鉛鍍層的英文怎麼說

The weight of coating and current density has the direct ratio relation

電鍍層的量隨著電流密度的增大而增大。

For electrodeposition by dc methods, the metals deposite uninterrupted and the particles were also embeded uninterrupted into the coatings ; for electrodeposition by pc method, the particles with biggish volume were desorbed from the coatings and returned to the electrolyte again owing to the presence of pulse interval ; for electrodeposition by prc method, the particles carried positive charges are much more easy to desorb from the coatings owing to the effecf of reverse pulse current combined with pulse interval, in addition, the reverse pulse current also could dissovle the metals, further accelerates the desorption of particles, thus the particles size embeded in the coatings by prc method is the least

直流電沉積時，基質金屬的沉積連續進行，粒子在電極表面不間斷嵌入鍍層;單脈沖電沉積由於脈沖間歇的存在使得具有較大體積的粒子會脫附，重新回到溶液中;採用周期換向脈沖時，反向脈沖電流使表面荷正電的較大的粒子更易從電極表面脫附，同時，反向脈沖電流對基質金屬的溶解作用，也會促進粒子的脫附，因此鍍層中復合粒子尺寸最小。隨著鍍層中粒子復合量的增加，三種鍍層的晶粒都明顯細化，說明al _ 2o _ 3的存在阻止了晶粒的長大，提高了電沉積過程中晶核的形成速率。

The effects of different current density on the alloying element content were discussed. based on the results, the optimal process condition was confirmed : pb ~ ( 2 + ) 80 - 90 g / l sn ~ ( 2 + ) 7 - 15 g / l ch _ 4so _ 3 ( dissociative ) 130 - 150 g / l composite additive 12 ml / l current density 2 - 6 a / dm ~ 2

採用hull槽實驗方法確定了甲磺酸體系電沉積pb - sn合金鍍層的電流密度范圍，並探討了不同沉積電流密度下pb 、 sn合金含量的變化規律。

Standard specification for electrodeposited coatings of lead and lead - tin alloys on steel and ferrous alloys

鋼及鐵合金表面鉛和鉛錫合金的電解沉積鍍層標準規范

It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead - free soldering

包括背景，焊料，表面鍍層，元器件，基板，組裝工藝，返工和無鉛焊接的可靠性。