線焊晶元 的英文怎麼說
中文拼音 [xiànhànjīngyuán]
線焊晶元
英文
wire bonded chip-
During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc
在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。The main content is design of digital man - machine interface system, a speed regulating system of good stabilization and dynamic performance ; software for appraising the performance of wire feeder. the first, a digital man - machine interface system using at89s8252 singlechip is designed. the system uses sd7218a keyboard / display chip with serial bus interface
首先，人機交互系統選用at89s8252為核心控制晶元，選用具有串列總線介面的sd7218a鍵盤/顯示晶元完成了數字化人機交互系統軟、硬體設計;採用rs - 485總線實現主控系統和人機交互系統的數據交互;系統採用數字編碼器和鍵盤配合的方式實現焊接參數的選擇和設定，同時還具有最優參數存儲、調用等功能。Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。Wire bonded chip
線焊晶元分享友人