鍵合金絲 的英文怎麼說

中文拼音 [jiàngějīnsī]
鍵合金絲 英文
goldbondingwire
  • 鍵 : 名詞1 [機械工程] （使軸與齒輪、皮帶輪等連接並固定在一起的零件） key 2 [書面語] （插門的金屬棍子）...
  • 合 : 合量詞（容量單位） ge, a unit of dry measure for grain （=1 decilitre）
  • 金 : Ⅰ名詞1 （金屬） metals 2 （錢） money 3 （古時金屬制的打擊樂器） ancient metal percussion instrum...
  • 金絲 : gold wire
  1. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  2. Trough the experiment, we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )

    通過實驗，探索出了合適的貼裝方式（ 183焊膏貼裝）和管芯鍵合工藝（直徑18 m的金絲球焊） 。
  3. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  4. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
  5. The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed, and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process, separately

    本文首先對比分析了銅絲球鍵合和金絲球鍵合的全過程，採用實驗設計分別對燒球工藝參數和鍵合工藝參數進行了優化。在此優化參數下，獲得了連接良好的銅絲球鍵合點和金絲球鍵合點。
  6. A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours

    研究結果表明:金屬間化合物厚度與老化時間的關系符合拋物線法則，金屬間化合物的生長對老化溫度比老化時間更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ，老化后金屬間化合物呈層狀分佈，主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ，主要相為au4al和au5al2 ，同時在界面周邊區域生成了au2al和aual ;老化過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵合點200老化96小時出現了明顯的kirkendall空洞和裂紋，但銅絲球鍵合點200老化2900小時和250老化169小時都沒有形成空洞和裂紋。
  7. Trend of alloying investigation for gold bonding wires

    鍵合金絲的合金化研究動向
  8. Our products include, ball screw assembly, linear ball rail system, miniature ball rail system, x - y tables, ball spindles, slide spindle and slide guide

    主要產品有：滾珠絲杠副、直線滾動導軌副、微型滾珠線性滑軌、精密十字工作臺、滾動花鍵副、硬質鍍鉻導桿、直線軸承、鋁基合金滾動導軌等。
  9. Method for determining impurities in gold wire for semiconductor lead bonding by icp - aes

    鍵合金絲中雜質元素的icp - aes測定方法
  10. Gold wire for semiconductor devices lead bonding

    半導體器件鍵合金絲
分享友人
分享到 Line

分享到臉書