熱應力分析 的英文怎麼說

中文拼音 [rèyīnglìfēnxī]
熱應力分析 英文
thermal stre analysis
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  • 析 : Ⅰ動詞1. （分開; 散開） divide; separate 2. （分析） analyse; dissect; resolve Ⅱ名詞（姓氏） a surname
  1. Thermal stress analysis of helium cooling lines in control valve box for bepc ssm magnet

    磁體控制閥箱內氦冷卻管線熱應力分析
  2. With the focus on the structure and components character of plate metal / ceramics graded coating, this paper extends and improves the thermal elastoplastic analysis model of trilayered materials derived by suresh et al and builds the theoretical model of thermal elastoplastic stresses analysis of plate metal / ceramics graded coating, and this paper also analyzes the thermal elastoplastic stresses and deformation of metal / ceramics graded coating

    本文針對平板狀金屬陶瓷梯度塗層的結構和組成特徵，推廣和完善了suresh等人的三疊層材料的熱彈塑性分析模型，建立了平板狀金屬陶瓷梯度塗層熱彈塑性應力分析的理論模型，對金屬陶瓷梯度塗層的熱彈塑性應力和熱彈塑性變形進行了分析。
  3. This paper also researches on thermal elastoplastic analysis model of multilayered graded coating structures on the basis of thermal elastoplastic analysis model of trilayered materials with the focus on the structural character of graded coating. it builds the thermal elastoplastic analysis theory for the graded coating structure that has a single plastic layer or two plastic layers. it gives the analytical formulas of thermal stresses and the thermal elastic - plastic transform temperatures of graded coating that has a single plastic layer or two layers under the thermal loading

    針對梯度塗層的結構特徵，在建立的三層疊層材料熱彈塑性分析模型的基礎上，對多層梯度塗層結構的熱彈塑性分析模型進行了研究，分別建立了含單個塑性層和兩個塑性層的梯度塗層結構的熱彈塑性分析理論，給出了在熱載荷作用下含單個塑性層和兩個塑性層的梯度塗層的熱彈性-塑性臨界溫度和熱應力分析公式，利用有限元分析對理論模型進行了驗證。
  4. Thermal stress analysis for laminated composite plates

    復合材料層合板的熱應力分析
  5. Residual stress analysis of thermal barrier coatings

    熱障塗層的殘余應力分析
  6. The calculation result is compared with that of some experiments and other references, and it is satisfactory. the subroutines can be applied to the stress analysis of turbine disks in aeroengines

    計算結果表明介面子程序具有在不同應變率條件下、應變率跳級拉伸條件下以及循環載荷條件下的模擬能力，程序正確、可靠，適于渦輪盤等發動機熱端部件的應力分析。
  7. Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages

    塑料封裝集成電路結構熱應力分佈的解析解
  8. This paper studied two - dimension model of rotor and cylinder and builded the finite element model. generally take the rotor and the cylinder as control objects ， definite their boundary conditions ， solute their temperature fields ， and then analyst their bear expansions and distortions as well as thermal stress distribute ， to control the courses ， and keep the unit the most optimum operating condition. and put the theories into practice developed by c + + program, used as the important part of the online monitoring and management system of life of the steam turbine

    本文對汽輪機轉子和汽缸的二維模型的進行分析，建立有限元模型；將汽輪機轉子和汽缸作為控制對象，確定其邊界條件，求解其溫度場，分析其熱膨脹、熱變形以及熱應力分佈；採用c + +語言編制汽輪機高壓缸、中壓缸以及缸體的溫度場實時在線監測程序，作為汽輪機壽命在線監測與管理系統的核心部分，用以指導汽輪機的啟停及運行過程，使機組可以安全的、經濟的運行。
  9. Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip

    本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。
  10. Firstly, this paper describes the optimization problem of thermal stress of fabrication process and steady work process for the hollow cylinder and the infinite plate. then, thermal stress distribution is calculated making use of theoretical formulation and the results can be validated by finite element method. in optimization, the restriction condition is heat insulation performance and the objective function is danger coefficient

    本文首先對平板結構和圓筒結構梯度塗層在制備過程和穩定工作狀態下的熱應力優化設計問題進行描述，然後分別用解析法求解兩種結構的梯度塗層在制備過程和穩定工作狀態下的熱應力分佈，並採用有限元方法驗證了熱應力分佈的結果，在優化設計時，以危險系數為目標函數，以塗層的隔熱性能為約束條件進行設計。
  11. Analysis of thermal stresses around the whole process of artery cryopreservation

    血管低溫保存全過程的熱應力分析
  12. A short fiber reinforced composition and interface residual stress analysis

    短纖維增強復合材料纖維和界面層殘余熱應力分析
  13. Thermal stress analysis

    熱應力分析
  14. Finally, the 4 - nodes finite element for heat conduction of shell structures is presented

    首先簡介結構熱應力分析的有限元方法。
  15. Thermal stress analysis and gradient design for single geometry bodies of functionally gradient materials

    簡單幾何體的熱應力分析及梯度化設計
  16. Mixed finite element method for saturated porous media and application to starin localization at finite strain

    十次對稱二維準晶中的熱應力分析
  17. Introducing heat exchange theory and finite element theory, and deducing the theory that applies finite element method to thermal analysis and thermal stress analysis

    介紹了傳熱學基本理論知識，有限元方法思想。對有限元法在熱分析和熱應力分析中的具體應用進行了理論推導。
  18. The phase structure of different cu - fe thin films were studied by using grazing incidence x - ray analysis ( gixa ). the texture and residual stress of different cu - fe thin films were measured by scan of x - ray diffraction ( xrd ) and 2 scan with different. the thicknesses of different thin films were characterized by means of small angle x - ray scattering ( saxs ) technique. by using atomic force microscope ( afm ) measured surface roughness of thin films. the component of different thin film was characterized by energy disperse spectrum ( eds ) and x - ray fluorescence ( xrf ). the magnetic properties of cu - fe thin films were measured by means of vibrating sample magnetometer ( vsm ). in addition, the giant magnetoresistance ( gmr ) effects of different films were also measured. the original resistance of the film fabricated by a direction - current magnetron sputtering system is directly affected by bias voltage

    利用掠入射x射線分析（ gixa ）技術對不同cu - fe薄膜的相結構進行了研究;利用xrd掃描及不同角度的2掃描對薄膜進行了結晶織構及殘余應力分析;運用小角x射線散射（ saxs ）技術測量了薄膜的厚度;採用原子力顯微鏡（ afm ）觀察了薄膜的表面形貌;運用能量損失譜（ eds ）及x射線熒光光譜（ xrf ）對薄膜進行了成分標定;使用振動樣品磁強計測量了不同cu - fe過飽和固溶體薄膜的磁性能;最後利用自製的磁阻性能測試設備測量了真空磁場熱處理前後不同薄膜的巨磁阻值。
  19. Steady state thermal analysis under natural convection boundary condition was performed. both the temperature distribution and the induced mechanical stress were calculated in this simulation. high stress area was found and the potential reasons which can cause packaging to fail were also discussed

    具體內容包括: 1 .建立一款疊層csp / bga封裝的三維實體有限元模型，求解自然對流條件下的穩態溫度場分佈，並在此基礎上進行穩態熱應力和熱應變分析，找出由於溫度梯度在封裝內部引起的高熱應力區域，分析其可能造成的失效結果。
  20. In real engineering, the two surfaces in sliding contact are rough. and it is an important theoretical part to calculate the coupled temperature and stress of sliding bodies having rough surfaces

    工程實際中，相互接觸的滑動摩擦表面是粗糙的，對粗糙表面的瞬時溫升和熱機械應力分析有重要的理論意義。
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