鍍層 的英文怎麼說
中文拼音 [dùcéng]
鍍層
英文
cladding material; film鍍層鋼板 [冶金學] clad steel sheet; coated steel; 鍍層金屬 [化學] coated metal-
Technical requirements and inspection methods for pb - sn - cu alloy antifriction coating
Pb ? sn ? cu三元合金減摩鍍層技術要求和檢驗方法Effect of heat treatment on induced apatite deposition and bonding strength of the alkali treated titanium oxide layer for carbon carbon composite
碳復合材料上堿液處理氧化鈦鍍層誘導沉積磷灰石和結合強度的影響2 water faucets shall be chrome - plated type with ball valve
水龍頭外表為鉻鍍層。Review and prospect of solderable tin - based binary alloy plating
可焊性錫基二元合金鍍層研究的現狀與展望When ph value < 0. 5, faster deposition rate, faster growth rate of crystallizing nucleus, which causes bigger crystalline granularity and bad surface quality of the deposits such as crassitude or darkling
Ph 0 . 5時，沉積速度過快，晶核成長速度快，晶粒粒度較大，鍍層表面粗糙、發黑，表面質量差。The weight of coating and current density has the direct ratio relation
電鍍層的量隨著電流密度的增大而增大。Electroplated coatings - chemicals for cyanic and or alkaline electroplating baths - requirements and testing
電解鍍層.氰化槽和或鹼化槽用化學品.要求和檢驗For electrodeposition by dc methods, the metals deposite uninterrupted and the particles were also embeded uninterrupted into the coatings ; for electrodeposition by pc method, the particles with biggish volume were desorbed from the coatings and returned to the electrolyte again owing to the presence of pulse interval ; for electrodeposition by prc method, the particles carried positive charges are much more easy to desorb from the coatings owing to the effecf of reverse pulse current combined with pulse interval, in addition, the reverse pulse current also could dissovle the metals, further accelerates the desorption of particles, thus the particles size embeded in the coatings by prc method is the least
直流電沉積時，基質金屬的沉積連續進行，粒子在電極表面不間斷嵌入鍍層;單脈沖電沉積由於脈沖間歇的存在使得具有較大體積的粒子會脫附，重新回到溶液中;採用周期換向脈沖時，反向脈沖電流使表面荷正電的較大的粒子更易從電極表面脫附，同時，反向脈沖電流對基質金屬的溶解作用，也會促進粒子的脫附，因此鍍層中復合粒子尺寸最小。隨著鍍層中粒子復合量的增加，三種鍍層的晶粒都明顯細化，說明al _ 2o _ 3的存在阻止了晶粒的長大，提高了電沉積過程中晶核的形成速率。The effects of different current density on the alloying element content were discussed. based on the results, the optimal process condition was confirmed : pb ~ ( 2 + ) 80 - 90 g / l sn ~ ( 2 + ) 7 - 15 g / l ch _ 4so _ 3 ( dissociative ) 130 - 150 g / l composite additive 12 ml / l current density 2 - 6 a / dm ~ 2
採用hull槽實驗方法確定了甲磺酸體系電沉積pb - sn合金鍍層的電流密度范圍，並探討了不同沉積電流密度下pb 、 sn合金含量的變化規律。Since the dry plating does not require the reduction using electricity, the dry plating has many advantages in that it permits to plate the surface of non - conductive polymer materials, and further does not use the electrolyte solution so that wastewater is not produced and the plating thickness can be readily controlled
由於不要求用電還原，干鍍有許多優點，因為它允許對非導電性聚合物進行上鍍，其次不使用電鍍液，結果不產生廢水，而且鍍層厚度易於控制。In order to solve the above - mentioned problems, the present invention provides a method for plating a polymer material with a metal film, which can form the film on the surface of polymer materials, which are difficult to plate by the prior wet plating method, at a relatively low cost in comparison to the dry plating method and exhibits a uniform thickness and a good adhesion of the metal film and further, shows a good reproducibility
為了解決上述問題，本發明提供了一種給聚合物材料上鍍金屬膜的方法，用該方法可以在聚合物材料表面形成膜層，這是原來的工藝難于做到的，而且比干鍍成本低，鍍層厚度均勻，金屬膜的粘附性好，最後，還顯示出好的重現性。Cobalt - tungsten electrodeposit as copper barrier was presented in the paper
本文提出以電鍍鈷鎢二元合金鍍層作為防銅滲層。Specification for electroplated coatings of tin lead alloys
錫鉛合金電鍍層規范Research status of tib2 coating by electroplating in molten salt
2鍍層的研究現狀A new matrix in electroplated diamond tools
採用鎳鈷錳鍍層製造玉雕用金剛石工具Electroplated coatings - designation in technical documents
電鍍層.技術文件的標識Hot - galvanized steel wire. zinc coating specification
熱鍍鋅鋼絲.鋅鍍層的規范Test methods for bare wires - solderability test of coating - solder globule method
裸電線試驗方法鍍層可焊性試驗焊球法Test method for sheet resistance of gold plating layer
金電鍍層薄層電阻測試方法Horology. gold - plated watch - cases. test methods for coatings
鐘表業.鍍層的試驗方法分享友人