輝光放電氮化 的英文怎麼說

中文拼音 [huīguāngfàngdiàndànhuà]
輝光放電氮化 英文
glow discharge nitriding
  • : Ⅰ名詞(閃耀的光彩) brightness; splendour; brilliance Ⅱ動詞(照耀) shine
  • : Ⅰ名詞1 (照耀在物體上、使人能看見物體的一種物質) light; ray 2 (景物) scenery 3 (光彩; 榮譽) ...
  • : releaseset freelet go
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : 名詞[化學] nitrogen (7號元素, 符號n)
  • 放電 : [物理學] (electric) discharge; electro-discharge; discharging
  1. The properties of cn thin films such as their morphology, component, crystal structure and the bonding structure and the relation between those properties and the gas - phase reaction parameters were discussed, showing that the deposition of p - c3n4 thin film is the compete result of various reaction processes in the dynamics balance conditions ; the process of cn films depo sition is diagnosed in situ through the optical emission spectra technique, the effects of experimental parameters on the concentration of the precursors and the gas - phase reactions in the plasma have been obtained ; the main reaction precursors for film deposition identified ; the relation between the characteristics of cn thin films and the reaction process in the plasma is analyzed. the cn thin films deposition under different substrate temperatures in high pressure pe - pld shows that the si atom of the substrate has participated the cn films growth process, based on this the growth mode of cn thin films on the si substrate is proposed. the further experiment of cn thin films deposition on si substrate scratched by diamond as well as covered with fe catalyzer has been attempted, which indicates that changing the dynamics conditions of the surface reaction can alter the growth characteristic of the cn thin films and can enhance obviously the films growth rate

    採用pld技術進行了碳合物薄膜沉積,得到了含量為21at的cn薄膜;研究了襯底溫度和反應氣體壓強對薄膜結構特性的影響,給出了cn薄膜中n含量較小、 sp ~ 3鍵合結構成分較少和薄膜中僅含有局域cn晶體的原因;引入脈沖等離子體增強pld的氣相反應,給出了提高薄膜晶態sp ~ 3鍵合結構成分和薄膜的含n量可行性途徑;應用pe - cvd技術以ch _ 4 + n _ 2為反應氣體並引入輔助氣體h _ 2 ,得到了含n量為56at的晶態cn薄膜;探討了cn薄膜形貌、成分、晶體結構、價鍵狀態等特性及其與氣體壓強和流的關系,證明了- c _ 3n _ 4薄膜沉積為滿足動力學平衡條件的各種反應過程的競爭結果;採用學發射譜技術對cn薄膜生長過程進行了實時診斷,得到了實驗參量對等離子體中活性粒子相對濃度和氣相反應過程的影響規律,給出了cn薄膜沉積的主要反應前驅物,揭示了cn薄膜特性和等離子體內反應過程之間的聯系;採用高氣壓pe - pld技術研究了不同襯底溫度條件下cn合物薄膜的結構特性,揭示了si原子對薄膜生長過程的影響,給出了si基表面碳薄膜的生長模式;在金剛石研磨和催劑fe處理的si襯底上進行cn薄膜沉積,證明了通過控制材料表面動力學條件可以改變碳薄膜結構特性,並可顯著提高晶態碳材料的生長速率。
  2. Plasma nitriding is an application way to metal surface and heating treatment based on the formed plasma by glow discharge. nitriding is a way of heating treatment, namely, metal accessory is put into activate nitrogen and the gas of low light pressure is ionized into energy electrons, high energy ions and high energy neutral atoms by the action of the electric field under a definite temperature and the time of the heat preservation

    等離子滲是利用形成等離子體在金屬表面,熱處理方面的應用,滲是強金屬表面的一種熱處理方法,是將金屬零件置於活性的介質中,在一定溫度和保溫時間下,低壓氣體在場作用下使之離產生能子、高能離子和高能中性原子。
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