焊料 的英文怎麼說

中文拼音 [hànliào]
焊料 英文
solder; welding flux; soldering flux
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : 名詞1 (材料; 原料) material; stuff 2 (喂牲口用的穀物) feed; fodder 3 (料器) glassware 4 (...
  1. It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can ' t corrode carbon steel, stainless steel and solders like tin and lead

    儀表適用於測量氨的液體和氣體的壓力真空,也可測量對碳鋼、奧氏體不銹鋼和錫鉛類焊料無腐蝕作用的介質的壓力和真空。
  2. Welding consumables - determination of moisture resistance of manual metal arc welding electrodes by measurement of diffusible hydrogen iso 14372 : 2000 ; german version en iso 14372 : 2002

    焊料.通過測量可擴散氫測定手工金屬電弧電極的抗濕
  3. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛焊料接頭中金屬間化合物在時效中的演變
  4. The strength and wear resistance of diamond drill bits for petroleum exploitation will be increased considerably when cast tungsten carbide is applied and adheres to the substrate firmly with cast tungsten carbide of 80 - 200mesh as the skelton and copper alloy as the soldering material in a process of non - pressure immersion

    石油鉆探行業用的金剛石鉆頭,用粒度為80 ? 200目的鑄造碳化鎢粉作骨架,採用無壓浸漬工藝,以銅合金作釬焊料,將鑄造碳化鎢與基體牢固結合,強度、耐磨性大大提高。
  5. Soft solder alloys. chemical compositions and forms

    焊料合金.化學成分和表格
  6. If you add solder and you can make that circuit substitute for a maze of conventional wiring.

    如加上焊料,你就可以使板上面的電路代替那種用舊方法連接起來的迷宮一樣的線路。
  7. Solder wicking test procedures for electrical connectors

    電連接器焊料吸液作用試驗程序
  8. Heat solder joints only to the point were solder will flow properly. excessive heat may distort brass castings

    焊料連接只能用在焊料能夠正確流動的地方。過熱可能扭曲黃銅鑄件。
  9. Rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended

    額定內部壓力是所連接的管道額定內部壓力。如果可以採用焊料,則推薦使用銅合金。
  10. H rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended

    額定內部壓力是所連接的管道額定內部壓力。如果可以採用焊料,則推薦使用銅合金。
  11. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  12. Lead - free solder and conducting resin packaging technology involved in lead - free packaging are analyzed. the technological differences between the traditional tin - lead welding and lead - free welding are also described. finally, some technical difficulties in promoting lead - free packaging technology are presented

    從無鉛組裝的角度出發,詳細分析了無鉛組裝技術涉及的無鉛焊料和導電膠組裝技術,闡述了傳統的錫鉛接與無鉛接的工藝差異,提出了該技術要推廣應用所面臨的技術難點。
  13. Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用的連接材.電子接設備用的電子分級焊料合金和助熔劑和非助熔劑的要求
  14. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材.第1 - 3部分:電子接用電子級釬合金及有劑和無劑的固體焊料的要求
  15. The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability

    摘要通過分析焊料在釬過程中的行為,提出了電子焊料的工藝性能主要包括熔化固化溫度、抗氧化性、潤濕性和漫流性。
  16. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明:相關的影響因素主要包括合金的組成、純度和化學均勻性;母材的成分、性質和表面的潔凈度;液態焊料的表面張力;釬溫度、氣氛、助劑的活性;液態焊料表面膜的組成、結構和性能等。
  17. A method of multi - metal - layer alternate growing is applied to develop a new type of solder structure, which prevents oxidation and creeping of the solder ( the research of this field has been published in an english journal )

    採用多層金屬交替生長的方法,研製出一種新型的焊料結構,防止了焊料的氧化和上爬(已在國外刊物發表) 。
  18. Do not use 50 / 50 tin - lead solder ( or any lead based solder ) in potable water lines. use 95 / 5 tin - antimony or other equivalent material

    在飲用水管道上不要採用50 / 50鉛焊料(或任何鉛基焊料) 。請採用95 / 5錫-銻或其他等同材
  19. This article introduced the development and ti - based brazing material used for titanium alloys, and analyzed the relationship between metallurgical structure and mechanical property of welding joint, mechanical behavior under high temperature 、 corrosion resisting property and fatigue capability of the joint were also represented

    本文介紹了鈦合金用的鈦基釬焊料的發展現狀,重點評價了鈦基釬后組織與力學性能的關系,以及鈦基釬的高溫力學性能、耐蝕性以及疲勞性能等。
  20. Oily or greasy surfaces repel fluxes, leaving bare spots that oxide and result in voids and inclusions

    油脂表面會排斥焊料,留下氧化物裸點,並導致砂眼和雜物。
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