焊錫性 的英文怎麼說

中文拼音 [hànxíxìng]
焊錫性 英文
solderability
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 性 : Ⅰ名詞1 （性格） nature; character; disposition 2 （性能; 性質） property; quality 3 （性別） sex ...
  1. Review and prospect of solderable tin - based binary alloy plating

    可焊性錫基二元合金鍍層研究的現狀與展望
  2. Solder bar is made from high purity metal. by means of strict qualitg control the oxide and metallic and non - metallic impnrities and effectively minimized, the available high purity solder bar is with uniform and glazed surface good wetting and spreading ability after molten bright joint and minimum oxide residue after soldering. our product is suitable for wave and handwork soldering with high quality requirement

    本公司生產焊錫條採用高純度金屬原料，在嚴格品管條件下，有效控制氧化程度以及金屬和非金屬雜質含量，焊錫條表面均勻光滑，純度極高，熔化后流動性好，潤濕性極佳，焊點光亮，氧化渣物極少發生，適用於高品質要求的各種波峰焊和手工焊。
  3. Testing of solderability for soft soldering ; vertical dipping test for pre - tinned specimens ; testing ; assessment

    軟釬焊可軟釬性的檢驗.預鍍錫試樣的垂直浸漬試驗.檢
  4. All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program

    我們製造焊膏所使用的焊錫粉是在惰性氣體和嚴格質量控制之下製成的。
  5. Each displays different properties for solderability, etc

    每一種類型都有不同的特性和焊錫性。
  6. Relationship between quality and capability of lead - free solder powder

    無鉛焊錫微粉霧化量與性能的關系
  7. Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball, the chips should be vacuum sealed shortly after the reball process

    因為很容易氧化並且形成一個氧化層覆蓋會降低錫球的焊接特性，所以在重新植球加工后應盡快真空封裝。
  8. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  9. No white power occurring on soldered surface or surface of the components, no moisture absorption

    焊錫表面和零件面無白粉產生、無吸濕性。
  10. Experience of the following manufacturing processes ; ultrasonic welding of plastics, thermal forming of plastics, thick film screen printing, selective soldering

    有下列製造工藝的經驗:超聲波焊接塑料，塑料熱成型鉚接，厚膜絲網印刷，選擇性錫焊
  11. Almit produces a wide range of solders and fluxes with varying attributes and characteristics to suit practically every task

    阿米特公司生產一系列焊錫膏、焊錫絲和助焊劑等產品，性能卓越、質量可靠，可滿足不同客戶的各種需求。
  12. Our solid solder wire is made according to the most exacting quality standards. specifications for composition, weight and diameter are followed exactly, for use in the demanding electronics industry

    固品之實心焊錫絲成份系經細心調合金製成因其成份及正確規格影響電子（器）產品之品質及持久性關系極大，所以我們以嚴格的品質管制來符合中外各大廠之需求。
  13. Every pack of powder is back - filled with inert gas to prevent further oxidation during storage

    惰性氣體的運用防止了在貯藏時每一包焊錫粉的進一步氧化。
  14. Powder produced in this way has a uniform particle size distribution, low oxide content and high purity

    這種方法製造出來的焊錫粉具統一的粒徑、低氧化和高純度的特性。
  15. Sc ： this media produced with silicon carbide, used for aggressive cutting, better for brazing, welding or soldering. good cutting characteristics and good wear

    該磨塊由碳化硅原料製成，用於需要很強切削力的零件，尤其適用於銅焊件，錫焊件和其他焊件，具有很好的切削性能和磨耗。
  16. Environmental testing. part 2 : tests. test ta : soldering. solderability testing by the wetting balance method

    基本環境試驗規程.第2部分:試驗.第54節:試驗ta :錫焊.潤濕平衡法可焊性試驗
  17. We have developed a set of supersonic atomizing equipment with the base theory of the supersonic atomization and the base characteristic of the solder alloy. the paper studies systematic the production technology and process of the solder alloy fine powders in the equipment, and deduces the gas velocity formula used in supersonic atomization in theory

    為此，運用超音速霧化的基本原理和焊錫合金的基本性質，研製出一套超音速霧化裝置，在該裝置上對焊錫合金微粉的制備技術及工藝進行了系統的研究，並從理論上推導出適用於超音速霧化的氣體速度公式。
  18. A brief introduction of xishan city huada universal electrical appliance factory i. the general situation of the enterprise having transport facilities, xishan city huada universal electrical appliance factory, which is 7 km away from dongting road junction of huning expressway in the east, 10 km away from wuxi railway station in the south, 7 km away from xizhang road junction of huning expressway in the west and 30 km away from zhangjiagang port in the north, is located in beautiful taihu bank

    本廠座落於風景秀麗的太湖之濱，南鄰滬寧高速公路東亭道口7公里，無錫市火車站10公里；西鄰滬寧高速公路西漳道口7公里；北距張家港港口30公里，是生產家用電器、不銹鋼製品、模具、沖壓拉深件、焊接、噴塑、噴漆為一體的綜合性廠家。
  19. Tin has replaced lead, which is more toxic, in a lot of soldering

    的確，由於錫毒性較弱，它已在許多焊接過程中取代了鉛。
  20. The forward compatibility, backward compatibility, tin whisker, voids, micro - voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed

    重點論述了前向兼容與後向兼容、錫須、空洞與微空洞、可焊性塗層以及如何避免無鉛轉移中出現的問題。
分享友人
分享到 Line

分享到臉書