焊錫球 的英文怎麼說

中文拼音 [hànxíqiú]
焊錫球 英文
ball, solder
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 球 : 名詞1 （以半圓的直徑為軸 使半圓旋轉一周而成的立體; 由中心到表面各點距離都相等的立體） sphere; glo...
  1. This could cause a variety of solder defects, ranging from solder balling to non - wetting to damaged devices to voiding to charred residues

    這樣會產生許多焊接缺陷，諸如錫球、潤濕不良、破壞元器件、空洞、碳化等。
  2. Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball, the chips should be vacuum sealed shortly after the reball process

    因為很容易氧化並且形成一個氧化層覆蓋會降低錫球的焊接特性，所以在重新植球加工后應盡快真空封裝。
  3. Spherical alloy solder powder producing by high - energy atomizing technique, under accurate monitoring by the computer, carrying out the high quality standard of the alloy solder powder, can satisfy with the high quality demand of the solder paste manufacture absolutely

    採用高能霧化技術生產的球型合金焊錫粉，在計算機精確的控制下，執行高品質的合金焊粉質量標準，完全能滿足高品質錫膏製造的要求。
  4. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  5. Pb - free solders ? sn - bi - zn based with our own patent and their modification to fit for package applications

    無鉛焊錫?錫鉍鋅系無鉛焊錫，材料設計、開發，焊料（錫球、錫膏）開發等。
  6. The fine powders of the solder alloy are one of the key materials in the smt, the requirement as following : the particle diameter is in 5 u m ~ 74 u m, the shape is spherical and the distribution of the particle size is uniform

    表面組裝技術（ smt ）已廣泛應用於電子工業中，而焊錫合金微粉是該技術的關鍵材料之一，通常要求：粉末粒徑5 74 m ，形狀為球形，且粒徑分佈均勻。
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