覆銅壓層板 的英文怎麼說

中文拼音 [fùtóngyācéngbǎn]
覆銅壓層板 英文
laminate epoxyglasss
  • 覆 : 動詞1. [書面語] （蓋住） cover 2. [書面語] （底朝上翻過來; 歪倒） overturn; upset 3. 同 「復」 （Ⅱ1. 2. ）
  • 銅 : 名詞（金屬元素） copper （cu）
  • 壓 : 壓構詞成分。
  • 層 : i 量詞1 （用於重疊、積累的東西 如樓層、階層、地層） storey; tier; stratum 2 （用於可以分項分步的...
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  1. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  2. Single sided - fpc this product is pressed with one layer of flexible copper - clad panel and one layer of flexible solder coating

    柔性單面線路板是由一層柔性覆銅板和一層柔性阻焊覆蓋膜壓合而成。
  3. Polyimide woven glass fabric copper - clad laminated sheet of defined flammability for printed circuits

    印製電路用限定燃燒性的覆銅箔聚酰亞胺玻璃布層壓板
  4. Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

    限定燃燒性的薄覆銅箔環氧玻璃布層壓板
  5. Thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    多層印製電路用限定燃燒性的薄覆銅箔聚酰亞胺玻璃布層壓板
  6. Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3

    印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3
  7. Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5

    印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5
  8. Test methods for copper - clad laminated sheets for printed circuits

    印製電路用覆銅箔層壓板試驗方法
  9. General rules for copper - clad laminated sheets for printed circuits

    印製電路用覆銅箔層壓板通用規則
  10. Specification for flame resistant aluminum base copper - clad laminated sheets

    阻燃型鋁基覆銅箔層壓板規范
  11. Metal core copper - clad laminate

    金屬芯覆銅箔層壓板
  12. Specifications - specification for phenolic cellulose paper copper - clad laminated sheet, economic quality - specification no 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    規范.經濟型酚醛纖維素紙覆銅箔層壓板規范.第2號規范:經濟型酚醛纖維素紙覆銅箔層壓板規范
  13. Metal base copper - clad laminate

    金屬基覆銅層壓板
  14. , specifications - phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    規范.限定燃燒特性的酚醛多孔覆銅層壓板
  15. Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13

    印製電路板用覆箔板.第13部分:硅酮玻璃布覆銅層壓板si - gc - cu - 13
  16. Base materials for printed circuits. part 2 : specifications. specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  17. Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  18. Base materials for printed circuits. part 2 : specifications. specification no. 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板
  19. Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade

    印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板
  20. Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality ; amendment 2

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板.修改件2
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