釬焊性能 的英文怎麼說

中文拼音 [hànhànxìngnéng]
釬焊性能 英文
solderability
  • : 名詞(釬子) drill rod [steel]; borer
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : Ⅰ名詞1 (性格) nature; character; disposition 2 (性能; 性質) property; quality 3 (性別) sex ...
  • : 能名詞(姓氏) a surname
  1. The research results show that, from the viewpoint of second phase morphologies, there exist quite differences between the grain - type materials ( such as wc / bcu brazing deposit material, wrs1000 and 1zt tungsten carbide strengthening overlaying material, as well as the wear - resistant material of polymer adhesive coating etc. ), and the aggregation - type as well as dispersion - type ones ( such as zg35simn, wrd - 1 and khc - k2 depositing material ) in the wear - resistance and sand slurry abrasion mechanism. the sand slurry abrasion mechanisms are brought forward, of new wear - resistant materials with the features of grain - type second phase morphologies

    研究發現,與聚合型、彌散型第二相的材料(如zg35simn 、 wrd ? 1和khc ? k2熔敷材料等)相比,顆粒型第二相的材料(如wc bcu熔敷耐磨材料、 wrs1000型耐磨材料、 1zt碳化鎢顆粒增強熔敷材料及ktc ? 1耐磨膠粘塗層材料等)在耐磨和磨損機理等方面均有不同,總結提出了以「顆粒型第二相」為特徵的耐磨新材料泥沙磨損機理。
  2. The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability

    摘要通過分析料在過程中的行為,提出了電子料的工藝主要包括熔化固化溫度、抗氧化、潤濕和漫流
  3. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明:相關的影響因素主要包括合金的組成、純度和化學均勻;母材的成分、質和表面的潔凈度;液態料的表面張力;溫度、氣氛、助劑的活;液態料表面膜的組成、結構和等。
  4. This article introduced the development and ti - based brazing material used for titanium alloys, and analyzed the relationship between metallurgical structure and mechanical property of welding joint, mechanical behavior under high temperature 、 corrosion resisting property and fatigue capability of the joint were also represented

    本文介紹了鈦合金用的鈦基料的發展現狀,重點評價了鈦基后組織與力學的關系,以及鈦基料的高溫力學、耐蝕以及疲勞等。
  5. However the machining of light - composite armor material is still a dead - hand problem to be resolved, and so, this dissertation analyses and researches the mechanical - physics performance, the tissue - structure characteristics and the machining mechanism of light - composite - armor material ( fiber - reinforced polymer - based composite and defense - bullet ceramics ) ; researches the machining technology of light - composite - armor material, developing the special cutters and special clamps. researches the machining technology of light - composite - armor after molding, mainly resolving the drilling a hole and cut a straight - line of defense - bullet ceramics / fiber - reinforced polymer - based composite. using the machining tools, which mainly include multiple - tools machining fiber - reinforced polymer - based composite holes and diamond saw - blade, diamond hole - drills machining defense - bullet ceramics and so on, researched in this dissertation, the machining - experiment of composite, defense - bullet ceramics and ceramics / composite was carried through, and good machining result was gained

    然而,輕質復合裝甲材料的加工仍是一個亟待解決的問題,為此本課題分析研究了輕質復合裝甲材料的物理機械、組織結構特點和加工機理,即:維增強聚合物基復合材料和工程陶瓷;研製了輕質復合裝甲材料加工所用的專用工裝,主要包括專用刀具和專用夾具;研究了輕質復合裝甲成型后的加工技術,主要解決了工程陶瓷復合材料板的鉆孔和直邊切割加工;利用所研究的加工纖維增強聚合物基復合材料臺階孔用的復合刀具、切割直邊用的金剛石切割鋸片、加工工程陶瓷用的金剛石套料鉆、切割工程陶瓷復合材料板用的金剛石切割鋸片等加工刀具對纖維增強聚合物基復合材料和工程陶瓷,以及工程陶瓷復合材料板進行了加工實驗,並取得了良好的實驗效果。
  6. Because the property of niobium alloy is far from that of stainless steel, some special welding techniques have been applied, such as explosive welding, vacuum braze welding, electric resistance welding, vacuum electron beam self - material brazing and so on

    因為二者的差別較大,所以通常採用一些特殊的方法進行接,如爆炸、真空、電阻和真空電子束自等。
  7. Semiconductor devices - mechanical and climatic test methods - part 20 : resistance of plastic - encapsulated smds to the combined effect of moisture and soldering heat

    半導體裝置.機械和氣候試驗方法.第20部分:塑料密封的smds抗濕氣和熱綜合影響的
  8. Connectors for electronic equipment - tests and measurements - part 12 - 6 : soldering tests - test 12f : sealing against flux and cleaning solvents in machine soldering

    電子設備連接器.試驗和測量.第12 - 6部分:試驗.試驗12f :機器時連接件密封耐劑和清洗劑
  9. Elements of electrical and optical connection - test methods - soft solderability

    電氣和光學連接元件.試驗方法.可軟釬焊性能
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