無焊料的 的英文怎麼說

中文拼音 [wúhànliàode]
無焊料的 英文
solderless
  • 無 : 無Ⅰ動詞（沒有） not have; there is not; be without Ⅱ名詞1 （沒有） nothing; nil 2 （姓氏） a surn...
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 料 : 名詞1 （材料; 原料） material; stuff 2 （喂牲口用的穀物） feed; fodder 3 （料器） glassware 4 （...
  • 的 : 4次方是 The fourth power of 2 is direction
  1. It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can ' t corrode carbon steel, stainless steel and solders like tin and lead

    儀表適用於測量氨的液體和氣體的壓力真空，也可測量對碳鋼、奧氏體不銹鋼和錫鉛類焊料無腐蝕作用的介質的壓力和真空。
  2. Phenolic foam is a new generation heat preservation prevent fire soundproof material and polystyrene together ammonia ester foaming rubber etc, material to compare, and it is good that its biggest characteristics is a heat - proofound the low temperature contractility is smatt, and have te special prevent burning wit the size stability under 2000 heat, not burning, not melt not contract constant form not poisonous spirit hove no thick smoke, just surface formation layer

    信息內容：酚醛泡沫為新一代保溫防火隔音材料與聚苯乙烯聚氨脂發泡橡膠比，其最大特點是耐熱性好，低溫收縮性小，具有獨特的阻燃和尺寸穩定性，在焊槍火焰下，不燃燒不收縮不變形，無毒氣無濃煙，只是表面炭化，性質穩定，耐化學腐蝕抗老化。
  3. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛焊料接頭中金屬間化合物在時效中的演變
  4. The strength and wear resistance of diamond drill bits for petroleum exploitation will be increased considerably when cast tungsten carbide is applied and adheres to the substrate firmly with cast tungsten carbide of 80 - 200mesh as the skelton and copper alloy as the soldering material in a process of non - pressure immersion

    石油鉆探行業用的金剛石鉆頭，用粒度為80 ? 200目的鑄造碳化鎢粉作骨架，採用無壓浸漬工藝，以銅合金作釬焊料，將鑄造碳化鎢與基體牢固結合，強度、耐磨性大大提高。
  5. It is drawn seamless tubing, which can be welded to join the tubes of the bike frame together. the tubes are cold worked to provide additional strength to the material, and through this process is tailored to provide the correct shape tubing for the frame design

    由ti 3al2 . 5v製成的鈦合金車架採用無縫管材的焊接技術，其管材經冷軋成形后經過嚴格地挑選檢驗，以保證其材料的強度和質量。
  6. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  7. From the design of patterns to the choice of raw material, and through unique spraying and computer carving craft, welding and minute processing technology of professional technicians ; jiashide products are leading in the pattern, quality, technology and style, which is the first choice of numerous star hotels, high - grade buildings and luxurious residential houses

    佳仕得產品從款式的設計到原材料的精選，再通過獨特的噴塗噴砂和電腦雕花工藝結合，專業技師焊接及精細加工技術，無論在款式上還是質量技術和風格上均能處于引領潮流的地位，是眾多星級酒店高檔樓盤和豪華家居之首選。
  8. Lead - free solder and conducting resin packaging technology involved in lead - free packaging are analyzed. the technological differences between the traditional tin - lead welding and lead - free welding are also described. finally, some technical difficulties in promoting lead - free packaging technology are presented

    從無鉛組裝的角度出發，詳細分析了無鉛組裝技術涉及的無鉛焊料和導電膠組裝技術，闡述了傳統的錫鉛焊接與無鉛焊接的工藝差異，提出了該技術要推廣應用所面臨的技術難點。
  9. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材料.第1 - 3部分:電子焊接用電子級釬焊合金及有焊劑和無焊劑的固體焊料的要求
  10. Then an thorough computer modeling using finite element program with material, geometry and state triple - nonlinear taken into account is carried out on a series of influencing factors, such as comparison with npn - beam splice connection, comparison of varies designed theories, and the varying of fraction coefficient, diameter, grade, pretension and arrangement of bolts, thickness of web and flanges of beam and column, splicing location, axial loading on column, etc. lots of useful conclusions are drawn form computer modelling. finally, design and construction suggestions are given out. this study fills the black in the field of steel beam - to - column connection with cantilever beam high - strength bolted - splicing at both home and abroad

    然後，本文在考慮材料、幾何和狀態三重非線性的基礎上，對該連接形式進行了全面的計算機模擬，主要考慮了帶懸臂梁段全螺栓拼接的樑柱連接節點與無拼接的樑柱連接及翼緣對接焊接腹板拼接的連接節點的對比，各種設計方法之間的對比，以及翼緣拼接和腹板拼接的螺栓間距、直徑和數量，拼接點與梁端之間的距離，梁和柱的翼緣、腹板厚度，柱的軸力，接觸面的摩擦系數，翼緣和腹板拼接板的厚度等因素的影響。
  11. Study on the reliability of sn - ag - cu lead - free solders

    無鉛焊料的可靠性研究
  12. Development and research of self - adaptive lead - free solders

    自適應無鉛焊料的開發與研究
  13. Currently, the technique of semiconductor laser arrays and stacks assembly is not mature in china. there are no assembling equipment for semiconductor laser arrays and stacks in the world, and all institutions manufacturing semiconductor laser arrays and stacks kept usage of solder as secret. consequently, assembling technique, solder and assembling equipment have been deemed as focal points of my studies

    目前國內對半導體激光器列陣及疊陣的組裝技術還不成熟，國內外還沒有用於半導體激光器列陣及疊陣的組裝設備，各個研製半導體激光器列陣及疊陣的機構對焊料的使用還互相保密，因此本人對半導體激光器的結構、組裝技術、焊料、組裝設備進行了如下研究：對無鋁半導體激光器的結構進行了設計，在理論上對半導體激光器列陣及疊陣進行了研究。
  14. It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead - free soldering

    包括背景，焊料，表面鍍層，元器件，基板，組裝工藝，返工和無鉛焊接的可靠性。
  15. Current status and trends in research of lead - free solders in electronics

    電子產品用無鉛焊料的研究現狀和趨勢
  16. The gauge can be used in measure and it also can be used in measuring the pressure and uacuum of the service medium of the carbon steel stainless steel and solders like tin. lead without corroddent function

    氨氣壓力表適用測量氨的液體和氣體正負壓力，亦可測量對碳鋼、奧氏體不銹鋼、錫鉛類焊料無腐蝕作用介質的正負壓力。
  17. Progress of lead - free solder

    無鉛焊料的發展
  18. Wedlding consumables - tubular cored electrodes for metal arc welding with or without a gas shield of stainless and heat - resisting steels - classification

    焊料.不銹鋼和耐熱鋼的有或無氣體保護金屬極電弧焊接用藥芯焊條.分類
  19. Non - destructive examination of welds. general rules for metallic materials

    焊接的無損檢驗.金屬材料用一般規則
  20. Non - destructive examination of welds - general rules for metallic materials

    焊縫的無損檢驗.金屬材料的一般規則
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