集成電路封裝 的英文怎麼說

中文拼音 [jíchéngdiànlùfēngzhuāng]
集成電路封裝 英文
integrated circuit package
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  2. A novel low mechanical hysteretic ceramic capacitive pressure transducer has been made, by using of ceramic sealing technology ; integrate circuit ( ic ) technology and thick film plane fixing circuit technology. this transducer is made of a deformable ceramic diaphragm and a ceramic base plate, between which has an air cavum. a coaxial gold electrode was fired onto the diaphragm and the base plate

    本文利用新型陶瓷技術、集成電路技術和厚膜平面安裝電路技術，採用零力學滯后的陶瓷和陶瓷密封材料進行設計製造了一種非充液乾式的電容式壓力傳感器，該壓力傳感器由較厚的陶瓷基體和較薄的陶瓷膜片構成，中間形成一空氣介質腔，在基座和膜片之間內置同軸的雙電極，組成兩個電容，當膜片承受壓力時發生位移，使電容量產生變化，經後置處理電路直接轉換為可輸出的直流電壓信號。
  3. The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature

    摘要簡述了集成電路陶瓷封裝內部水汽含量的不穩定性，主要是由粘接材料導電膠在高溫下分解釋放出的水汽所造成的。
  4. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  5. In the current production of integrate circuit ( ic ), we usually package the chip with chemical material to protect chips

    在當前的集成電路生產中，為了保護晶元，通常要用化學材料對晶元加以封裝。
  6. The second part introduces concepts and knowledge of the integrate circuit ( ic ) design and package. the third part introduces the realization of the routing algorithm and the

    （ 2 ）包括第二、三章，介紹了集成電路設計和封裝的概念和知識。
  7. Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages

    塑料封裝集成電路結構熱應力分佈的解析解
  8. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  9. Terminology of packages for semiconductor integrated circuits

    半導體集成電路封裝術語
  10. Coplanarity problems of ic packaging

    集成電路封裝的共面性問題
  11. Ultra - thin dia.

    集成電路封裝劃.
  12. This product design for ic assembly die attache process on die bonder machine

    本產品為ic集成電路封裝工藝晶元全自動固晶機上而專門設計。
  13. The company ' s primary business is ic component packaging and test and memory module assembly

    公司的主要業務是集成電路封裝測試和內存模塊裝配。
  14. Reinvest jingyang technology co., ltd engaging in ic package, manufacture, test, and the components producing and selling

    轉投資晶揚科技股份有限公司，從事集成電路封裝製造測試服務及其零組件加工銷售
  15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

    完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。
  16. In order to reduce the thermal strain, improve the reliability and electrical performance of the microelectronics, it is important and necessary to test the thermal deformation and the residual stress of the assemble circuit

    為降低器件封裝的熱應力，改善和提高產品的電熱性能及可靠性，對集成電路封裝的熱變形及殘余應力進行分析測試是十分重要的和必不可少的。
  17. In relation to an integrated circuit ; a term that indicates small element size and high packing density

    集成電路技術中的一種修飾術語，表示元件體積小而且封裝密度高。
  18. Electromagnetic modeling and parameter extraction play an important role in 1c design and it is a foundation of the works later

    因此，對互連和封裝結構進行電磁建模和參數提取，對于高速集成電路設計具有重要的意義，它是一系列后續工作的基礎。
  19. The developments of high - speed circuits and mmic pose the problem of analyzing the circuits characterized both in time and frequency domains. a variety of mixed time - frequency methods have been developed during the last quarter century in the research of the vlsi interconnect and package analysis and nonlinear steady - state analysis. this paper examines these methods from a unified point of view. various mixed problems are formulated as circuit equations in the mixed time - frequency domain. fundamental approaches to slove the equations are given, from which all of the published mixed methods can be naturally deduced. this facilitates the comprehension of these methods and is helpful for their applications. some new ideas are proposed based on the cross reference among these different kinds of methods

    隨著高速集成電路及mmic （微波單片集成電路）的發展，提出了對時-頻混合表示電路進行分析的任務.本文用統一的觀點考察了通常屬于高速電路互連與封裝分析、非線性電路穩態響應分析兩個不同方面的混合分析問題，指出這類問題的實質是要求解一個時-頻混合的電路方程，給出了求解這一方程的基本思路，闡明了現有的各種方法是如何從這一基本思路導出的.這可為認識這些方法的本質與聯系，促進它們的應用與發展提供參考.此文還探討了某些方法之間的相互借鑒，提出了若干新的想法
  20. With yulon ' s reputation and financial power, worldwide fab and assembly house ' s support, anachip is devoted to provide total ic solutions to serve our customers, and expect to reach a great operational result together

    藉由裕隆集團在企業界的聲望及財務奧援，與世界各地晶圓廠及封裝測試廠的配合，易亨電子將致力於提供客戶完整的集成電路方案，共同創造更亮麗的營運成果。
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