( 2 ) design of the implantating device : some quantity of 316l stainless steel, perform forging and thermal rolling, drawing filament ( diameter 0. 4mm and 0. 23mm respectively ), enlacing and jointing, after that assembling the products into guiding filum, a technical examination was carried out to appraise their physical capability. the second part : experimental study : animal experiments were used to screen and observe its validity and security : under general anesthesia, tracheotomy was performed on the healthy dog, the bronchus was localized using x - ray fluoroscopy fibrobronchoscope and with the help of the implanting equipment, several niti alloy occludes were implanted into the target bronchus of the dogs through the biopsy channel in the fibrobronchoscope
（ 2 ）推送器的研製：取316l不銹鋼熱軋，分別拉製成不同直徑的不銹鋼絲分別用作製作內芯、外環及車制螺絲，再經纏繞、
焊接、裝配成推送器。對上述兩者進行技術鑒定。第二部分：支氣管
封堵器的實驗研究：四種形狀的
封堵器分四組（上述四種
封堵器各12隻）進行動物實驗，分別觀察其安全性與有效性。
Flux entrapped in the joints is the principal cause of low strength or failure.
裂縫中
封存有
焊藥是強度不足或斷裂的主要原因。
According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
採用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡（ c - sam ）無損檢測技術，測量了在不同
焊點狀態下， b型和d型兩種實際倒裝
焊封裝晶元與底充膠界面分層裂縫傳播速率。
Light gauge metal containers - round vent - hole cans with soldered ends for milk and milk products - capacities and related diameters
薄壁金屬容器.裝牛奶和牛奶製品用帶
焊封埠的圓形通氣孔罐.容積和相關尺寸
The minimal usage means the usage in the welding sealed iron container, if in the humidity or inner liner plastic bag sealed package wooden container, should use double
注：最少使用量指在
焊封鐵容器內的使用量，凡是在潮濕環境和採用木箱內襯塑料袋
封裝的包裝，應採用加倍的量。
Notice : the minimal usage means the usage in the welding sealed iron container, if in the humidity or inner liner plastic bag sealed package wooden container, should use double
注：最少使用量指在
焊封鐵容器內的使用量，凡是在潮濕環境和採用木箱內襯塑料袋
封裝的包裝，應採用加倍的量。
To our knowledge, for real flip chip packaging under the thermal loading, the paris equation obtained from experiment da / dn and simulation g is firstly reported here, and will be useful practically
本文在熱循環加載條件下對實際倒裝
焊封裝給出實驗da / dn和模擬g關系的paris方程，屬首次報導。
2. the delamination at the interface is one of typical failure mode for electronic packaging. in order to get more understanding of the propagation behaviour of [ he delamination, a series of finite element simulations related were done
為了對界面分層及其傳播行為進行深入研究，本文對b型和d型兩種實驗倒裝
焊封裝，在熱循環加載下，進行了有限元模擬。
Then, the half - empirical paris equation, which can be used as a design base of flip chip package reliability, have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated
然後由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率，擬合得到可作為倒裝
焊封裝可靠性設計依據的paris半經驗方程。
The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now
目前，測定實際倒裝
焊封裝界面分層傳播速率報道尚少見。
The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations
本文針對倒裝焊封裝可靠性問題進行了實驗和數值模擬兩方面的研究。
