用砂輪細磨 的英文怎麼說

中文拼音 [yòngshālún]
用砂輪細磨 英文
finish sanding
  • : Ⅰ動詞1 (使用) use; employ; apply 2 (多用於否定: 需要) need 3 (敬辭: 吃; 喝) eat; drink Ⅱ名...
  • : 名詞(沙子) sand; grit
  • : Ⅰ名1 (輪子) wheel 2 (像輪子的東西) wheel like object; ring; disc 3 (輪船) steamer; steamboa...
  • : 形容詞1 (條狀物橫剖面小) thin; slender 2 (顆粒小) in small particles; fine 3 (音量小) thin ...
  • : 磨動詞1 (摩擦) rub; wear 2 (研磨) grind; mull; polish 3 (折磨) grind down; wear down [out]:...
  1. On the other side, based on research on noncircular surface grinding features, this deissertation designs the data structure of simulation driver, then, applies interpolation theory to design the grinding motion simulation module and researches all sorts of cases on constructing the solid swept of grinding wheels in the process of noncircular surfaces grinding, finally, designs nc codes verification simulation module by using design model - based verification technique

    在實體模擬技術方面,詳研究了非圓曲面削加工的特徵並設計了對應的模擬驅動數據結構;應插補原理設計了體現加工速度的運動過程模擬模塊;詳研究了非圓曲面削加工中的相對和絕對運動掃掠實體的構造,並採基於精確實體設計模型的驗證方法構建了數控代碼的模擬驗證模塊。
  2. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明,增大軸向進給速度和減小工件轉速,採粗粒度有利於提高削矽片的材料去除率,軸向進給速度對材料去除率的影響最為顯著;適當增大轉速,減小軸向進給速度,採粒度可以減小削表面粗糙度;在其它條件一定的情況下,速度超過一定值會導致材料去除率減小,主軸電機電流急劇增大,表面粗糙度變差;採比# 2000粒度更削時,材料去除率減小,矽片表面粗糙度沒有明顯改善。
  3. Features and use : it is used for abrading rubber 、 plastic or the same kind material like them. has the advantage of two grinding wheel working at the same time

    特點及途:製橡膠、塑料或類似的試片至一定的厚度供其他試驗設備進行試驗之,具有精兩種同時工作之優點。
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