鍵合度 的英文怎麼說

中文拼音 [jiàngědù]
鍵合度 英文
degree of bond
  • 鍵 : 名詞1 [機械工程] （使軸與齒輪、皮帶輪等連接並固定在一起的零件） key 2 [書面語] （插門的金屬棍子）...
  • 合 : 合量詞（容量單位） ge, a unit of dry measure for grain （=1 decilitre）
  • 度 : 度動詞[書面語] （推測; 估計） surmise; estimate
  1. Interfacial atoms diffusion or covalence by a circulated - argon ion bombardment process could improve the adhesion strength between the coatings and the uranium substrate

    循環氬離子轟擊鍍方法可促進使膜-基界面原子間的擴散或鍵合，有利於提高膜-基結合強度。
  2. The development of renewable amperometric is a possible way to circumvent the problem. here, antigen ( antibody ) is immobilized with graphite ( carbon ) and carrier on a transducer, the analyze is measured through on enzyme catalytic reaction after sandwich or competitive immunoreaction

    將抗原（抗體）與石墨或者碳固定在載體材料中，在一個競爭性的或者夾心式的免疫反應后，將酶標抗原（抗體）鍵合在傳感器表面，通過一個酶催化反應來確定待測抗原（抗體）的濃度。
  3. The development of renewable amperometric is a possible way to circumvent the problem. here, antigen ( antibody ) is immobilized with graphite ( carbon ) and carrier on a transducer, the analyze is measured through on enzyme catalytic reaction after sandwitch or competitive immunoreaction. the surface of immuno - sensor can be renewed by used in a new immunoassay

    將抗原（抗體）與石墨或者碳固定在載體材料中，在一個競爭性的或者夾心式的免疫反應后，將酶標抗原（抗體）鍵合在傳感器表面，通過一個酶催化反應來確定待測抗原（抗體）的濃度。
  4. After analysising the theory and characteristics of the corba and mobile agent technologies, the paper brings forward firstly a kind of mobile agent architecture - coma, and gives the solution to coma ' s asynchronous transfer, concurrent control, naming, location and intelligence mechanism in detail. furthermore, aiming at making up the flaws of the application servers based on corba in distributed group environment and solving the problem of object ' s remotion on the corba server, the paper proposes a kind of corba architecture based on mobile agent - maorb, discusses naming and transparent transfer of mobile agent in a maorb system in detail, and gives a reasonable improvement method

    本文在分析了corba和移動agent這兩種分散式技術的運行原理及其特點之後，首先提出一種應用於協同環境下的移動agent體系結構coma ，並詳細給出了coma的異步遷移、並發控制、命名和尋址，智能化機制這幾個關鍵技術的解決方法。進而，為了彌補單純的利用corba技術來構建分散式集群環境中應用服務器的不足，解決corba服務端對象的可移動性問題，本文又提出了一種基於coma的corba體系結構maorb ，詳細討論了maorb系統中移動agent的命名和透明遷移以及corba和coma的結合度問題，並給出了合理的解決方案。
  5. In the dissertation, the effects of the air slide - film damping on the capacitive accelerometers having different slot structures which are completely or partly etched, and fabricated by the anodic bonding between silicon and glass and bulk silicon micromachining process are researched by changing the distance between the moving structure and substrate, the thickness of the structure, the width of the completely etched slot structure, the depth of the partly etched slot structure according to the two well known air slide - film damping models

    對于橫向運動的體微機械器件，其周圍空氣表現為滑膜阻尼。本文基於滑膜阻尼的兩個模型，通過改變振子與襯底的間距、振子的厚度、刻透的柵槽的寬度、沒有刻透的柵槽的深度等參數，研究了這些參數對硅?玻璃鍵合工藝製作的體硅微機械電容式傳感器阻尼特性的影響。
  6. A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours

    研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。
  7. The experimental method includes selecting pure complexes of histidine - containing or cysteine - containing materials, from c - and n - terminal group of these amino acids to link to a group which have color or fluorescence or ultraviolet absorption, elucidating their binding affinity, fluorescence or uv - visible spectrum properties with zinc at physiological concentration and to elucidate their structure in the solid state via infrared spectroscopy. with the help of the concerned the data, the analysis was done to prove whether it can be applied to the zinc detection, in other words, whether it can be used as a new fluorescence probe for zinc detection

    本實驗首次選用在生物體內與zn ~ （ 2 + ）鍵合能力很突出的物質? ?組氨酸和半胱氨酸，採用類似於多肽合成的方法，在其羧基或氨基分別嫁接上一個帶有標記的基團，生成穩定的共價鍵化合物；在此化合物中模擬生理濃度條件加入鋅離子，通過紅外圖譜、紫外圖譜或熒光圖譜的變化分析鋅離子對標記基團是否產生影響，再結合有關數據分析其是否適合檢測鋅離子，即是否可能作為新的鋅離子熒光探針。
  8. A study on bonding strength of hybrid integrated circuits

    功率混合集成電路鍵合強度控制研究
  9. An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders

    全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。
  10. Then the key process parameters of laser bonding, including laser power, scanning velocity, and initial temperature, are obtained with the help of scanning experiments

    運用該模型計算了不同的工藝參數條件下硅玻璃的溫度場分佈，並由此得出鍵合線寬。
  11. The three dimensional temperature distribution of laser bonding with a gaussian thermal source is modeled using the finite element method

    摘要在硅玻璃激光鍵合中，溫度場的分佈是影響晶片能否鍵合的關鍵因素。
  12. Finally, with regression analysis on the simulation results, a regression model is made and the optimal process parameters of laser bonding are found

    然後通過漏選試驗確定影響激光鍵合的主要工藝參數有激光功率、激光掃描速度及鍵合初始溫度。
  13. A faster speed of repetition than that of conventional piano actions enables for greater precision of interpretation for music repertoires

    與一般的直立式鋼琴相比，回鍵速度更迅速，合彈奏起節拍較快的曲目時更揮灑自如。
  14. We call this measure as “ global - coarse and local - precise orientation ”, with which full - automation bonding is realized. first a micro vision positioning system based on zoom microscope is established after analysis of mems parts ’ property and bonding requirement, which gets both big visual range and high resolution

    首先，本文在分析了mems器件的特點及鍵合要求后，建立了基於連續變倍顯微物鏡的顯微視覺定位系統，成功解決了大視野、高精度顯微視覺定位的關鍵技術。
  15. The fouling of monomer recovery system of qilu esbr plant was studied. it was con sidered that the fouling was principally caused b y the following four reasons, there existed the colopholic potassium containing c onjugated doublebonds in the disproportionated colopholic potassium, excessive co ntent of c16 - 18 compositions existed in the fatty acid, excessive content of com positions for which the demol condensation degree was above 5, the reaction conve rsion was higher than 72 percent. effective countermeasures were proposed

    介紹了齊魯引進乳聚丁苯橡膠裝置回收單元存在的設備堵掛問題，經分析認為歧化松香酸鉀中帶有含共軛雙鍵的松香酸鉀，脂肪酸中c16 18組分含量高， demol縮合度高於5的組分高，反應轉化率高於72 %是造成堵掛的4條主要原因，提出了對策。
  16. The main aim of system harness of man - made debris flow is to make potential debris flow not broken out and present debris flow decreased

    控制固體物質補給是關鍵，合理設計規劃棄土石渣的排放場地是重點，搞好匯水區水土保持系統工程是基礎，調整溝床比降，減少水流動能，使泥石流暴發減少到最低程度。
  17. Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design

    本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。
  18. Also the thermodynamics condition and energy flow of the parallel - flow air cooling mode that is one of the modes of battery ' s temperature management system is studied, and the bond graph model of the temperature management system is built

    研究了電池溫度管理系統的常用的平行氣流風冷方式的熱力學狀態和能量流動，並建立了鍵合圖模型。
  19. Sum - of - gradient - magnitude measure is chosen to adapt all images with different enlargement according to analysis of focusing measures ’ character. for 3d bond targets, it is explained that why focusing window should be placed accurately. efficiency of the whole system is ensured by analyzing shift of focal plane when enlargement ratio is changing

    為了保證快速採集到鍵合器件的清晰圖像，通過對調焦評價函數特徵的分析，選擇能夠適應各個放大倍數顯微圖像的梯度作為系統的自動調焦評價函數;針對三維器件說明了調焦窗口正確放置的原則和必要性;分析了變倍過程中聚焦平面位置的變化規律，提高了自動調焦的效率。
  20. When injecting samples, chromatographic column should be completely flushed and balanced with mobile phase ; if the system applicability is not up to regulation, or if filling agents are damaged, replace with new similar chromatographic column for analysis ; if operation according to procedures can not reach scheduled separation due to existence of certain difference between degree of bond of chemically bonded - phase of similar filling agents and performance, another brand of similar chromatographic column can be used for test

    3進樣前，色譜柱應用流動相充分沖洗平衡，如系統適用性並不符合規定，或填充劑已損壞，則應更換新的同類色譜柱進行分析，由於同類填充劑的化學鍵合相的鍵合度及性能等存在一定差異，往往依法操作達不到預定的分離時，可更換另一牌號的同類色譜柱進行試驗。
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