金焊料合金 的英文怎麼說

中文拼音 [jīnhànliàojīn]
金焊料合金 英文
gold soldering alloys
  • : Ⅰ名詞1 (金屬) metals 2 (錢) money 3 (古時金屬制的打擊樂器) ancient metal percussion instrum...
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : 名詞1 (材料; 原料) material; stuff 2 (喂牲口用的穀物) feed; fodder 3 (料器) glassware 4 (...
  • : 合量詞(容量單位) ge, a unit of dry measure for grain (=1 decilitre)
  • 金焊料 : [冶金學] gold solder
  1. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛接頭中屬間化物在時效中的演變
  2. Experimental investigation on ni - cr brazed monolayer diamond abrasives

    單層剛石磨的試驗研究
  3. The strength and wear resistance of diamond drill bits for petroleum exploitation will be increased considerably when cast tungsten carbide is applied and adheres to the substrate firmly with cast tungsten carbide of 80 - 200mesh as the skelton and copper alloy as the soldering material in a process of non - pressure immersion

    石油鉆探行業用的剛石鉆頭,用粒度為80 ? 200目的鑄造碳化鎢粉作骨架,採用無壓浸漬工藝,以銅作釬,將鑄造碳化鎢與基體牢固結,強度、耐磨性大大提高。
  4. Soft solder alloys. chemical compositions and forms

    .化學成分和表格
  5. It is drawn seamless tubing, which can be welded to join the tubes of the bike frame together. the tubes are cold worked to provide additional strength to the material, and through this process is tailored to provide the correct shape tubing for the frame design

    由ti 3al2 . 5v製成的鈦車架採用無縫管材的接技術,其管材經冷軋成形后經過嚴格地挑選檢驗,以保證其材的強度和質量。
  6. Bpec handrail, a new type compositive handrailing which hollow ball, metal stucture, its stanchion is set up with several metal hollow balls and pipc through welding, the composition at worksite is very simple and easy without any welding, economic & fine outlook, stable, convenient for installing and separaing

    博佩克欄桿是一種新型的空心球屬結構組式欄桿,立柱由若干個屬空心球和同一材屬管通過接成為柱子;扶手,橫桿與立桿採用現場組裝,可不用接,具有經濟美觀,安裝及拆卸簡便,牢固耐用的優點。
  7. Rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended

    額定內部壓力是所連接的管道額定內部壓力。如果可以採用,則推薦使用銅
  8. H rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended

    額定內部壓力是所連接的管道額定內部壓力。如果可以採用,則推薦使用銅
  9. Purpose : mainly to be material for making lithium metal and used in making for dehumidizer of air - condition, bleaching powder, disinfestant, electrolyte of lithium - battery, synthetic fiber, welding agent for alloys and flux

    用途:主要用於制取屬鋰的原及空調除濕劑、漂白粉、殺蟲劑、鋰電池電解液、成纖維、接劑或助熔劑。
  10. Argon welder, oxygen welder, co2 welder, electric welder, allumen composite sole welder and ultrasonic plastic welder total : 14 sets braze, iron welding stainless steel welding, plastic welding, welding of composite sole of stainless steel aluminum, direct welding, roll welding, spot welding

    氬弧機氧氣機二氧化碳機電機鋁機超聲波塑機共計14臺銅不銹鋼不銹鋼鋁復底
  11. Requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子釬用電子級釬及助熔和非助熔固體釬的要求
  12. Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用的連接材.電子接設備用的電子分級和助熔劑和非助熔劑的要求
  13. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材.第1 - 3部分:電子接用電子級釬及有劑和無劑的固體的要求
  14. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明:相關的影響因素主要包括的組成、純度和化學均勻性;母材的成分、性質和表面的潔凈度;液態的表面張力;釬溫度、氣氛、助劑的活性;液態表面膜的組成、結構和性能等。
  15. Calcium carbide is an important primary material for organic synthesis industry. reacted to water, it can produce ethyne for the manufacture of synthetic fiber, synthetic resin, plastic, synthetic rubber, fertilizer, agricultural pesticide, growth hormone for plants, dyes, and solvent etc

    電石為基本有機成工業的重要起始原,電石與水反應生成乙炔,可用於成纖維成樹脂塑成橡膠化肥農藥植物生長激素染溶劑等的製造,也可用於屬切割與接照明等,竭誠歡迎各界選購。
  16. This article introduced the development and ti - based brazing material used for titanium alloys, and analyzed the relationship between metallurgical structure and mechanical property of welding joint, mechanical behavior under high temperature 、 corrosion resisting property and fatigue capability of the joint were also represented

    本文介紹了鈦用的鈦基釬的發展現狀,重點評價了鈦基釬后組織與力學性能的關系,以及鈦基釬的高溫力學性能、耐蝕性以及疲勞性能等。
  17. The thermoelectric power outputs of laminated structures with various thermoelectric materials have been mathematically optimized and experimentally measured. some conclusions have been drawn in the present work as follows : 1. the performance, microstructures and the failure mechanism of laminated bi2te3 / fesi2 prepared by dip coating using tin - based alloys as bridge materials have been investigated

    本項研究獲得了以下主要成果: 1 、以sn基接材,採用熱浸技術制備了bi _ 2te _ 3 / fesi _ 2疊層熱電材,並系統地分析研究了疊層熱電材的性能,接過渡層的微觀組織結構以及過渡層在熱加工及模擬服役過程中的破壞機制。
  18. In the interface an interdiffused layer with multphases would be formed during the process of welding or operation at elevated temperature. because of so much difference between the interdiffused layer and the original interface layer, it would influence the welding strength severely

    接過程中以及經過較高使用溫度的長時間使用后,鈮同不銹鋼界面會產生材組分元素的互擴散,形成互擴散層,互擴散層的性能與原始界面的性能有較大差別,影響接強度。
  19. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    、峰值溫度、液相線以上時間和接環境五個關鍵因素中,前四項對點可靠性比較重要,接環境對點可靠性的影響不很顯著。
  20. The fine powders of the solder alloy are one of the key materials in the smt, the requirement as following : the particle diameter is in 5 u m ~ 74 u m, the shape is spherical and the distribution of the particle size is uniform

    表面組裝技術( smt )已廣泛應用於電子工業中,而微粉是該技術的關鍵材之一,通常要求:粉末粒徑5 74 m ,形狀為球形,且粒徑分佈均勻。
分享友人