conditions

    文摘:本文介紹了最近開發成功的一種新型f級耐高溫層壓板，研究了環氧樹脂膠粘劑的合成，層壓板的製造工藝及其性能，並與國外同類產品進行了對比，結果表明，它具有粘接強度、浸水后絕緣電阻及耐電壓、高溫機械強度高等特性，可用作大型高壓電機、輸變電設備以及核電工程、低溫高真空工程中絕緣結構材料，尤其適用於高電壓、高溫、高機械強度的工作環境。
  15. 7. sodium chloride has slight effect on the heat of micropcm phase transition, but it easily leads microcapsules to stick together. for the microcapsules feeding more than 6 % sodium chloride in the emulsion, their super - cooling can be prevented availably ; however, their mechanical intensity and their thermal stabilities turn worse and they cohere each other

    7 、 nacl對微膠囊的相變熱影響較小，但容易造成微膠囊粘結；乳液中的naci濃度超過為6 %合成的微膠囊的過冷現象得到明顯改善，然而，膠囊的機械強度與耐熱性能均下降，微膠囊之間發生粘結。
  16. Laminin is not only the mainly structural molecule of extracellular matrix, but also the important signal molecule. laminin and collagen iv compose the net - structure of the extracellular matrix, given the tissue of elastic, tenacity, water - holding power, amortization of mechanical power, ect

    層粘蛋白與型膠原蛋白構成網狀的細胞外基質結構，賦予組織以韌性、彈性、保水性及對機械力的緩沖性，並為細胞提供生存及從事活動的微環境。
  17. Gongxing packaging machinery factory, affiliated to hu da industry co., ltd., specializes in producing coating machine, multi - layer laminating machine, slitting machine, rewinding machine, cutting machine, punching and stacking machine, fabric checking machine, and other related machine for various adhesive products and non - adhesive paper, cloth, leather and plastic materials

    工興包裝工業有限公司是東莞市一家集開發與生產於一體的專業機械製造企業，專門從事製造各種膠粘製品及無膠紙類、布類、皮革類、多種塑料製品類物料的上膠、多層貼合、分條、復卷、分切、沖型機械，並可生產相近專業機械。
  18. Standard practice for determining the adhesion of lamination films to prints utilizing mechanical stress : four different test methods - score tape, cross hatch, x - cut, and crease - folding

    利用機械應力測定疊層膠片和印刷品間粘性的標準規程:四種不同的試驗方法.劃線膠帶交叉影線x切割和折皺
  19. Low viscosity, cures at room temperature to a transparent gel, the cured gel state provides excellent mechanical cushioning and vibration damping for delicate electronic assemblies

    低粘度，室溫固化成透明凝膠，固化后的凝膠對于精密電子組件有著良好的機械緩沖和減振作用，且具有低溫性能。
  20. Mechanical standardization of semiconductor devices - recommendations applying to tape automated bonding of integrated circuits

    半導體器件機械標準化.第5部分:集成電路膠帶自動粘合推薦標準
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