銅膜 的英文怎麼說
中文拼音 [tóngmó]
銅膜
英文
copper film-
Light gas gun was used to create shock pressure. staged samples, cuneiform window with aluminium coat on the reflecting surface and visar ( velocity interferometer system for any reflector ) were employed in the experiments. polymethyl methacrylate and ofhc copper were assembled as the impactor to impact staged samples
採用氣炮加載,利用臺階樣品、雙點式visar ( velocityinterferometersystemforanyreflector )和鍍膜楔形窗口技術,以有機玻璃和無氧銅組合為飛片,碰撞無氧銅臺階樣品。The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the damascene process is the main stress. the thermal stress distribution in copper interconnects has been simulated by the finite element analysis software with the different trench structures
對測量結果的分析得出金屬薄膜的淀積是造成銅互連線中應力的主要原因,熱應力在銅互連線應力中占較大比例,熱處理后銅互連線中應力減小。Film forming mechanism of imidazole on copper surface
咪唑化合物在銅表面的成膜過程與機理Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer
待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接,得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當,而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。In this paper, pan based metal gradient composites films ( pmgcf ) were prepared by electrochemical reduction. the effect of polymer matrix on pmgcf and preparation and its forming mechanism of pmgcf were invested, they are as follows : lacrylonitrile - methyl - methacrylate copolymer, acryonitrile - itaconic acid copolymer, acrylonitrile - methyl methacry late - sodium allyl sulfonate terpolymer have been synthesized seperately in order to analyze the effects of the mma monomer unites and the hydrophilic unites of acryonitrile terpolymer on the process of copper deposition in polyacrylonitrile - based metal gradient composite film ( pmgcf ) as well as the flexibility of the film
其內容如下: 1通過合成的丙烯腈?甲基丙烯酸甲酯二元共聚物( p ( an - mma ) ) ,丙烯腈?亞甲基丁二酸二元共聚物( p ( an - ita ) ) ,丙烯腈-甲基丙烯酸甲酯?丙烯磺酸鈉三元共聚物( p ( an - mma - as ) )分別作為基體制備了聚合物基金屬梯度復合膜材料( pmgcf ) ,以分析加入的mma基團和親水性基團對pmgcf沉積層中金屬銅的梯度分佈形態和膜的柔韌性的影響。Studies on the stress of copper interconnects include the stress measurement by xrd, computer simulation and observation the local stress distribution with snam
利用薄膜應力測試分佈儀和xrd測量硅基銅膜及銅互連線薄膜宏觀應力。The design of manganin film and copper film were etched by the first time
首次採用以半導體光刻的方法來刻蝕錳銅敏感薄膜和銅電極薄膜的圖形。Conducting wire core composed by thin brass wires or tinning brass wires, it is very soft. surface of part leads wraped mylar isolation layer, in case affecting their bending performance
導電線芯採用較細的銅絲或鍍錫銅絲束絞組成,導線極其柔軟,部分產品的導線表面包有聚脂薄膜隔離層,以免絕緣橡皮嵌入其邊縫中而影響彎曲性能。Bloom in babylinen and pelisse, bigheaded, with a caul of dark hair, fixes big eyes on her fluid slip and counts its bronze buckles with a chubby finger, his moist tongue tolling and lisping
裹著襁褓和斗篷,腦袋挺大,烏黑的頭發恰似胎膜。一雙大眼睛盯著她那晃來晃去的襯裙,用胖嘟嘟的指頭數著上面的青銅扣子。1 ) the synthesis and structural characterization of 5, 10, 15 - tris ( penta - fluorophenyl ) corrole and its corresponding [ 5, 10, 15 - tris ( pentafluorophenyl ) corrolato ] manganese ( iii ) ; 2 ) the synthesis and structural characterization of series of porphyrin and metalloporphyrins as follows : chloro [ 5, 10, 15, 20 - tetra ( p - methyl - phenyl ) - porphinato ] manganese ( iii ), chloro [ 5, 10, 15, 20 - tetra ( p - methyl - phenyl ) - porphinato ] iron ( iii ), [ 5, 10, 15, 20 - tetra ( p - methyl - phenyl ) - porphinato ] copper ( ) and - oxo - bis [ 5, 10, 15, 20 - tetra ( p - methyl - phenyl ) - porphinatomanganese ( iii ) ]. 2. in the third charpter, a highly selected silver electrode based on 5, 10, 15 - tris ( pentafluorophenyl ) corrole has been prepared, and its response was compared with that of metallo corrole counterpart and 5, 10, 15, 20 - tetra ( phenyl ) porphyrin
3 、制備了以-氧-雙( 5 , 10 , 15 , 20 -四(對甲基苯基) )錳卟啉載體的鉬酸根選擇性電極,並與5 , 10 , 15 , 20 -四(對甲基苯基)鐵卟啉、 5 , 10 , 15 , 20 -四(對甲基苯基)錳卟啉、 5 , 10 , 15 , 20 -四(對甲基苯基)銅卟啉電極的響應性能進行了比較,對電極的膜組份進行了優化,並分別考查了電極的選擇性、 ph值影響、穩定性和壽命等,並將該電極應用於腐蝕抑制劑中鉬酸根的測定。Studies of aggregation of copper phthalocyanine nanoparticles
酞菁銅薄膜的真空熱蒸發制備及其性能The great amount of stabilizing agent led to the non - uniform of the plating layer. the addition of the high polymer could decrease the size of silver particles and help to increase the dispersibility of powders
採用高銅鍍液,鍍覆表面金屬顆粒降至2 3urn ,形成一層緻密連續的銅銀共沉積的金屬膜層。Upon comprehensively reviews of the predecessors ? results, using the experience of other countries for reference, and implementing thin film technology, the author have developed the microsensor in this thesis by sputtering metal material on a silex substrate
本文在綜合評述前人工作成果的基礎上,借鑒國外的製作和研究經驗,利用薄膜技術,在石英基片上濺射銅、鎳和二氧化硅薄膜,形成薄膜熱流計。The elementary study of preparing cu particles on thiol self - assembled monolayers
硫醇自組裝膜上制備銅粒子的初步研究Effect of heat treatment on color sol - gel coating glass
熱處理對銅系鍍膜玻璃色彩的影響Test method for continuity of anodic oxide coatings on aluminium and aluminium alloys - copper sulphate test
鋁和鋁合金的陽極氧化膜連續性的試驗方法.硫酸銅試驗Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem, the measurement of texture by xrd and ebsd, the evaluation of barriers by xps and aes
銅互連線的微觀結構的研究:通過afm 、 sem 、 tem等的分析方法對銅膜及銅互連線薄膜的晶粒尺寸進行了評價。Xrd analysis results reveal the electroplated copper film has strong cu { 111 } texture and cu { 111 } texture weakens after annealed. the cu { 111 } texture of copper film in trenches is obviously weaker than that of the blanket copper film
在沉積態銅膜存在較強的銅{ 111 }織構,熱處理以後銅膜的織構減弱,銅互連線溝槽中銅{ 111 }織構要弱於銅膜的銅{ 111 }織構。The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure
結果顯示熱處理后銅膜晶粒長大,但銅互連線薄膜由於溝槽結構對晶粒的長大有阻礙作用。利用xrd和ebsd測試方法對銅膜及銅互連線薄膜的織構進行評價。Brass wires are winded between two metallic electrodes located in a vacuum chamber, where 2 m thickness films are deposited onto the substrate glass after explosive wires discharging
實驗結果表明:玻璃基體表面被鍍上一層緻密的銅膜,具有與金屬類似的導電性。在掃描電鏡下觀察,膜厚約為2 m 。分享友人