焊錫度 的英文怎麼說

中文拼音 [hànxídù]
焊錫度 英文
solder wicking
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  1. To further reduce equivalent series resistance and improve long term reliability, the leads are then soldered with lead free silver solder

    為了進一步的減少等效串聯阻抗和改善，長期的信賴度，引線是以無鉛銀焊錫來接焊
  2. To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads

    為了獲得要求的凸起高度，錫膏在晶片焊盤過焊。
  3. Quite a bit of heat is needed, due to the thickness of the copper pipe, and an electrical soldering iron probably won ' t be able to deliver sufficent heat

    因為銅管有一定的百度，所以有可能錫焊的溫度不夠，它對溫度的要求是比較高的。
  4. Lead - free solder and conducting resin packaging technology involved in lead - free packaging are analyzed. the technological differences between the traditional tin - lead welding and lead - free welding are also described. finally, some technical difficulties in promoting lead - free packaging technology are presented

    從無鉛組裝的角度出發，詳細分析了無鉛組裝技術涉及的無鉛焊料和導電膠組裝技術，闡述了傳統的錫鉛焊接與無鉛焊接的工藝差異，提出了該技術要推廣應用所面臨的技術難點。
  5. Thermosetting powder coating of low - temperature curing type is a newly - developed powder coating which is used on the things that are not suitable for high - temperture baking. this type of powder coating opens up wider application by lowering curing temperature to 108 - 130. it can be used for surface coatings on such things as flaw detectors, auto water tanks, springs, electrical appliances with coils, instruments, equipment with tin welding seams. it can also be used on the products made of aluminum and magnesium materials, glass, plastics and wood etc

    低溫固化型粉末塗料是針對那些不宜高溫烘烤的產品，而最新研製的新品種，它不僅具備一般粉末塗料的特徵，而且可以把固化溫度降低到108 - 130 ，從而拓寬了粉末塗料的應用領域；適用於擦傷機械、汽車水箱、發動機、彈簧、線圈電器、儀器儀表、錫焊條接縫設備、鉛鎂材質、玻璃、塑料、木材等製品的表面塗裝。
  6. Solder bar is made from high purity metal. by means of strict qualitg control the oxide and metallic and non - metallic impnrities and effectively minimized, the available high purity solder bar is with uniform and glazed surface good wetting and spreading ability after molten bright joint and minimum oxide residue after soldering. our product is suitable for wave and handwork soldering with high quality requirement

    本公司生產焊錫條採用高純度金屬原料，在嚴格品管條件下，有效控制氧化程度以及金屬和非金屬雜質含量，焊錫條表面均勻光滑，純度極高，熔化后流動性好，潤濕性極佳，焊點光亮，氧化渣物極少發生，適用於高品質要求的各種波峰焊和手工焊。
  7. I am using an alloy for chip attach that has a liquidus of 2900c ( sn10 / pb88 / ag2 ), what do you offer for this application

    我正在貼片應用中使用錫10 /鉛88 /銀2合金的焊錫膏，融點溫度是2900c ，有適合這種應用的無鉛錫膏嗎？
  8. Q : i am using an alloy for chip attach that has a liquidus of 2900c ( sn10 / pb88 / ag2 ), what do you offer for this application

    我正在貼片應用中使用錫10 /鉛88 /銀2合金的焊錫膏，融點溫度是2900c ，有適合這種應用的無鉛錫膏嗎？
  9. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  10. Then the paper also study the atomizer structure ( the protrusion of the delivery tube value h ), atomizing gas pressure p, over - heat temperature of alloy a t, the component of solder alloy and atomizing medium and so on

    進一步對霧化器結構（導液管突出高度h ） 、霧化氣體壓力p 、合金過熱度t 、焊錫合金成份和霧化介質進行了研究。
  11. The most obvious is the necessity for increased reflow temperature

    最明顯的是，使用無鉛錫膏必須提高迴流焊溫度。
  12. The result of emulational experiment shows that the algorithms are effective. the algorithm solves the problems of too much training and the low precision of bp network applied in solder joints inspection

    模擬實驗驗證了改進后的演算法是有效的，並解決了將bp網路應用於基於結構式光源的錫量類型焊點質量檢測中時訓練次數較多和網路精度不高的問題。
  13. To address this issue, i own development company dedicated to produce aluminum wire enameled wire, enameled wire welding of aluminum products in the process to save time, save costs and reduce process, solder joint reliability bright spot. fundamentally solve the problem of welding aluminum enameled wire, so to some extent, aoruidi aluminum and aluminum brazing wire enameled wire exclusive agent to promote the use and development of aluminum enameled wire

    針對這個問題，我公司自主開發生產出鋁漆包線專用焊錫絲，該產品在鋁漆包線的焊接流程中節省時間，節約成本，減少工序，焊點可靠，焊點光亮，從根本上解決了鋁漆包線的焊接問題，從而在某種程度上來說，奧瑞迪鋁漆包線專用焊錫絲和鋁釬劑促進了鋁漆包線的應用和發展。
  14. Powder produced in this way has a uniform particle size distribution, low oxide content and high purity

    這種方法製造出來的焊錫粉具統一的粒徑、低氧化和高純度的特性。
  15. We have developed a set of supersonic atomizing equipment with the base theory of the supersonic atomization and the base characteristic of the solder alloy. the paper studies systematic the production technology and process of the solder alloy fine powders in the equipment, and deduces the gas velocity formula used in supersonic atomization in theory

    為此，運用超音速霧化的基本原理和焊錫合金的基本性質，研製出一套超音速霧化裝置，在該裝置上對焊錫合金微粉的制備技術及工藝進行了系統的研究，並從理論上推導出適用於超音速霧化的氣體速度公式。
  16. 1 majority of components undergo pre - forming to correct lead shape and length to avoid extra lead trimming process or soldering process

    大部份零件都經過預加工成形，調整各零件腳形狀和長度之要求，並省卻額外對零件腳切斷及焊錫製程之要求
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