進給磨削 的英文怎麼說

中文拼音 [jìngěixiāo]
進給磨削 英文
plunge cut grinding
  • : 進構詞成分。
  • : 給Ⅰ動詞1 (送對方某物; 使對方得到) give; grant 2 (用在動詞后 表示交與 付出) pass; pay 3 (叫; ...
  • : 磨動詞1 (摩擦) rub; wear 2 (研磨) grind; mull; polish 3 (折磨) grind down; wear down [out]:...
  • : 削動詞1. (用刀斜著去掉物體的表層) pare [peel] with a knife 2. (乒乓球的一種打法) cut; chop
  1. Sxm11p straight line beveling machine is the latest develop new style of beveling machine from suntech. it specialty adopt beveling wheel, it can whole progress and can lifting intergrally, it compare to traditional front beam or back beam s lifting, it have more pithiness structure. more better stability, higher grinding precision s characteristic. at present this technique was apply country patent. this machine have high automatizationg, set the grinding paramenter into the interface of the human - machine, the machine can automatic to adjust, realize the glass fine grinding, polishing can be automatic processing in one time

    Sxm11p直線斜邊機是億海公司最新開發研製的新型直線斜邊機,它的特點是採用了斜邊頭,即可整體,又可整體升降的新技術,與傳統的前梁或後梁升降技術相比,具有結構更簡單,穩定性更好,精度更高的特點,目前該技術已申請國家專利,該機自動化程度高,只要在人機界面上設定有關的參數,機器便可自動行調整,實現對玻璃精拋光等的一次性自動加工。
  2. Influences of feed rate on machining precision during grinding metal ceramics blade by diamond grinding wheel

    速度對金屬陶瓷刀片精度的影響
  3. Szm8325a - szm9325 glass straight line edging machine is designed for grinding straight line flat edging of different sizes and thickness. szm9325a can process straight line and 45edge. coarse grinding, refine grinding, polishing, and angle - marking can be completed in a procession. tt s speed can be widely adjustedby its stelpless regulator. speed alteration is very mooth. in grinding operation, feeding and operation speed can be adjusted at random. front fails can be adjusted to fit caried thickness of processed glass. and its advanced structure, high precision, easy handling, and highefficiency, it is one of indispensable instruments for glass procession. szm9325p and szm9325ap adopt plc control system

    Szm8325a - szm9325型玻璃直線邊機適用於不同尺寸和厚度的平板玻璃直邊和45稜角, szm9325a可加直邊和45級邊。本產品集粗拋光倒角等工序一次加工而成,並採用無級變速調節,可調范圍大,變速平穩在過程中可任意調節料速度和量可調節前導軌變換加工玻璃的厚度。
  4. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明,增大砂輪軸向速度和減小工件轉速,採用粗粒度砂輪有利於提高矽片的材料去除率,砂輪軸向速度對材料去除率的影響最為顯著;適當增大砂輪轉速,減小砂輪軸向速度,採用細粒度砂輪可以減小表面粗糙度;在其它條件一定的情況下,砂輪速度超過一定值會導致材料去除率減小,主軸電機電流急劇增大,表面粗糙度變差;採用比# 2000粒度更細的砂輪時,材料去除率減小,矽片表面粗糙度沒有明顯改善。
  5. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉原理的矽片超精密床,通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪速度等主要因素對材料去除率、砂輪主軸電機電流以及后矽片表面粗糙度的影響關系。
  6. Improving give manner of grinding fluidin the slowly feeding grinding

    改善緩進給磨削液的供方法
  7. Creep feed grinding

    進給磨削
  8. Application of technology on augmentation of heat transfer in the grinding contact zone with radial jet impinging in creep feed grinding

    進給磨削弧區徑向射流沖擊強化換熱技術的應用
  9. Then a dynamic compensating system is designed and added into the measuring system to accomplish the compensation. furthermore, a mcu system is designed to acquire, process and display the output of the transducer ' s serving circuit, and to feed back the workpiece ' s real time dimension to the nc grinding machine

    同時,設計了一個單片機系統來對氣隙式電感傳感器及其調理電路的輸出信號行採集、處理、顯示,並反饋床,實現對加工的閉環控制,並且使整個系統具有友好的人機交互界面。
  10. Complete traverse grinding

    進給磨削
  11. By adopting the microscope and ccd photographic system the adjustment of pipette and feeding process of grinding are observed directly

    採用顯微鏡和ccd攝像系統直接觀察對針和過程。
  12. In this paper, a cutting experiment using metal cutting tools with frictional reducing groove is described. the calculation and analysis of measured cutting force data shows that this kind of cutting tools can reduce the data of cutting force. and according to these, the relations among frictional reducing groove parameters and other parameters such as feed engagement were analyzed. cutting tools with frictional reducing groove have practical value when great cutting depth and feed engagement are needed because the cutting force is reduced obviously. frictional reducing groove has wide prospect in the use of non - regrinding tools

    通過採用有減摩槽的車刀行切實驗,將測得的切力數據計算分析得出有減摩槽的刀具可降低切力的數據,並由此分析減摩槽參數與量等參數之間的關系.有減摩槽的刀具在大切深度、大量的切加工方面有明顯的降低切力的效果和實用價值,用於不重刀片刀具上具有廣闊的前景
  13. Feed and dressing movements are controled by means of two independent driving systems. size - metric grinding is adopted. feed movement can be carried out both manually and hydraulically

    機床的及修正,由二個互不干涉的傳動機構執行。系統具有定程功能,採用手動或液動二種方式。
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