灌封料 的英文怎麼說
中文拼音 [guànfēngliào]
灌封料
英文
potting compound-
New silicone flame retardant potting compound was prepared by blending of ltv silicone rubber as base gum with diluent, crystalline quartz filler, chain extension agent, crosslinking agent, inhibitor, carbon black and platinum catalyst
以中溫硫化硅橡膠（以下簡稱ltv硅橡膠）為基膠，混入稀釋劑、石英粉、鏈增長劑、交聯劑、阻聚劑、炭黑及鉑催化劑等組分，制得新型有機硅阻燃灌封料。Abstract : new silicone flame retardant potting compound was prepared by blending of ltv silicone rubber as base gum with diluent, crystalline quartz filler, chain extension agent, crosslinking agent, inhibitor, carbon black and platinum catalyst
文摘:以中溫硫化硅橡膠（以下簡稱ltv硅橡膠）為基膠，混入稀釋劑、石英粉、鏈增長劑、交聯劑、阻聚劑、炭黑及鉑催化劑等組分，制得新型有機硅阻燃灌封料。Development of organic silicon encapsulation
有機硅灌封材料的研究進展Encapsulation materials of expoy series for use in electronic components
電子元器件用環氧系灌封材料Morphology and mechanical properties of mg pu ep encapsulating composite
環氧灌封材料的形態結構與力學性能The material, technology and some questions on the encapsulation in current epoxy resin
環氧樹脂灌封料及其工藝和常見問題Progress in study on crack initiation in epoxy resin sealing compounds at low temperature and its measures
環氧灌封料低溫開裂問題及對策研究進展The effects of primary compounds on the property of the potting compound were studied and the optimum technological factors were determined
討論了其主要組分對灌封料性能的影響，並確定了最佳工藝條件。Manufacturer of electronic components and solutions for original equipment manufacturers in the telecom, multimedia, automotive and industrial control sectors
-生產各種環氧樹脂灌封料，主要應用高壓器件變壓器點火器led等電子器件。Uses : packing of high tension electrical equipment, expoxy pouring packing material, plastic pacing material, dry type transformer, high tension mutual inductance equipment, insulator
產品用途：高壓電器件的絕緣澆注料、環氧灌封料、塑封料、包封料、絕緣子、乾式變壓器、高壓互感器、填料等。Above year productive forces 10, 000 tons, variety specification complete, the versatility, mainly applies in the epoxy, fills seals the material, pours the material, the envelope anticipates the electronic electric appliance, the plastic, the coating, the printing ink, the building material, the silica gel, the tooth material, the ceramics, is fireproof, shi cai, the precision casting and so on as well as other chemical domains
年生產力1萬噸以上，品種規格齊全，用途廣泛，主要應用於環氧、灌封料、澆注料、包封料及電子電器、塑料、塗料、油墨、建築材料、硅橡膠、齒料、陶瓷、耐火、石材、精密鑄造等以及其它化工領域。The cbb90 capacitors are used for hight - frequency electricity circuit, having charcteristic of samll dimension, low disipation factor under hight - frequency condition, fine self - healing character, withstanding hight - voltage and powerful electricity. the case is used in flame retardant hith - quality engineering plastic, filled with epoxy resin
Cbb90型電容器主要用於電磁爐振蕩電路，適用於高頻電路中，具有耐高壓及耐大流的優良特性同時具有體積小、優良的自愈性能、安全性能高、高頻下低損耗等特點，外殼採用優質的工程塑料，用環氧樹脂灌封。Based on the over research, three different kinds of encapsulating materials of epoxy resin are performed
在各種不同制備方法研究的基礎上，選用不同的改性體系制備出環氧灌封材料，並對其性能作了評價。Test method for shrinkage stresses in plastic embedment materials using a photoelastic technique for electronic and similar applications
用光彈性技術測定電子及類似用途的塑料灌封材料的收縮應力的試驗方法Low viscosity, easily pourable potting material, with the ability to develop good adhesion to most substrates without the use of a primer, has a long working time and high temperature resistance, cure at elevated temperature
低粘度，易澆注的灌封材料，並在不需要底塗的情況下能獲得較好的粘接性，操作時間長，耐高溫，需加熱固化。Encapsulating materials of epoxy resin are modified with hgh, nano - sio2 and organophilic montmorillonite, in the present investigation, the microstructue, some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction, electron microscopy and differential thermal analysis measurement techniques
隨著航空、電子等事業的發展，灌封器件的高性能化對灌封材料提出了越來越高的要求。探索制備環氧灌封材料的新方法，尋求提高其使用性能的有效途徑是該領域研究的重要課題。This paper mainly described the research on rheological property, high thermal stability, flame retardant, the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials, which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要綜述了國內外用於電子元器件、大規模集成電路等高科技領域的有機硅灌封材料在流動、耐高溫、阻燃和絕緣導熱等方面的性能以及催化劑對灌封材料的影響的研究應用進展。Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved, but the the addition of hgh, the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected. nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin, impact strength reaches 27. 64kj / m2 from 13. 95 kj / m2, flexural strength reaches 136. 68mpa from64. 95 mpa. by addition of the montmorillonite, glass transition temperature and heat distortion temperature of the encapsulating materials are 13. 2 and 16 higher than that of epoxy re
結果表明，活性硅微粉對環氧灌封材料的熱變形溫度和電學性能提高較為顯著，尤其在浸水后，電學性能降低幅度很小，西北工業大學碩士學位論文但活性硅微粉用量較大，材料的工藝性能明顯降低;納米5102對環氧灌封材料具有顯著的增強和增韌作用，沖擊強度、彎曲強度由原來的13 . 95kj / mz和64 . 95mpa分別提高到27 . 64kjzm2和136 . 68mpa 。Polyurethane ( pu ) pouring sealant was synthesized with polymer h and modified isocyanate k as basic materials
摘要選用聚合物h和改性異氰酸酯k為主要原料合成聚氨酯灌封膠。After a lot of experiments, we have found the most appropriate material and the best proportion of the two components for the type of the high - voltage isolation optocouplers are found, and concluded some original creative operation processes and rules for encapsulation technique of the high - voltage isolation are concluded the author has done some deeply research in the field of the series of the high - voltage isolation optocouplers, enlarged the application of the optocoupler and
5 、對高壓隔離特性類光電耦合器的工藝製作、測試方法作了詳細的介紹;通過大量的實驗，找到合適的介質填充材料以及最佳的組分配比，制定灌封工藝操作詳細規范。目前，國外仍無該類型的器件面世，國內也沒有其它的單位在此領域有過或正在深入的研究。分享友人