粘合焊接 的英文怎麼說

中文拼音 [niángěhànjiē]
粘合焊接 英文
weldbonding
  • 粘 : 粘動詞（粘附） glue; stick; paste; adhere to; bond
  • 合 : 合量詞（容量單位） ge, a unit of dry measure for grain （=1 decilitre）
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 接 : Ⅰ動詞1 （靠近;接觸） come into contact with; come close to 2 （連接; 使連接） connect; join; put ...
  • 焊接 : weld; welding; soldering; seal; sealing; sealing-in; shutting together
  1. After blanting resin abrasive cloth into small blocks, glue them into a disc, it can be equipped on electronic grinder or wind - driven tools so as to buffing and dry milling functions of inner holds or elbow pipes of metals work pieces

    該產品選用樹脂砂布沖成小塊粘合而成，可裝在電磨機、風動工具上，用於復雜金屬件內孔及彎接處、焊疤的打磨、拋光。
  2. Usually, glass insulated terminals are either soldered or cemented into the throughhole in the case.

    通常是把玻璃絕緣接線端焊接或者是粘合在殼體上的通孔內。
  3. Specification for welding primers and weld - through sealants, adhesives and waxes for resistance welding of sheet steel

    板材鋼電阻焊用焊接底劑焊透密封劑粘合劑和蠟規范
  4. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  5. Shear properties in the plane of the panel ( interlaminar shear ) duplicate the kind of shear stress encountered in such glued structural assemblies as structural sandwiches and adjacent to gluelines between flanges and webs in box - beams and i - beams and gusset plates in trusses

    面板平面的剪切特性（層間剪切） ，與夾層結構這類粘合組件，以及箱形梁、工字梁凸緣與腹板間的焊接層和桁架加固板附近位置所受的剪切應力類型相同。
  6. It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials

    研究表明， 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果； ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散，並由此在二者接頭處生成了cu - ti金屬間化合物的中間相； tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果，另外，由於熱膨脹系數的差異，擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
  7. Tabular layouts of article characteristics for filler metals for welding, brazing and soldering, fluxes and adhesives

    第57部分:焊接銅焊和釬焊填充金屬焊劑和粘合劑用
  8. Specifications for particular types of winding wires - solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

    特種繞組線規范. 130級帶粘合層的可焊接聚氨酯漆包圓銅線
  9. Specifications for particular types of winding wires ; part 2 : solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

    特種繞組線規范.第2部分:帶粘合層的可焊接的聚氨基甲酸乙酯漆包圓銅繞組線， 130級
  10. Specifications for particular types of winding wires - part 2 : solderable polyurethane enamelled round copper wire, class 130, with a bonding layer ; amendment 2

    特種繞組線規范.第2部分:帶粘合層的可焊接的聚氨基甲酸乙酯漆包圓銅繞組線， 130級.修改件2
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