邊緣晶元 的英文怎麼說

中文拼音 [biānyuánjīngyuán]
邊緣晶元 英文
edge die
  • 邊 : 邊Ⅰ名詞1 （幾何圖形上夾成角的直線或圍成多邊形的線段） side; section 2 （邊緣） edge; margin; oute...
  • 緣 : Ⅰ名詞1 （緣故） reason 2 （緣分） predestined relationship 3 （邊） edge; fringe; brink Ⅱ動詞（攀...
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 邊緣 : 1 （沿邊的部分） border; edge; fringe; margin; rim; limb; skirt; verge; brink; periphery 2 （靠近...
  1. Then a comparison is made according to their characters and the application scope of each method is determinate. from that we get the whole scheme of design for testability of dspc50, which is using boundary scan to improve the board - level testability of the chip and using full - scan in designing the nuclear circuit to reduce the difficulty of testing the chip

    在此基礎上得到dspc50的可測性設計的整體方案，即採用邊緣掃描設計提高晶元在板級的可測性，同時用全掃描思想設計晶元核心電路，以降低晶元本身測試的難度，即將晶元的全掃描設計包含入邊緣掃描系統。
  2. While the chips are attached to near center or near a edge of subatrate, the mean, deviation and maximum are at the almost same level ; when the chip is attached near a corner, the deviation and the maximum is far larger than those of the above two positions ; during thermal treatment followed, the residual stress demonstrates a regular cycle trend when the chips are attached near center or edge of the substrate and fluctuates in a wide range when the chip is attached near a corner

    當晶元粘貼在基板中心和靠近基板邊緣的位置時粘合劑固化后殘余應力的平均值、最大值和數值的分散性皆處于相接近的水平，而當粘貼在基板靠近一角的位置時應力分佈狀況則有很大不同：應力的分散性增大，應力最大值也遠大於粘貼于另外兩個位置時的值。
  3. Edge chip and indent - an edge imperfection that is greater than 0. 25 mm

    晶元邊緣和縮進-晶片中不完整的邊緣部分超過0 . 25毫米。
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