鍍通孔 的英文怎麼說

中文拼音 [dùtōngkǒng]
鍍通孔 英文
plated through hole （pth）
  • 鍍 : 動詞（用電解或其他化學方法使一種金屬附著到別的金屬或物體表面上） plate
  • 通 : 通量詞（用於動作）
  1. When only allows the total internal reflection beams focus on the small aperture, which is formed at the center of metal film coated on the bottom of solid immersion lens, the optical fields propagated from the aperture of different dimension is first simulated

    根據衍射超分辨原理首次模擬出了底面鍍有金屬膜、中心留有通光微孔的固體浸沒透鏡的出射光場分佈。
  2. Metallic coatings - porosity tests - porosity in gold or palladium coatings by sulfurous acid sulfur dioxide vapour

    金屬鍍層.孔隙試驗.通過亞硫酸二氧化硫蒸氣的金和鈀鍍層的孔隙度
  3. System of quality assessment - sectional specification - rigid double - sided printed boards with plated - through holes

    質量評估體系.分規范.有鍍通孔的剛性雙面印製板
  4. Interstitial via hole : an embedded through - hole with connection of two or more conductor layers in a multilayer pcb

    埋孔：多層pcb內的連接兩個或以上導體層的鍍通孔。
  5. Reliability of plated through hole ( pth ) has close relationship with technology parameters during manufacture process

    摘要鍍通孔的可靠性與製造過程工藝參數有非常密切的關系。
  6. Is plated copper being test in the environmental test chamber ? if so, what is the test frequency

    對于鍍通孔，測試是否在（可設定條件的）環境艙內進行？如果是，測試頻率是多少？
  7. System of quality assessment - capability detail specification - rigid double - sided printed boards with plated - through holes

    質量評估體系.性能詳細規范.帶鍍通孔的剛性雙面印製板
  8. Capability detail specification : single and double sided printed boards with plated - through holes ; german version en 123200 - 800 : 1992

    性能詳細規范.帶電鍍通孔的單面和雙面印製電路板
  9. Harmonized system of quality assessment for electronic components : sectional specification : single and double sided printed boards with plated through holes

    電子元器件質量評定統一體系.分規范:具有鍍通孔的單面和雙面印製電路板
  10. Current research of failure mechanism and physics model of pth in manufacture process including drilling, electroless plating and electroplate were reviewed

    從鉆孔、化學鍍銅、電鍍三個主要工藝入手，對目前製造過程鍍通孔失效的機理與物理模型的研究現狀進行總結。
  11. Accumulating model of steel balls was used to simulate the pore distribution in the coating the pore distribution in the direction of coating thickness was self - existent and could not join to intercommunicating pore

    分析結果表明有兩個主要的原因致使鍍層不會產生水溶液介質的孔隙腐蝕：一是在鍍層厚度方向上孔隙是獨立的，不會相互連接形成通孔。
  12. Tp - 96, plated through hole integrity test procedure for electrical connectors

    電連接器電鍍通孔完整性的試驗程序tp - 96
分享友人
分享到 Line

分享到臉書