絡銅劑 的英文怎麼說
中文拼音 [làotóngjì]
絡銅劑
英文
cutrine-
Meanwhile, fundamental principles about electroless tin plating by reducing agent and disproportionation reaction were explained. function of every component in the bath was explained that complexing agent can effectively change the potential of copper and tin, and accelerate the beginning of replacement reaction favorably ; reducing agent can increase the rate of chemical reaction and has the effect of promoting reaction dynamics too ; antioxidant can effectively prevent sn2 + in the bath from being oxidated ; additive agent a can improve the stability of the bath ; additive agent b has such effects as refining and brightening for the tin deposits, and it enlarges the range of brightening section ; additive agent c used as leveling agent can not only make the depostis level off, but also improve the dispersive ability of the bath ; surface - active agent can solve bubble problem which gathered on the surface of the deposits, and improve the surface quality of the deposits and the bath stability
闡述了鍍液中各組分的作用：絡合劑能有效地改變銅、錫的電位，促使初期的置換反應順利進行；還原劑能加快化學反應速度，對反應動力學有積極的促進作用；抗氧化劑能有效地防止鍍液中sn ~ （ 2 + ）的氧化；添加劑a能提高鍍液的穩定性，添加劑b對鍍層能有細化和光亮作用，擴大了鍍層光亮區的范圍；添加劑c作為平滑劑，不僅能增強鍍層表面的平整性，而且能提高鍍液的分散能力；表面活性劑較好地解決了化學鍍過程中汽泡在鍍件表面聚集的問題，提高了鍍層的表面質量和鍍液的穩定性。Study on the adsorptive - voltammetric behavior of the complex of copper and cps at paste carbon electrode
銅鐵試劑絡合物在碳糊電極上的吸附伏安行為In this work, the copper binding capacity of several complexing agents of known stability constants was determined.
在這一工作中，測定了幾種已知穩定常數的絡合劑對銅的束縛能力。Effects of complex agent on the nanocrystalline copper powders prepared by reduction in acqueous solution
絡合劑對液相還原法制備納米銅粉的作用When the bath load was increased, the plating rate was shortened. the effects of bath composition and plating conditions on the composition were also investigated. the x - ray analysis showed that edta and the stabilization agent can effectively increase the content of the copper oxidation in the composite powders
粉體x ray分析的結果表明，絡合劑對防止鍍液中的氫氧化銅的產生起來關鍵作用，而氫氧化鋼是產生氧化亞銅的直接原因，因而選用edta作為絡合劑，以及合適的量，可以減少二射線中的氧化亞銅的饅頭峰。On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained
本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。Through determination of the infinite relative volatility for ethane / ethylene by means of gas stripping method, the ability of the cuprous halide amine to separate ethane / ethylene is evaluated and the factors influencing the stability of the cuprous halide amine such as the basicity of ligand, diluters, ratios are studied
摘要通過測定乙烯乙烷在含氮基團絡合亞銅體系中的無限稀釋相對揮發度，研究了基團堿度、配比數及稀釋劑對吸收劑選擇能力和穩定性的影響。分享友人