設通氣孔 的英文怎麼說
中文拼音 [shètōngqìkǒng]
設通氣孔
英文
spile-
Conscious that the human organism, normally capable of sustaining an atmospheric pressure of 19 tons, when elevated to a considerable altitude in the terrestrial atmosphere suffered with arithmetical progression of intensity, according as the line of demarcation between troposphere and stratosphere was approximated, from nasal hemorrhage, impeded respiration and vertigo, when proposing this problem for solution he had conjectured as a working hypothesis which could not be proved impossible that a more adaptable and differently anatomically constructed race of beings might subsist otherwise under martian, mercurial, veneral, jovian, saturnian, neptunian or uranian sufficient and equivalent conditions, though an apogean humanity of beings created in varying forms with finite differences resulting similar to the whole and to one another would probably there as here remain inalterably and inalienably attached to vanities, to vanities of vanities and all that is vanity
人體組織通常能夠抗得住十九噸的氣壓169 ，可是一旦在地球的大氣層里上升到相當的高度，越是接近對流層與平流層的境界線，鼻孔出血吸呼困難以及眩暈，隨著算術級數就越發嚴重起來。他曉得這一點，尋求解答時就設想出這樣一個難以證明是不可能的行之有效的假定：倘若換個更富於適應性，解剖學上的構造也有所不同的種族，說不定就能在火星水星金星木星土星海王星或天王星那充足而相同的條件下生存下來。然而那個遠地點170的人類種族，盡管在構造方面與地球上的人類有著一定限度的不同之處，整個來說彼此卻有著相似的種種形態。In order to effectively determine the position and distribution of porosities in laser welding sampes with complex structure, a preliminary research was proceeded on the distribtion features of porosities and a formula which can calculate the buried depth of porosities was deduced based on the line profile distribution curve of the flaw position
為了確定復雜結構激光焊件焊縫中氣孔缺陷的位置和分佈，對氣孔缺陷的分佈特徵進行了研究，推導出氣孔缺陷埋藏深度的計算公式，設計了峰值異常缺陷和斜凹型異常缺陷投影距離自動提取演算法，確定了缺陷在鈦合金激光焊件中的分佈特徵，並通過模擬試件的破壞性試驗對該公式進行了驗證。Thaw settlement cause negative friction. this paper base on the thought of " initiative cooling ", aim at three problems existing in common concrete pile used in frozen soil, a new type of pile is proposed to overcome the disadvantages of the classical pile used in frozen soil. pile body within active layer is fluted and refilled with porous materials such as gravels and ballasts, convection will be occur and then thermal exchange inside porous material in winter while only heat conduction exists in summer, as a result the soil around flutings will be cooled, so the top line of permafrost will be drive up
本文基於「主動冷卻」地基的思想，以及針對凍土地區普通混凝土樁存在的三大問題，提出了一種新型樁的設計思路，運用數值模擬試驗手段對其冷卻機理與加固機理進行了系統研究，即在凍融活動層的深度范圍內，在混凝土樁身的表面刻槽，修築完時槽內填充碎石、塊石等多孔介質，通過外界大氣溫度的自然波動下多孔介質在冬季時存在的對流換熱機制，而在夏季只存在熱傳導，來達到主動冷卻樁周凍土和抬升凍土上限的目的。This thesis work has researched the fabrication technics of photonic crystal defect waveguide with air - bridge structure and collecting waveguide ; suggested using uv - lithography and wet etching to fabricate traditional waveguide, after that, using eb - lithography and dry etching to fabricate photonic crystal holes, so can reduce the fabrication cost by a big range ; designed the moulding board, which can fabricate the air - bridge structure and is convenient for recognizing position in eb - lithography ; the structure consisted of traditional waveguides and etching grooves are fabricated on soi successfully, then an successful eb - lithography is realized on the structure, the defect waveguide collected with the traditional waveguide quite well ; used the etching grooves to do the sacrificial layer etching experiment, which grounded etching sacrificial layer by photonic crystal holes in next step
提出採用紫外光刻工藝製作傳統波導結構之後，通過電子束曝光和干法刻蝕製作光子晶體小孔的工藝方案，大幅度減低了製作成本；設計出可形成空氣橋結構、並且適用於電子束曝光位置識別的光刻模板，在soi材料上成功製作出帶有空氣橋刻蝕預留槽以及接續光波導的結構，在該結構上成功實現了光子晶體帶隙波導的電子束曝光，帶隙波導與接續光波導位置接續良好；最後利用預留槽進行了刻蝕犧牲層的實驗，為下一步利用光子晶體小孔刻蝕犧牲層形成空氣橋結構打下了基礎。When in experiment, the air was heated by the film heater installed on the above and below surface of channel, adopting various air velocity of flow, test import ' s and export ' s temperature, wall temperature, fluid flux and the drop of pressure, and the other parameter. adopting nu and nu0 to analyze the baffle ' s situation of heat transfer and fluid flow, which baffle was holed various diameters
實驗時，通過矩形通道上下壁面敷設的電加熱膜加熱通道空氣，改變空氣流速，測試不同工況時的進出口溫度、壁面溫度、流體流量和壓力損失等參數，並採用無量綱努謝爾特準則數nu 、 nu _ 0等分析了設置不同開孔折流板的換熱與流動情況。Rapid cooling section is at the end of the firing section, cool the tiles by means blow environment air with high pressure fan into the tunnel directly through tiny holes in series of stainless steel pipes inside the tunnel
急冷設于燒成帶未端，由高壓離心鼓風機，經環境空氣通過總管、支管、手動球閥，直接將窯外冷空氣經不銹鋼管通過細孔高速打入窯內冷卻製品。The results show that transformation of transmission mechanism and much higher birefringence can be achieved after nlc - filling. farther, we firstly demonstrate the realization of modulating pbg and modes of pbg - pcfs by changing refractive index filled of filled nlc by virtue of temperature or electric field, and finally tunable
在此研究的基礎上，首次提出並設計出通過用溫度或者電磁場來調節空氣孔中液晶的折射率來連續調節這種高雙折射光子帶隙光纖中的傳輸帶隙和傳導模式，最終實現的高雙折射可調的光子帶隙光纖。Cae on reverse circulation structure of buried pore hammer bit ofthrough model with gas - operated
貫通式氣動潛孔錘鉆頭反循環結構的計算機輔助設計In order to study the regeneration mechanism of dpf in detail, we still need a mathematical model of the channel unit, which present temperature field and the soot reaction rate of the channel. finally, it points out the influences of various factors to the regeneration process by computing the numerical solution of model under different boundary conditions and geometry parameters, such as the initial temperature, the gas flow rate, the oxygen concentration, the sediment quantity and the wall thickness of the filters, and so on. in this way, the paper provides theoretical guidance for optimization design of the dpf
首先研究了干凈壁流式過濾體的加熱特性，然後在加熱和燃燒理論的基礎上建立了微粒捕集器再生過程的數學模型，並對模型進行了數值計算，得到了捕集器內部的三維溫度場分佈以及溫度梯度分佈，結果與實驗值吻合較好，驗證了模型的正確性;為了詳細的研究微粒捕集器的再生機理，建立了孔道單元數學模型，得到了孔道內的溫度場分佈和微粒反應速率分佈;最後，通過求解模型在不同邊界條件和不同幾何參數下的數值解，分析了各種因素對再生過程的影響，如過濾體初始溫度、過濾體內氣流的流動速率、氧濃度、微粒沉積量以及過濾體壁面厚度，為微粒捕集器的優化設計提供理論指導。Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices
半導體器件.機械和氣候試驗方法.通孔安裝設備的耐釬焊溫度Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices
半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設備的耐釬焊溫度Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices iec 60749 - 15 : 2003 ; german version en 60749 - 15 : 2003
半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設分享友人