研磨應力 的英文怎麼說

中文拼音 [yányīng]
研磨應力 英文
grinding stress
  • : 研同 「硯」
  • : 磨動詞1 (摩擦) rub; wear 2 (研磨) grind; mull; polish 3 (折磨) grind down; wear down [out]:...
  • : 應動詞1 (回答) answer; respond to; echo 2 (滿足要求) comply with; grant 3 (順應; 適應) suit...
  • : Ⅰ名1 (力量; 能力) power; strength; ability; capacity 2 [物理學] (改變物體運動狀態的作用) forc...
  • 研磨 : 1. (用工具研成粉末) grind; pestle2. (用磨料摩擦器物使變得光潔) abrade; polish
  1. The al matrix composites by reaction synthesis put up high mechanical behavior, well high - temperature properties and excellent wearing quality but the existent difficulties lie in that homogenizing method is not perfect, fundamental research to growth mechanism is absent and the concomitance compound come from reaction is difficult to eliminate at present

    合成的鋁基復合材料具有常溫學性能高、高溫性能好和耐性突出的優點,而存在的主要究難題則是整個材料均質化方法不理想、生長機制等基礎理論究缺乏、反伴生的化合物難以控制等。
  2. In comparison with impact force dominated conventional pulverizing equipment, pan - mill is especially effective for the pulverization of polymer materials. experimental results show that not only commodity polymers such as polystyrene and polypropylene but also coriaceous engineerin g plastics such as pa6 can be effectively pulverized by pan - mill

    盤形化學反器對聚合物材料的粉碎具有獨特的優勢,究結果表明,常溫操作條件下,盤形化學反器不但可以有效粉碎通用聚合物材料,如聚丙烯,也可以粉碎強韌性工程塑料尼龍6 。
  3. This paper mainly aims at the strategic demands for large - aperture lightweight mirror proposed by high - tech development. its main research contents are : select material blank for lightweight mirror according to physical and chemical properties of optical glass ; analyze and calculate the deformation quantity of the mirror with finite element method ; design and optimize mirror body structure of 400 lightweight plane mirror and 450 lightweight spherical mirror, analyze glass cutting principle, design specisl - use grinding wheel structure, select reasonable technological parameters to implement the processing of weight reduction holes on 400 plane mirror ; analyze etching mechanism of hydrofluoric acid, look for the technological parameters such as the optimal acid concentration and etching time etc. ; eliminate the stress of weight reduction holes and micro - cracks on 400 lightweight plane mirror ; discuss the processing principle and

    本論文的究主要是瞄準國家高技術對大口徑輕型鏡的戰略需求而開展的。主要究內容是:根據光學玻璃的物理與化學性能,選擇輕型鏡坯材料;用有限元法對鏡子的變形進行分析、計算,找出變形規律,優化設計400mm輕型平面鏡、 450mm輕型球面鏡鏡體結構;分析玻璃切削原理,設計專用輪結構,選擇合理工藝技術參數,完成400mm平面鏡輕量化減重孔的加工;分析氫氟酸腐蝕光學玻璃機理,尋找最佳酸濃度、腐蝕作用時間等工藝參數,實現400mm平面鏡減重孔與微裂紋的消除;討論分離器加工原理和工藝技術特點,完成400mm平面輕型鏡面形加工。
  4. This paper introduces the ball lapping model of spring - loading lap tools for the four shafts ball - lapping machine and explains the small tendence mechanism of the ball roundness error using the effets of cutting high points and homogenization lapping error

    摘要從建立四軸球體機彈簧加壓球體學模型入手,運用高點切削作用機制和誤差均勻化效,解釋了球體圓度誤差趨小化機理。
  5. The character of tube roll mill is that it combines the advantages of ball mill and roller, then great improves the grinding efficiency through the study of the grinding theory of tube roll mill, pressing stress, grinding effect and the comparation between roller and vertical mill, this text combined the national important technology equipment crert item - - tube roll milling developing item, gets following results : firstly, because of the special structure of tube and roll, powder from single particle grinding in the early peried contincely transit press grinding stage, it better stops the loss of splash energy, secondly, during the grinding progress, powder form loose to dense fully uses the nonsmoth surface of particle and stress focus to make its stress lower than roller " s

    本文結合國家重大技術裝備國產化創新項目-筒式輥碾開發項目,通過對筒輥的粉機理、層壓的分析、粉效果的究及與輥壓機、立效果、粉機理的比較,可知:首先,由於筒與輥的特殊結構方式,筒輥內粉體由初期的單顆粒破碎逐漸過渡到層壓粉碎階段,較好地防止了飛濺能的損失,其次,在粉過層中,粉體由疏鬆到密實,充分利用了顆粒的非光滑表面及集中效使其低於輥壓機。實驗證實,筒輥的粉效果大大優于立和輥壓機。
  6. The grinding pressure depends on the material and on the wishes of the customer, by increasing of the grinding size the pressure must be increased

    根據石材的材質,或客戶的實際需要,在目數增加的情況下,壓須相地增大。
  7. There exist large stress, intensive scratch, damage and pollution of ion in wafer process, so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress. reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process

    目前加工過程中存在過大,造成表面劃傷嚴重,容易產生破損,離子沾污的問題,因而必須改善切削、機理,把單一的機械作用變為均勻穩定的化學機械作用,以達到淺損傷、低的目的,有效的減少破損層和的累積,提高產品質量和加工的效率。
  8. The properties of cn thin films such as their morphology, component, crystal structure and the bonding structure and the relation between those properties and the gas - phase reaction parameters were discussed, showing that the deposition of p - c3n4 thin film is the compete result of various reaction processes in the dynamics balance conditions ; the process of cn films depo sition is diagnosed in situ through the optical emission spectra technique, the effects of experimental parameters on the concentration of the precursors and the gas - phase reactions in the plasma have been obtained ; the main reaction precursors for film deposition identified ; the relation between the characteristics of cn thin films and the reaction process in the plasma is analyzed. the cn thin films deposition under different substrate temperatures in high pressure pe - pld shows that the si atom of the substrate has participated the cn films growth process, based on this the growth mode of cn thin films on the si substrate is proposed. the further experiment of cn thin films deposition on si substrate scratched by diamond as well as covered with fe catalyzer has been attempted, which indicates that changing the dynamics conditions of the surface reaction can alter the growth characteristic of the cn thin films and can enhance obviously the films growth rate

    採用pld技術進行了碳氮化合物薄膜沉積,得到了含氮量為21at的cn薄膜;究了襯底溫度和反氣體壓強對薄膜結構特性的影響,給出了cn薄膜中n含量較小、 sp ~ 3鍵合結構成分較少和薄膜中僅含有局域cn晶體的原因;引入脈沖輝光放電等離子體增強pld的氣相反,給出了提高薄膜晶態sp ~ 3鍵合結構成分和薄膜的含n量可行性途徑;用pe - cvd技術以ch _ 4 + n _ 2為反氣體並引入輔助氣體h _ 2 ,得到了含n量為56at的晶態cn薄膜;探討了cn薄膜形貌、成分、晶體結構、價鍵狀態等特性及其與氣體壓強和放電電流的關系,證明了- c _ 3n _ 4薄膜沉積為滿足動學平衡條件的各種反過程的競爭結果;採用光學發射譜技術對cn薄膜生長過程進行了實時診斷,得到了實驗參量對等離子體中活性粒子相對濃度和氣相反過程的影響規律,給出了cn薄膜沉積的主要反前驅物,揭示了cn薄膜特性和等離子體內反過程之間的聯系;採用高氣壓pe - pld技術究了不同襯底溫度條件下cn化合物薄膜的結構特性,揭示了si原子對薄膜生長過程的影響,給出了si基表面碳氮薄膜的生長模式;在金剛石和催化劑fe處理的si襯底上進行cn薄膜沉積,證明了通過控制材料表面動學條件可以改變碳氮薄膜結構特性,並可顯著提高晶態碳氮材料的生長速率。
  9. The turbulent characteristics of high - velocity sediment - laden and aerated flow are more other than the clear water flow of single - phase and current of low speed. in a special circulating system with high velocity flow, some flow parameters such as boundary shear stress and pulsation pressure are measured. an investigation is made on the turbulent characteristics of the three - phase flow of water, air and sand

    本文針對高速含沙摻氣水流的運動規律有別于低速水流及清水單相流,在自己製的高速渾水循環系統中,通過對高速含沙摻氣水流壁面剪切和脈動壓強等參數的量測,分析了水沙氣三相流的紊動特性,探索了泥沙對固壁的蝕機理及減蝕措施,其主要內容包括以下幾個方面: 1
  10. By comparing between the rectangular groove and curved groove, we find that two high stress area of rectangular groove o - ring occurs during the sealing period, and the wearing on the both inside and outside diameter surfaces ; the high stress area only happens at the part area of cone shaft, and the distribution of stress is more even than the former, and the wearing is on the inside diameter surface, the improvement of its distortions makes the service life of sealing lengthen

    通過矩形槽和弧形槽的對比究發現,矩形槽o形圈在密封過程中出現兩個高區,損發生在內徑、外徑兩個表面_匕,弧形槽o形圈的高區僅出現在牙爪軸鄰近的局部區域內,分佈較前者更為均勻,損進發生在內徑表面,其受變形狀況的改善將使密封壽命進一步提高。
  11. Research on the regularity of the stress and deformation of the barrel

    機筒體的及變形規律的
  12. In this paper, the microstructure changes of polypropylene induced by a complex combination of shearing, compression, stretching and friction actions during single pan - milling or co - milling with iron, uhmwpe and waste tire rubber chips ( wtr ) were studied and the stress induced effects were revealed. the structure and morphological development of iron particulates and wtr during pan - milling and co - milling with polypropylene were also characterized. the properties of pp / fe, pp / wtr and pp / wtr / fe composites prepared through pan - milling techniques were investigated

    本文利用盤型化學反器對被碾材料施加強大的剪切、環向、擠壓、拉伸和摩擦作用,究聚丙烯碾和共碾粉碎過程微觀形態結構和性能的變化,以及聚合物在碾過程中呈現的化學現象,並將其用拓展至金屬、橡膠等體系,究碾粉碎在聚丙烯鐵超微粉體的制備、高交聯密度彈性材料廢舊輪胎橡膠( wtr )的超微粉碎,以及pp fe , pp wtr材料的性能與碾作用的關系。
  13. The strong shear cut and grinding force of hlgb horizontal stirring grinding machine is used to the surface of the moderate supersonic carbon and the fusion particles of the cao & sio2 in this paper. the result of xps indicated that the si - c bond is detected on the surface of the particles. the high melting point superfine sic and caco3 are produced on the surface of cao & sio2, and composite particles are formed

    本論文利用hlgb臥式雙向旋轉攪拌球設備,通過正反轉攪拌齒及珠工作時產生的強烈的剪切、機械持續作用於cao sio _ 2熔融顆粒及中超碳黑顆粒表面, xps檢測表明,顆粒表面有si - c及ca - co鍵生成,根據機械化學理論是由於機械的作用,誘發利用熱能難以進行的機械化學反,在cao sio _ 2熔融顆粒表面生成了sic及caco _ 3新物質,構成包覆型復合粒子。
  14. The important application of diamond film is using the windows materials coat. because the glass is easy to be stain, it is very disadvantage to grow high quality diamond film. influence the diamond film application, and like commonly, rubbing the quartz glass can not improve the nucleus density, so it is very hard to grow high quality diamond film, and the quartz glass contain too much oxygen, it is very disadvantage to diamond growth

    金剛石薄膜的一個重要的用就是作為窗口材料塗層,但是由於玻璃易於被污染,對于生長高質量的金剛石薄膜是不利的,影響了其用,而且由於一般的襯底方法對于石英玻璃的成核方法影響不大,更難以生長出高質量的金剛石薄膜,而且由於玻璃中含有較多量的氧元素,對于金剛石薄膜的生長是不利的,因此對于金剛石薄膜在一些領域中限制了其用潛
  15. Then, this paper presents a program, which is used to analyze the construction control of modong hongshuihe arch bridge. the calculated values coincide with the measured data and closely agree with the results obtained by other references. it was thus confirmed that the stress balance d method is effective and reliable in practice

    同時依據平衡法的思想,編制了用於懸臂拼裝拱橋施工控制的程序,採用該程序對廣西來賓東紅水河大橋進行了施工控制分析計算,經與監測數據及課題組究成果相比較,結果表明,平衡法是合理與有效的。
  16. In order to prolong the natural life of fracturing pump valve, this article do much basic research work on fracturing pump value. firstly, kinetic characteristics of fracturing pump valve are stated particularly and analysed. through stimulated experiment based on practical working conditions, the wearing disciplinarian and forms of impact particle wear about fracturing pump valve are researched by comparing it with pure impact wear and abrasive wear. furthermore, the wear mechanism of impact particle wear and particle erosion are analysed. in the end, by using the fenite element analyzing tool ansys, the distributing law of stress and strain of fracturing pump valve at the state of closing and during the process of impact are analysed carefully

    詳細闡述和分析了它的運動特性;根據其實際工況,通過模擬試驗,究了壓裂泵閥沖擊損的損規律和損形式,並且將其與純沖擊損、滑動損進行了對比;分析了壓裂泵閥的沖擊損、沖蝕損等損機理;藉助ansys有限元分析工具,對泵閥關閉狀態下和沖擊過程中的變分佈規律進行了詳細分析。
  17. In addition, the electrical and thermal conductive pp / graphite composites prepared by s3c technology keep pretty good mechanical properties. this research develops the intercalation technique for nanocomposites, as well as pan - milling mechanochemistry, the electrical and thermal conductive theories of polymer based composites. the main outcomes are listed as follows : 1

    究結果表明,盤碾剪切場實現石墨的層間剝離及與pp的納米復合是分階段完成的,是碾過程產生的摩擦、擠壓、拉伸和剪切及物料螺旋運動過程綜合作用的結果。
  18. Abstract : in this paper, a residual stress on cemented carbide inserts caused b y grinding of diamond and electrical grinding of diamond, and its effect on cemented carbide strength are studied

    文摘:究了在金剛石刃和電金剛石刃時硬質合金刀片上引起的殘余,及其對硬質合金強度的影響。
  19. In accordance with the characteristics of repeated impact load, and from the aspects of stress wave transmission, repeated impact wear, hardening and softening of repeated impact and plastic deformation of repeated impact, an experimental study on partial mechanics behaviors of samples bearing laser melted clad coating under repeated impact load was carried out

    摘要根據多次沖擊載荷的特性,從波傳播、多沖損、多沖硬化與軟化和多沖塑性變形方面,對帶有激光熔覆層試樣在多沖沖擊載荷下的部分學行為進行了試驗究。
  20. We effectively solve the stress of wafer process and prove the function of the new slicing slurry and lapping slurry in wafer process. research fruit is applied to manufacture

    在實驗部分中我們有效地解決了矽片加工的問題,驗證了新型切削液和液在矽片加工過程中的明顯作用,並使究成果投入生產轉化為產品。
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