溫度拋物線 的英文怎麼說

中文拼音 [wēndùpāowùxiàn]
溫度拋物線 英文
temperature hyperbola
  • 溫 : Ⅰ形容詞（不冷不熱） warm; lukewarm; hot; gentle; mild Ⅱ名詞1 （溫度） temperature 2 （瘟） acute ...
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  • 拋 : 動詞1. （扔; 投擲） throw; toss; fling 2. （丟下; 拋棄） leave behind; cast aside; abandon
  • 物 : 名詞1 （東西） thing; matter; object 2 （指自己以外的人或與己相對的環境） other people; the outsi...
  • 線 : 名詞1 （用絲、棉、金屬等製成的細長的東西） thread; string; wire 2 [數學] （一個點任意移動所構成的...
  • 溫度 : [物理學] temperature
  1. The relationship between the holding temperature and the average of the equal - area - circle diameter or the average of the roundness was parabolic

    而等溫溫度對最終球化組織的平均等積圓直徑和平均球化度的影響呈拋物線關系。
  2. It shows that the injection quantity and the difference of temperature distribute as a parabola which is at the same load, and the minimum of the parabola corresponds to the optimum quantity of injection ( g ). under the condition that the quantity of injected mass, the air speed and the heat quantity is respectively g, v and q, the research demonstrates that the pentium iv chip ' s temperature variation can be controlled under 40c and work normally when the wind speed overpass 1. 5m / s and the power dissipation of the chip is 60w. otherwise this paper calculates the flooding limit of thermosiphon with several different methods

    對其充灌量、散熱量、電子元件（ cpu模擬晶元）表面與環境溫度之差及通風、流速的影響進行了系統的測試，發現充液量與溫差的關系在負荷不變時呈拋物線分佈，其極小值點對應的充液量是最佳充液量g 。在充液量為g時，對風速v 、散熱量q進行的研究表明，當風速超過1 . 5m / s后，奔騰晶元在60w發熱條件下晶元溫度小於40 ，能滿足長期正常工作。
  3. A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours

    研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。
  4. The second one : we studied the effect of temperature on performance of lds. it was found that threshold current increase exponentially outpower and slope efficiency decrease parabola and exponentially respectively. coefficient of temperature shift is 0. 24 / k, wheras characteristic temperature also decrease with rise of temperature

    研究了溫度對激光器各參數的影響，隨著溫度的增加，閾值電流呈指數增加，輸出功率和斜率效率分別呈拋物線和指數關系遞減，同時特徵溫度也減少，波長隨溫度的漂移系數為0 . 24nm ，並且總結了一些溫度和結構設計方面的關系。
  5. On the basic of the detailed analysis on main causes and main prediction methods of casting shrinkage / porosity, we put forward two methods to describe the solid phase rate of materials solidification. one is liner - distributing method, and the other is parabola - distributing method. and then, we apply the former to the system

    本文在充分分析鑄件縮孔縮松產生機理與主要預測方法的基礎上，提出了材料凝固固相率的線性分佈法和拋物線分佈法，並將前者應用於系統中；同時提出了溫度梯度法和新山判據法的實現演算法，此演算法具有一定的靈活性。
  6. It was found that, the high - temperature oxidation of ni - fe alloy plating obeys parabola law. furthermore, the rate of oxidation increased with fe wt % and the temperature

    結果表明， ni - fe合金鍍層高溫氧化服從拋物線規律，氧化速度隨著鐵含量的增加而增加。
分享友人
分享到 Line

分享到臉書