無機半導體 的英文怎麼說

中文拼音 [wújībàndǎotǐ]
無機半導體 英文
inorganic semiconductor
  • 無 : 無Ⅰ動詞（沒有） not have; there is not; be without Ⅱ名詞1 （沒有） nothing; nil 2 （姓氏） a surn...
  • 機 : machineengine
  • 半 : Ⅰ數詞1 （二分之一） half 2 （在 中間的） in the middle; halfway 3 （比喻很少） very little; the l...
  • 導 : 動詞1. （引導） lead; guide 2. （傳導） transmit; conduct 3. （開導） instruct; teach; give guidance to
  • 體 : 體構詞成分。
  • 無機 : [化學] inorganic無機氮肥 inorganic nitrogenous fertilizer; 無機肥料 inorganic fertilizer; 無機化...
  1. The fluoroplastic products, possessing many unmatched and distinguished properties such as insulation, corrosion resistance, ageing resistance, self - lubricating etc. are broadly used in the following fields : chemical corrosion resistance, electrical insulation, aerospace, semiconductor, biomedicine, sources of petroleum energy, automobile, metallurgy, bridge construction, food - processing equipment and domestic applianes etc

    氟塑料以其獨特的無可取代的絕緣、防腐蝕、耐老化、自潤滑等優良性能被廣泛運用於化工防腐、電器絕緣、航空航天、半導體、生物醫藥、石油能源、汽車冶金、橋梁建築以及食品、機械、家電等行業。
  2. Semiconductor quantum dots ( qds ) are inorganic nanocrystals consisted of a cadmium selenide ( cdse ) core which was wrapped in an outer shell of zinc sulfide ( zns )

    摘要半導體量子點是無機納米結晶，構成於硒化鎘核心和硫化鋅外殼。
  3. According to the structural characteristic, hybrid materials of polyurushiol and inorganic semiconductor nanoparticles were prepared, which maybe a new king of functional organic - inorganic hybrid material. it would promote the characteristic of urushiol in new areas. searching literature, we did not find a report about polyurushiol / nanoparticles hybrid

    根據其結構特點，將無機半導體納米粒子引入漆酚中得到聚合漆酚無機半導體納米雜化材料，一方面有可能開發出具有新功能性的有機無機納米雜化材料，另一方面可使生漆的獨特性能在新的應用領域中得到發揮，促進生漆的應用開發研究。
  4. Flexibility, processability, low cost, interesting optical - electric properties and so on make organic materials be a good substitute for inorganic ones. modification of inorganics by organics can change surface properties of inorganics, for example, frictional, optical, electrical, chemical and biocompatible properties. on the other hand, many interests have been shown to integration of functional organics in si - base devices because of their great promise in optoelectronic, micro - electronic and sensor applications

    通過對無機半導體材料進行有機改性，可以改變無機材料的表面化學性質，生物相容性質，光電性質等等，因此，有機無機復合材料在光電器件、生物傳感、微電子器件的應用領域有著很好的應用前景，尤其是在微電子工業中廣泛使用的硅材料與有機光電材料的復合更是備受關注。
  5. The present invention describes a method to pattern layers of organic and / or inorganic or biological molecules by a printing technique for the use in semiconductor devices, circuits, sensors, biological patterns, biochips, and displays using organic and / or inorganic active or biological layers

    本發明記述了一種圖案化有機及/或無機或生物分子層的方法，通過一種將有機及/或無機活性或生物層運用到半導體設備，電路，傳感器，生物式樣，生物晶元和顯示印刷技術。
  6. Progress in research on composite materials with non - linear conductivity

    無機半導體顆粒填充聚合物復合材料的研究進展
  7. Mechanism of conducting polymers is different from metals and semiconductors

    導電聚合物的導電機理不同於金屬，也不同於無機半導體。
  8. Development and outlook of inorganic semiconductor materials photoinitiated polymerization

    無機半導體材料光引發高分子聚合的發展及前景
  9. Testing of semi - conducting inorganic materials ; determining the orientation of single crystals by means of x - ray diffraction

    無機半導體材料的檢驗.第1部分:採用x射線衍射現象對
  10. Testing of semi - conducting inorganic materials ; determining the orientation of single crystals by means of optical reflection figure

    無機半導體材料的檢驗.第2部分:採用反射光影法測定單
  11. In general, organic semiconductors have lower mobility than their inorganic counterparts do, resulting in slower switching speeds

    一般說來，有機半導體的遷移率比無機半導體的來得低，這使得開關的速度較慢。
  12. All the results are of great importance to surface modification of inorganic semiconductor devices and integration of organic devices

    本論文的這些研究對于硅及其他無機半導體材料的表面改性和有機光電器件的集成化具有十分重要的意義。
  13. This article analyses the operation principle of the semiconductor laser power in detail, and demonstrates the feasible scheme of the main part of the power according to the special request under the quasi - successive working way, designs the corresponding hardware circuits and software procedures which implement the accurate automatic control of timing, steady voltage and invariable current power supply without pulse voltage and surge current for digital display semiconductor laser power

    本文深入分析了半導體激光電源的工作原理，根據準連續工作方式下的特殊要求，論證了電源的主要環節的可行性方案，設計了相應的硬體電路與軟體程序， （實現了定時的精密自動化控制、數字式顯示機半導體激光電源的無脈沖電壓、無浪涌電流的穩壓恆流供電。
  14. The patent department include 12 patent attorneys covering specialties such as chemistry equipment, mining and heavy machinery, semiconductor technologies, electronic and electric appliance, home appliance, radio communication, inorganic material, metallurgy, organic synthesis material, macromolecular material, drug and bio - materials

    萬慧達公司專利部目前有12名專利代理人，其專業覆蓋化工設備礦山與重型機械半導體技術電子與電器家用電器無線電通訊無機材料冶金有機合成材料高分子材料藥物及生物材料等，所有專利代理人均取得了理工學士以上學位。
  15. Testing of semi - conductive inorganic materials ; measuring the thickness of silicon epitaxial layer thickness by infrared interference method

    半導體無機材料的試驗.用紅外線干涉法測量硅外延生長
  16. Currently, the technique of semiconductor laser arrays and stacks assembly is not mature in china. there are no assembling equipment for semiconductor laser arrays and stacks in the world, and all institutions manufacturing semiconductor laser arrays and stacks kept usage of solder as secret. consequently, assembling technique, solder and assembling equipment have been deemed as focal points of my studies

    目前國內對半導體激光器列陣及疊陣的組裝技術還不成熟，國內外還沒有用於半導體激光器列陣及疊陣的組裝設備，各個研製半導體激光器列陣及疊陣的機構對焊料的使用還互相保密，因此本人對半導體激光器的結構、組裝技術、焊料、組裝設備進行了如下研究：對無鋁半導體激光器的結構進行了設計，在理論上對半導體激光器列陣及疊陣進行了研究。
  17. Recently, nanostructured composite system with nanoparticals and inorganic or organic semiconductor functional materials attracted more and more attentions

    近年來，半導體納米粒子與無機或有機半導體功能材料復合體系的研究越來越受到人們的關注。
  18. Using this method, the interface characteristics of angle beveled mesa structure high - voltage silicon pn junction protected by organic materials or inorganic passivation films were measured

    採用此方法，測量了臺面型高壓硅半導體器件的無機鈍化和有機保護界面的表面復合速率。
  19. Semiconductor devices - mechanical and climatic test methods - part 33 : accelerated moisture resistance - unbiased autoclave

    半導體器件.機械和氣候試驗方法.第33部分:加速抗濕.無偏壓熱器
  20. Considering the practical manufacturing condition, an oxygen - free copper microchannel heatsink consisting of five copper sheets is designed and fabricated utilizing the technology of deep photolithography, mechanical machining, and bonding with medium

    根據實際製作條件，設計了五層結構微通道熱沉，採用深層光刻分離曝光化學腐蝕技術、機械加工技術和銅直接粘接技術（ dbc ）制備出冷卻大功率半導體激光器迭陣的無氧銅微通道熱沉。
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