熱循環加載 的英文怎麼說

中文拼音 [xúnhuánjiāzǎi]
熱循環加載 英文
thermal cycle loading
  • : 循動詞(遵守; 依照; 沿襲) follow; abide by
  • : Ⅰ名詞1 (環子) ring; hoop 2 (環節) link 3 (姓氏) a surname Ⅱ動詞(圍繞) surround; encircle;...
  • : 載Ⅰ名詞(年) year : 一年半載 six to twelve months; six months to a year; 三年五載 three to five ...
  • 循環 : circulate; circle; round; repeat; loop; period; recurrence; cycling; circulating; mixing; circula...
  1. Traditional hydronic sizing methods can be used for selecting pumps, expansion tanks, heat exchangers, and air removal devices, as long as the heat transfer liquid ' s thermal properties are considered

    傳統的液體體量法在泵、蒸發器、交換器和空氣移動裝置的選擇中可以應用,在考慮流體的血特性的情況下。
  2. Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design

    本論文正是針對以上情況,以採用引線鍵合工藝的三維疊層csp / bga封裝(裸晶元疊裝)為研究對象,在有限元分析軟體ansys中建立相關的有限元模型,編制了相應的apdl參數化分析程序,進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。
  3. The residue contact pressure will be decreased after temperature cycle, the higher the working temperature, the lower the residue contact pressure, which has been proved by experiment

    研究表明,當復合管處于狀態時,復合管存在著極限工作溫度;經過極限溫度后,殘余接觸壓力將減小,且極限溫度越高,殘余接觸壓力值越小;通過實驗得到了驗證。
  4. 3. the anand model, a unified viscoplastic constitutive relation, was applied to represent the nonlinear deformation behavior of 63sn37pb solder

    3 .採用anand統一型粘塑性本構模型對63sn37pb焊點釬料在熱循環加載下的應力應變進行模擬。
  5. To our knowledge, for real flip chip packaging under the thermal loading, the paris equation obtained from experiment da / dn and simulation g is firstly reported here, and will be useful practically

    本文在熱循環加載條件下對實際倒裝焊封裝給出實驗da / dn和模擬g關系的paris方程,屬首次報導。
  6. 2. the delamination at the interface is one of typical failure mode for electronic packaging. in order to get more understanding of the propagation behaviour of [ he delamination, a series of finite element simulations related were done

    為了對界面分層及其傳播行為進行深入研究,本文對b型和d型兩種實驗倒裝焊封裝,在熱循環加載下,進行了有限元模擬。
  7. Cooper standard automotive, a multi - national comp - any whose business covers sealing systems, nvh ( noise, vibration and harshness ) control systems, and fluid handing systems ( brake pipe, brake & fuel bundles fuel lines power steering assemblies, heating and cooling, emission control, and others with all the advanced production equipments as well as research facilities

    庫博汽車配件有限公司是一家國際性的汽車配件生產型公司,在全球均設有同汽車配件相關的生產及科研設施,涵蓋的產品包括密封系統、減震系統、流涕承系統(剎車管路、燃油管路、動力轉向系統、冷卻系統、廢氣再等系統) 。
  8. When the control system senses an increase in solar panel temperature, the pump circulates the heat transfer liquid, and energy is collected

    當控制系統感應到太陽平板溫度的增,泵使流體,能量被收集。
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