酚基板 的英文怎麼說

中文拼音 [fēnjībǎn]
酚基板 英文
phenolic resin copperclad laminate
  • 酚 : 名詞[化學] （特指苯酚） phenol
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  1. Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其它互連結構用材料.包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板
  2. Extraction of large - fragment genomic dna in order to gain dna template of pcr amplification ( long pcr amplification and salvage pcr amplification ) which was high purity and large fragment, three methods were used to extract genomic dna of bacillus subtilis, i. e. low melting - point agarose embedding method, sds - proteinase k - phenol chloroform extraction method and bacterial genomic dna extraction kit method. the genomic dna of bacillus subtilis were gained by these methods, and the operated programs of the methods were improved. the results showed that the genomic dna extracted by low melting - point agarose embedding method were obviously biggest than that of another two methods

    大片段基因組dna的提取為了獲得用於pcr擴增（長距離pcr擴增和分段pcr擴增）的高純度、大片段（至少為pcr產物長度的4倍）的dna模板，應用三種方法：低熔點瓊脂糖包埋法， sds -蛋白酶k -酚氯仿抽提法和細菌基因組dna提取試劑盒法，分別提取獲得了枯草桿菌基因組dna ，並對3種方法的操作程序進行了不同程度的改進，結果表明：低熔點瓊脂糖包埋法提取的基因組dna片段明顯大於后兩種方法，採用0 . 5瓊脂糖凝膠電泳3h ，仍然跑不出加樣孔。
  3. Based on the method of cell ( moc ), the effective elastic properties of resined fiber bundle with parallel or arbitrary orientation was studied, and a micro - mechanical model of resined plain - woven carbon fabric was established with the classical laminate theory, then, the method of calculation of the elastic moduli of resined plain - weave carbon fabric was presented, and can be extended to the whole carbon / phenolic composite

    基於元胞法（ moc ）計算了預浸樹脂的平直以及任意取向的纖維束的有效彈性常數。基於經典層板理論用替代層法建立了預浸樹脂平紋機織碳布的細觀力學模型，進而給出了預浸氨酚醛樹脂的平紋機織碳布的彈性模量的計算方法，該方法可推廣到碳酚醛復合材料。
  4. Base materials for printed circuits. part 2 : specifications. specification number 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印刷電路用基材.第2部分:規范. 2號規范:經濟質量的酚醛纖維素紙包銅層壓板
  5. Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3

    印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3
  6. Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5

    印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5
  7. Base materials for printed circuits. part 2 : specifications. specification number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板
  8. Base materials for printed circuits - part 2 : specification - specifications number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板
  9. . 5 base materials for printed circuits - part 2 : specifications ; specification no. 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality ; amendment 5

    印製電路用基材.第2部分:規范.第14號規范:規定易燃性和經濟質量的酚醛纖維素紙銅覆層壓板
  10. Base materials for printed circuits. part 2 : specifications. specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  11. Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  12. Base materials for printed circuits. part 2 : specifications. specification no. 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板
  13. Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality ; amendment 2

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板.修改件2
  14. Cotton cloth based

    棉布基材酚醛基層板
  15. Cotton base cloth

    棉布基材酚醛基層板
  16. Copper - clad laminates for printed wiring boards - paper base, phenolic resin

    印製電路板包銅層壓板.紙基酚醛樹脂
  17. Materials for printed boards and other interconnecting structures - part 2 - 1 : reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

    印製板和其它互連結構用材料.第2 - 1部分:包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟疊層板
  18. Materials for printed boards and other interconnecting structures - part 2 - 1 : reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其他互連結構用材料.第2 - 1部分:包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板
  19. Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - non - halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其他互連結構用材料.包被和非包被增強基材.銅包被的經濟級非鹵化酚醛纖維素紙增強層壓板
  20. Materials for printed boards and other interconnecting structures - part 2 - 23 : reinforced base materials, clad and unclad - non - halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

    印製板和其他互連結構用材料.第2 - 23部分:包被和非包被增強基材.銅包被的經濟級非鹵化酚醛纖維素紙增強層壓板
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