足印鑒定 的英文怎麼說
中文拼音 [zúyìnjiàndìng]
足印鑒定
英文
footprint identification- 足 : Ⅰ名詞1 （腳; 腿） foot; leg 2 （姓氏） a surname Ⅱ形容詞（充足; 足夠） sufficient; ample; enough;...
- 印 : Ⅰ名詞1 （圖章） seal; stamp; chop 2 （痕跡） print; mark 3 （姓氏） a surname Ⅱ動詞1 （留下痕跡）...
- 鑒 : Ⅰ名詞1 （鏡子 古代用銅製成） ancient bronze mirror2 （可以作為警戒或引為教訓的事） warning; objec...
- 定 : Ⅰ形容詞1 （平靜; 穩定） calm; stable 2 （已經確定的; 不改變的） fixed; settled; established Ⅱ動詞...
- 足印 : footmark; footprint; pelmatogram; podogram足印鑒定 footprint identification
- 鑒定 : 1 （評語） appraisal （of a person s strong and weak points） 2 （評定） appraise; identify; auth...
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This agreement ( the " agreement " ) describes the terms and conditions pursuant to which the customer ( as defined below ), for good and valuable consideration the receipt and sufficiency of which are acknowledged, is permitted by ups internet services, inc. and its affiliates who provide the services requested by the customer hereunder ( " ups " ) to access the ups internet shipping application to generate labels to be used solely by the customer for shipments tendered by the customer to ups for delivery and other services provided by ups available therein ( the " application " )
鑒于upsinternetservices ， inc .及其關系公司（ 「 ups 」 ）承認已收到良好且有價值之足夠承諾，由ups提供「客戶」要求服務之本協議「客戶」 （定義如下）根據這些條款和條件，可以使用「 ups網上托運應用程序」 （ upsinternetshippingapplication ） （ 「應用程序」 ）印製運單。此運單僅供「客戶」用於委託ups運送的貨件，以及其它「應用程序」中可用的由ups提供的服務。With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility
隨著微電子產品（集成電路晶元、印刷電路板等）向著高密度、細間距和低缺陷方向發展，對其檢測技術在精密、高效、通用和智能化等方面提出了更高要求。由此，本文對微電子產品視覺檢測中的關鍵技術進行研究，彌補了傳統檢測在精確快速定位、圖像全景組合和精細缺陷檢測等方面的不足，最終完成基於機器視覺的微電子產品外形尺寸和缺陷檢測的理論研究和樣機研製，並進行了大量實驗證明其正確性和可行性，力圖為我國自主創新的微電子產品視覺檢測技術提供理論和實際借鑒。
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