聚亞苯醚 的英文怎麼說
中文拼音 [jùyǎběnmí]
聚亞苯醚
英文
polyphenylene oxide-
In this paper, two kinds of polyazomethine / nylon - 6 ( pam / pa - 6 ) composites with different chemical structures were prepared by means of in - situ polymerization. pam1 and pam2 were prepared from the reaction of terephthalaldehyde with l, 6 - hexanediamine ( paml ), and terephthalaldehyde with 4, 4 ' - diamiediphenyl ( pam2 ). during the preparation, pam chain ends played a retard role in the polymerization of s - caprolactam obviously
本文通過原位聚合法制備了兩種不同化學結構的聚甲亞胺尼龍6 （ pam pa6 ）分子復合材料， pam1為對苯二甲醛與1 ， 6 -己二胺反應制備的聚甲亞胺， pam2為對苯二甲醛與4 ， 4 』 -二氨基二苯醚合成的聚甲亞胺。An excellent adhesive was prepared from bismaleimide ( bmi ), epoxy resin ( e - 51 and tde - 85 ), 4, 4 ' - diaminodiphenyl sulfone ( dds ) in this thesis. the influence of liquid rubber and polymer ether imide ( pei ) on the properties ( especially high - temperature strength and the peeling strength ) were discussed, their different toughening characteristics and mechanisms were discussed. last, the process and effection of heat - resisted structural adhesive were studied by adhesive experiment of synchronizer in automobile. the results of investigation made clear : the adhesive, has good properties, especially heat - resisted properity
根據材料分子設計的原理，研究了二苯甲烷雙馬來酰亞胺（ bmi ） 4 ， 4 』 ?二胺基二苯基碸（ dds ） e ? 51 tde ? 85組成的環氧膠粘劑體系，研究該體系在作為高溫結構膠粘劑使用時的粘接性能；然後研究了用無規羧基液體丁腈橡膠（ ctbn ? x ）和聚醚酰亞胺（ pei ）分別來增韌該體系的增韌效果；最後通過碳纖維耐磨材料與同步器圓錐環的粘接實驗，研究了耐高溫結構膠粘劑的粘接工藝和使用效果。The article was related pi 、 psf 、 pps 、 peek and pes etc, particular kind engineering plastics develop - ping actuality and the marketplace progress
摘要敘述了聚酰亞胺、聚碸、聚苯硫醚、聚醚醚酮和聚醚碸等特種工程塑料的發展現狀和市特種工程塑料的發展現狀和市場進展。Synthesis, characterization and property of poly aryl ether amides from 2 - 4 - aminophenyl - 4 - 3 - methyl - 4 - aminophenoxy - 2, 3 - phthala zinone
二甲基二氮雜萘酮聯苯結構聚醚酰亞胺的合成與性能Fixed capacitors for use in electronic equipment - part 20 : sectional specification : fixed metallized polyphenylene sulfide film dielectric chip d. c. capacitors
電子設備用固定電容器.第20部分:分規范:金屬化聚亞苯基硫醚膜介質片狀直流固定電容器Fixed capacitors for use in electronic equipment - part 20 : blank detail specification : fixed metallized polyphenylene sulfide film dielectric chip d. c. capacitors assessment level ez
電子設備用固定電容器.第20部分:空白詳細規范:金屬化聚亞苯基硫醚膜介質片狀直流固定電容器.評定等級ez分享友人